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74AC11074DE4

Texas Instruments

74AC11074DE4 by Texas Instruments

D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$1.637

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 209 parts In-Stock

1+ parts

-

100+ parts

$1.460

1k+ parts

$1.310

10k+ parts

$1.230

209

-

$1.460

$1.310

$1.230

DigiKey

USA . 209 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.930

10k+ parts

-

209

-

-

$1.930

-

Verical

USA . 209 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.637

10k+ parts

$1.538

209

-

-

$1.637

$1.538

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,349 parts In-Stock

1+ parts

$0.875

100+ parts

-

1k+ parts

-

10k+ parts

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4,349

$0.875

-

-

-

Vyrian

USA . 7,135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,135

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 479 parts In-Stock

1+ parts

$0.414

100+ parts

-

1k+ parts

-

10k+ parts

$0.398

479

$0.414

-

-

$0.398

Northwest PG Solutions

USA . 141 parts In-Stock

1+ parts

$0.456

100+ parts

-

1k+ parts

-

10k+ parts

$0.402

141

$0.456

-

-

$0.402

Corphita

USA . 1,895 parts In-Stock

1+ parts

$0.829

100+ parts

-

1k+ parts

-

10k+ parts

-

1,895

$0.829

-

-

-

Component Stockers USA

USA . 278 parts In-Stock

1+ parts

$0.940

100+ parts

$0.880

1k+ parts

-

10k+ parts

-

278

$0.940

$0.880

-

-

Parana Technologies

USA . 1,892 parts In-Stock

1+ parts

$19.830

100+ parts

$1,841.525

1k+ parts

$17.847

10k+ parts

-

1,892

$19.830

$1,841.525

$17.847

-

DigiPath Technology Company

USA . 2,267 parts In-Stock

1+ parts

$21.835

100+ parts

-

1k+ parts

-

10k+ parts

-

2,267

$21.835

-

-

-

ChromeModa Solutions

Germany . 5,339 parts In-Stock

1+ parts

$22.281

100+ parts

$18.270

1k+ parts

-

10k+ parts

-

5,339

$22.281

$18.270

-

-

IDEA Electronic Components Group

UK . 644 parts In-Stock

1+ parts

$22.281

100+ parts

$21.167

1k+ parts

$20.053

10k+ parts

-

644

$22.281

$21.167

$20.053

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Perfect Parts

USA . 233 parts In-Stock

1+ parts

-

100+ parts

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233

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Technical Specifications

Latches & Flip-Flops 74AC11074DE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

100000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay (tpd):

11.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

125 MHz

Trade Compliance

74AC11074DE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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