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74ACT11244NSR

Texas Instruments

74ACT11244NSR by Texas Instruments

74ACT11244NSR by Texas Instruments is a bus driver & transceiver with 2 functions, 4 bits, and 24 terminals. It operates at a nominal voltage of 5V with a propagation delay of 9.9ns. Ideal for industrial applications requiring true output polarity and low enable control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,169 parts In-Stock

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Digiode

USA . 1,924 parts In-Stock

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1,924

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Distributors (Availability)

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Native Components

USA . 96 parts In-Stock

1+ parts

$0.498

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96

$0.498

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Northwest PG Solutions

USA . 891 parts In-Stock

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$0.548

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-

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$0.483

891

$0.548

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$0.483

Andel Nordic

Denmark . 236 parts In-Stock

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$4.837

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-

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$4.644

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$4.644

236

$4.837

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$4.644

$4.644

AZTECH Wire

Italy . 573 parts In-Stock

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$7.793

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573

$7.793

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One Stop Electronics

USA . 906 parts In-Stock

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$9.000

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906

$9.000

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Parana Technologies

USA . 2,375 parts In-Stock

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$12.007

100+ parts

$1,115.031

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$10.806

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2,375

$12.007

$1,115.031

$10.806

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DigiPath Technology Company

USA . 1,807 parts In-Stock

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$13.221

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ChromeModa Solutions

Germany . 2,671 parts In-Stock

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$13.491

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$11.063

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$13.491

$11.063

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IDEA Electronic Components Group

UK . 1,890 parts In-Stock

1+ parts

$13.491

100+ parts

$12.816

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$12.142

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1,890

$13.491

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$12.142

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Corphita

USA . 1,208 parts In-Stock

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Microchip USA

USA . 392 parts In-Stock

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Overview

Enhance your electronic designs with the 74ACT11244NSR bus driver & transceiver from Texas Instruments. With a reputation for producing high-quality components, Texas Instruments delivers reliability and performance. This versatile product is perfect for applications requiring fast signal transmission and efficient data transfer. Experience the value of reduced propagation delay, low power consumption, and ease of integration. Trust Texas Instruments to provide cutting-edge solutions for your circuit design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components of the bus driver and transceivers, ensuring durability and reliability.

Propagation Delay At Nominal Supply: 9.9 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed data communication applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during the manufacturing process.

No. of Functions: 2

Having multiple functions in a single device helps streamline the design and implementation of the communication system, reducing overall complexity.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes this product compatible with a wide range of systems and power sources.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state when disabled, preventing bus contention and signal interference in multi-driver applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range (-40°C to 85°C) ensures reliable operation in harsh environmental conditions, making this product suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the bus driver and transceivers efficient and reliable in various communication systems.

Technical Specifications

Bus Driver & Transceivers 74ACT11244NSR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

ACT

JESD-30 Code:

R-PDSO-G24

Length:

15 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.9 ns

Propagation Delay (tpd):

9.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

74ACT11244NSR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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