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54LS74FMQB

Texas Instruments

54LS74FMQB by Texas Instruments

54LS74FMQB by Texas Instruments is a TTL technology flip-flop with 2 functions, operating at 5V. It has a max frequency of 20MHz and can handle up to 4A of current. Ideal for military applications due to its MIL-graded temperature range from -55°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,682 parts In-Stock

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Vyrian

USA . 2,273 parts In-Stock

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Anansix

USA . 1,646 parts In-Stock

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Electronic Expediters

USA . 77 parts In-Stock

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77

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One Stop Electronics

USA . 651 parts In-Stock

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$9.000

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651

$9.000

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AZTECH Wire

Italy . 784 parts In-Stock

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$11.338

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Parana Technologies

USA . 893 parts In-Stock

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$13.027

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$13.523

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893

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$13.523

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DigiPath Technology Company

USA . 2,112 parts In-Stock

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$14.344

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$13.197

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$14.344

$13.197

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ChromeModa Solutions

Germany . 3,052 parts In-Stock

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$14.637

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$12.002

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$14.637

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IDEA Electronic Components Group

UK . 1,282 parts In-Stock

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$14.637

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$13.905

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$13.173

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1,282

$14.637

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$13.173

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Native Components

USA . 480 parts In-Stock

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$35.200

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$33.792

480

$35.200

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$33.792

Northwest PG Solutions

USA . 1,458 parts In-Stock

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$38.720

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Corphita

USA . 4,542 parts In-Stock

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Supply Digital

USA . 1,266 parts In-Stock

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Overview

Elevate your electronic designs with the Texas Instruments 54LS74FMQB Latches & Flip-Flops. Crafted with precision and expertise, this product offers unmatched quality and reliability. Ideal for military-grade applications, this versatile component boasts a unique package body material of ceramic and dual terminal positions for enhanced functionality. With a maximum operating temperature of 125°C and a trigger type of positive edge, the 54LS74FMQB ensures optimal performance even in the most demanding environments. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides durability and heat resistance, making the product suitable for harsh environments.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

No. of Functions: 2

Having 2 functions in one component increases efficiency and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

Works efficiently at a common 5V supply voltage, making it compatible with many electronic systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures up to 125°C, ensuring reliable performance in demanding conditions.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise control and synchronization of signals in the circuit.

Technology: TTL

Utilizing TTL technology ensures fast switching speeds and compatibility with other TTL components.

Technical Specifications

Latches & Flip-Flops 54LS74FMQB attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F14

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

8 mA

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Trade Compliance

54LS74FMQB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-066-1151, 5962010661151, 5962-01-192-1759, 5962011921759

NIIN

010661151, 011921759

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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