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32F8102-CV

Texas Instruments

32F8102-CV by Texas Instruments

The Texas Instruments 32F8102-CV is a small outline, shrink pitch active filter with continuous time filtering. It operates b/w 0-70°C and has a cutoff frequency range of 6-18 MHz. Ideal for commercial applications requiring lowpass Bessel transfer characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,337 parts In-Stock

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8,337

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Digiode

USA . 1,282 parts In-Stock

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1,282

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Distributors (Availability)

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One Stop Electronics

USA . 468 parts In-Stock

1+ parts

$2.690

100+ parts

-

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468

$2.690

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Parana Technologies

USA . 1,687 parts In-Stock

1+ parts

$10.405

100+ parts

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1k+ parts

$10.918

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1,687

$10.405

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$10.918

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Native Components

USA . 576 parts In-Stock

1+ parts

$10.429

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576

$10.429

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DigiPath Technology Company

USA . 1,508 parts In-Stock

1+ parts

$11.457

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1,508

$11.457

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Northwest PG Solutions

USA . 1,318 parts In-Stock

1+ parts

$11.472

100+ parts

$10.325

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1,318

$11.472

$10.325

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ChromeModa Solutions

Germany . 6,144 parts In-Stock

1+ parts

$11.691

100+ parts

$9.587

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6,144

$11.691

$9.587

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IDEA Electronic Components Group

UK . 2,369 parts In-Stock

1+ parts

$11.691

100+ parts

$11.106

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$10.522

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2,369

$11.691

$11.106

$10.522

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AZTECH Wire

Italy . 638 parts In-Stock

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$19.472

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638

$19.472

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Corphita

USA . 3,142 parts In-Stock

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Overview

Elevate your electronic designs with the 32F8102-CV by Texas Instruments, a top-of-the-line active filter that delivers unparalleled quality and performance. Manufactured by the reputable Texas Instruments, this continuous time filter offers superior precision and reliability for a wide range of applications. Whether you're working on audio systems, telecommunications equipment, or medical devices, this small outline, shrink pitch package will streamline your design process and enhance overall functionality. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations and elevates your projects to new heights. Choose the 32F8102-CV for unbeatable value, benefits, and advantages in the world of active filters.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components within the filter, ensuring a longer product lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and labor costs during assembly.

Active Filter Type: CONTINUOUS TIME FILTER

Offers continuous filtering of signals, providing high-quality and uninterrupted performance.

Nominal Supply Voltage: 5V

Compatible with standard power sources, making it easy to integrate into existing electronic systems.

Poles and Zeros: 7 AND 0

Provides precise control over the filtering characteristics, allowing for customizable signal processing.

Max Center/Cutoff Freq Rng: 18000 kHz

Offers a wide range of frequency options for filtering, catering to diverse signal processing needs.

Technical Specifications

Active Filters 32F8102-CV attributes and parameters. Explore more Active Filters devices from Texas Instruments

Electrical Characteristics

Supply Voltage Limit:

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage:

5 V

Performance Parameters

Response Type:

Filter Technology:

Maximum Frequency - Cutoff or Center:

18 MHz

Minimum Frequency - Cutoff or Center:

6 MHz

Transfer Characteristics:

Bessel

Poles and Zeros:

7 and 0

Environmental Characteristics

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temperature Grade:

Connectivity

Total Functions:

1

Total Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Physical Characteristics

Length:

0.283 in (7.2 mm)

Width:

0.209 in (5.3 mm)

Seated Height Limit:

0.079 in (2 mm)

Package Style:

Small Outline, Shrink Pitch

Form Factor:

Rectangular

Package Code:

Package Body Material:

Plastic/Epoxy

Surface Mounting:

Yes

JESD-30 Code:

R-PDSO-G20

Additional Features

Special Features:

Additional Single-Pole Single-Zero Differentiator

Qualified:

No

Trade Compliance

32F8102-CV Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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