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74ACT11373DBR

Texas Instruments

74ACT11373DBR by Texas Instruments

74ACT11373DBR by Texas Instruments is an 8-bit bus driver with a propagation delay of 11.8 ns at 5V, suitable for industrial applications. It features a max operating temperature of 85°C, output polarity TRUE, and a terminal pitch of 0.65 mm. This CMOS technology device has a package style SMALL OUTLINE and is surface mountable.

Median Price

$2.230

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 72 parts In-Stock

1+ parts

-

100+ parts

$2.230

1k+ parts

$2.000

10k+ parts

$1.880

72

-

$2.230

$2.000

$1.880

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,601 parts In-Stock

1+ parts

$1.995

100+ parts

-

1k+ parts

-

10k+ parts

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2,601

$1.995

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-

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Vyrian

USA . 4,072 parts In-Stock

1+ parts

-

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4,072

-

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Component Stockers USA

USA . 16,968 parts In-Stock

1+ parts

$1.880

100+ parts

-

1k+ parts

$1.410

10k+ parts

$1.410

16,968

$1.880

-

$1.410

$1.410

Corphita

USA . 576 parts In-Stock

1+ parts

$1.890

100+ parts

-

1k+ parts

-

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576

$1.890

-

-

-

Andel Nordic

Denmark . 494 parts In-Stock

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$6.382

100+ parts

-

1k+ parts

$6.127

10k+ parts

$6.127

494

$6.382

-

$6.127

$6.127

Microchip USA

USA . 1,439 parts In-Stock

1+ parts

$11.490

100+ parts

$11.420

1k+ parts

$11.380

10k+ parts

$11.350

1,439

$11.490

$11.420

$11.380

$11.350

AZTECH Wire

Italy . 1,088 parts In-Stock

1+ parts

$17.580

100+ parts

-

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10k+ parts

-

1,088

$17.580

-

-

-

Parana Technologies

USA . 747 parts In-Stock

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$19.595

100+ parts

$1,819.705

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$17.636

10k+ parts

-

747

$19.595

$1,819.705

$17.636

-

DigiPath Technology Company

USA . 2,136 parts In-Stock

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$21.577

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2,136

$21.577

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ChromeModa Solutions

Germany . 6,848 parts In-Stock

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$22.017

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$18.054

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6,848

$22.017

$18.054

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IDEA Electronic Components Group

UK . 1,598 parts In-Stock

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$22.017

100+ parts

$20.916

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$19.815

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1,598

$22.017

$20.916

$19.815

-

Native Components

USA . 33 parts In-Stock

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$64.839

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10k+ parts

$62.245

33

$64.839

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-

$62.245

Northwest PG Solutions

USA . 1,939 parts In-Stock

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$71.322

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1,939

$71.322

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A-Z Elektronik GmbH

Germany . 6,647 parts In-Stock

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6,647

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Perfect Parts

USA . 2,130 parts In-Stock

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2,130

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Overview

Experience seamless and reliable data transmission with the 74ACT11373DBR by Texas Instruments, a top-tier manufacturer renowned for its high-quality products. As a Bus Driver & Transceiver, this component is versatile and essential for various applications. With a compact design and efficient performance, it ensures quick propagation delay and minimal power consumption. Trust in Texas Instruments for cutting-edge technology that delivers exceptional value, providing you with the competitive edge you need. Upgrade your systems with the 74ACT11373DBR and experience superior connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, this product is lightweight and durable, making it easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 11.8 ns

With a low propagation delay, this product offers fast signal transmission, ensuring efficient performance.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs, making it convenient for integration into various systems.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor for compatibility and ease of design in electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V, this product is compatible with many common power sources and ensures stable performance.

Load Capacitance (CL): 50 pF

With a specified load capacitance, this product is optimized for signal handling and can effectively drive connected components.

Power Supplies (V): 5

Having a power supply of 5V simplifies the design and operation of the product, ensuring reliable and consistent power delivery.

No. of Terminals: 24

With a sufficient number of terminals, this product offers versatile connectivity options and compatibility with various circuit configurations.

No. of Bits: 8

Featuring 8 bits, this product is suitable for handling and transmitting data in parallel, making it efficient for communication tasks.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style enables compactness and high-density mounting, ideal for space-constrained applications.

Maximum I (ol): 24 Amp

With a high output current capability, this product can drive heavy loads effectively, making it versatile for various applications.

Propagation Delay (tpd): 13 ns

The low propagation delay of 13ns ensures fast signal processing, enhancing the overall performance of the product.

Maximum Operating Temperature: 85 °C

Capable of operating at a high temperature of 85°C, this product is suitable for use in demanding environments with elevated heat levels.

Output Characteristics: 3-STATE

Featuring 3-state output characteristics, this product allows for efficient control of signals, enabling tri-state and high-impedance outputs when necessary.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is resilient to cold conditions, ensuring reliable performance in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the longevity and reliability of the product.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and connectivity options, allowing for versatile mounting configurations.

No. of Ports: 2

With 2 ports, this product can support multiple connections or channels, enabling the simultaneous transfer of data or signals.

Maximum Seated Height: 2 mm

Having a low seated height of 2mm, this product is compact and space-efficient, suitable for applications with height restrictions.

Width: 5.3 mm

With a narrow width of 5.3mm, this product can fit into tight spaces and PCB layouts, enabling efficient use of available board real estate.

Output Polarity: TRUE

The true output polarity ensures correct signal interpretation and compatibility with other components, facilitating seamless integration within a system.

Minimum Supply Voltage (Vsup): 4.5 V

With a low minimum supply voltage requirement of 4.5V, this product can operate efficiently even with limited power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during the assembly process.

Peak Reflow Temperature °C: 260

Capable of withstanding a peak reflow temperature of 260°C, this product maintains its integrity and functionality during the soldering process.

Length: 8.2 mm

With a compact length of 8.2mm, this product offers a space-saving design and easy integration into electronic assemblies.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this product is reliable and stable in harsh operating conditions, ensuring consistent performance.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliable solder connections, ensuring robustness and durability in the product.

Packing Method: TR

The TR packing method offers protection during shipping and handling, preventing damage and ensuring product integrity upon arrival.

Terminal Pitch: 0.65 mm

With a small terminal pitch of 0.65mm, this product allows for high-density mounting and precise PCB layout, optimizing space usage.

Control Type: ENABLE LOW/HIGH

Featuring enable control with both low and high options, this product offers versatile operational modes to suit different system configurations.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product can handle higher voltage inputs while maintaining reliable performance and safety.

Maximum Power Supply Current (ICC): 0.08 mA

Consuming only 0.08mA of power, this product operates efficiently and conserves energy, making it suitable for battery-powered or low-power applications.

Technical Specifications

Bus Driver & Transceivers 74ACT11373DBR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Family:

ACT

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

11.8 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.3 mm

Trade Compliance

74ACT11373DBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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