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74AC11074NSRE4

Texas Instruments

74AC11074NSRE4 by Texas Instruments

74AC11074NSRE4 by Texas Instruments is a dual-function latch with a nominal voltage of 5V and load capacitance of 50pF. It operates at temperatures ranging from -40 to 85°C, featuring a propagation delay of 11.3ns and max frequency of 125MHz. This CMOS technology flip-flop is ideal for industrial applications requiring positive edge triggering in compact designs.

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2

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1k+

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Vyrian

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Digiode

USA . 541 parts In-Stock

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541

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Native Components

USA . 322 parts In-Stock

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$1.645

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Northwest PG Solutions

USA . 2,019 parts In-Stock

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AZTECH Wire

Italy . 468 parts In-Stock

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Parana Technologies

USA . 1,851 parts In-Stock

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ChromeModa Solutions

Germany . 2,036 parts In-Stock

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$23.392

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$19.181

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IDEA Electronic Components Group

UK . 1,965 parts In-Stock

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$21.053

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One Stop Electronics

USA . 455 parts In-Stock

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DigiPath Technology Company

USA . 252 parts In-Stock

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Corphita

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Microchip USA

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Overview

Enhance your electronic designs with the 74AC11074NSRE4 by Texas Instruments, a high-quality latches & flip-flops component that offers exceptional performance and reliability. Manufactured by a trusted industry leader, this versatile product is ideal for a wide range of applications. With its advanced technology and efficient design, customers can expect seamless operation and improved functionality in their projects. Experience the value and benefits of this innovative solution, providing you with the competitive edge you need in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as a package body material ensures durability and reliability in various environmental conditions.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on PCBs.

No. of Functions: 2

Having 2 functions in one component offers flexibility and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard electronic systems.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF allows for efficient switching and signal transmission.

Power Supplies (V): 3.3/5

Supporting multiple power supply voltages (3.3V and 5V) adds versatility to the product.

Propagation Delay (tpd): 11.3 ns

Having a low propagation delay of 11.3 ns ensures fast response times in signal processing.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product is suitable for industrial applications where higher temperatures may be encountered.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise control and synchronization of operations.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows for reliable performance even in low-temperature environments.

Maximum I (ol): 24 Amp

A high maximum output current of 24A enables the product to drive heavy loads with ease.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB.

Width: 5.3 mm

The compact width of 5.3mm contributes to the overall space-saving design of the product.

Output Polarity: COMPLEMENTARY

Having complementary output polarity simplifies signal interpretation and processing in digital circuits.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity in the product.

Technical Specifications

Latches & Flip-Flops 74AC11074NSRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G14

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

100000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay (tpd):

11.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

125 MHz

Trade Compliance

74AC11074NSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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