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74ACT16651DLRG4

Texas Instruments

74ACT16651DLRG4 by Texas Instruments

74ACT16651DLRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 11.9 ns and output current of 24 Amp. It features a small outline package, operates at temperatures ranging from -40 to 85 °C, and is ideal for bidirectional control applications in industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,827 parts In-Stock

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Digiode

USA . 4,859 parts In-Stock

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Andel Nordic

Denmark . 391 parts In-Stock

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$8.217

100+ parts

-

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$7.889

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$7.889

391

$8.217

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$7.889

$7.889

AZTECH Wire

Italy . 855 parts In-Stock

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$8.817

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$8.817

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Parana Technologies

USA . 1,874 parts In-Stock

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$25.017

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$2,323.209

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$22.515

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$2,323.209

$22.515

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DigiPath Technology Company

USA . 569 parts In-Stock

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$27.547

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569

$27.547

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ChromeModa Solutions

Germany . 6,673 parts In-Stock

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$28.109

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$23.049

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IDEA Electronic Components Group

UK . 2,368 parts In-Stock

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$28.109

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$26.704

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$25.298

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2,368

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$25.298

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One Stop Electronics

USA . 886 parts In-Stock

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$32.000

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Component Stockers USA

USA . 489 parts In-Stock

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$99.990

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Corphita

USA . 1,952 parts In-Stock

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Microchip USA

USA . 113 parts In-Stock

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Northwest PG Solutions

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Native Components

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Overview

Looking for a reliable and high-quality bus driver and transceiver for your electronic projects? Look no further than the Texas Instruments 74ACT16651DLRG4. With its state-of-the-art technology and industrial-grade construction, this product offers unparalleled performance and reliability. Whether you're working on data communication systems, networking devices, or industrial automation equipment, this versatile component is sure to meet your needs. Say goodbye to worries about signal integrity and compatibility – choose Texas Instruments for peace of mind and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 11.9 ns

Low propagation delay ensures fast and efficient signal processing, making this product suitable for high-speed communication.

Surface Mount: YES

The surface mount feature allows for easy installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular package shape provides compatibility with standard PCB layouts and facilitates easy integration into existing systems.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data signals, making it versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product is compatible with most electrical systems and can be easily integrated.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product is suitable for industrial environments with varying temperature conditions.

Width: 7.49 mm

The compact width of 7.49mm allows for efficient use of PCB space and enables close placement of multiple components.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making this product energy-efficient and reliable.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product has a safe operating range, protecting it from potential damage due to voltage fluctuations.

Technical Specifications

Bus Driver & Transceivers 74ACT16651DLRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

11.9 ns

Propagation Delay (tpd):

13.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

74ACT16651DLRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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