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32F8101-CV

Texas Instruments

32F8101-CV by Texas Instruments

32F8101-CV by Texas Instruments is a small outline active filter with continuous time filtering. It operates at a supply voltage range of 4.5V to 5.5V, with a cutoff frequency range of 9kHz to 27kHz ideal for lowpass applications. This rectangular package has Gull Wing terminals and is suitable for commercial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,855 parts In-Stock

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3,855

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Vyrian

USA . 1,089 parts In-Stock

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1,089

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Distributors (Availability)

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One Stop Electronics

USA . 660 parts In-Stock

1+ parts

$4.690

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660

$4.690

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AZTECH Wire

Italy . 552 parts In-Stock

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$12.464

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552

$12.464

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Native Components

USA . 936 parts In-Stock

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$13.870

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936

$13.870

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Northwest PG Solutions

USA . 2,056 parts In-Stock

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$15.257

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$13.731

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2,056

$15.257

$13.731

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Parana Technologies

USA . 1,077 parts In-Stock

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$16.077

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$16.412

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1,077

$16.077

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$16.412

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DigiPath Technology Company

USA . 292 parts In-Stock

1+ parts

$17.703

100+ parts

$16.287

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292

$17.703

$16.287

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ChromeModa Solutions

Germany . 3,607 parts In-Stock

1+ parts

$18.064

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$14.812

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$18.064

$14.812

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IDEA Electronic Components Group

UK . 713 parts In-Stock

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$18.064

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$17.161

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$16.258

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713

$18.064

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$16.258

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Corphita

USA . 4,013 parts In-Stock

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Overview

Unlock the power of seamless signal processing with the 32F8101-CV by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality active filters that provide unparalleled performance and reliability. Ideal for a wide range of applications, this continuous time filter offers customers a valuable solution that enhances system efficiency and accuracy. Experience the benefits of advanced technology and precision engineering with the 32F8101-CV, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product durable and resistant to external elements, ensuring its longevity.

Surface Mount: YES

The surface mount design allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Active Filter Type: CONTINUOUS TIME FILTER

The continuous time filter ensures smooth and continuous filtering of signals, providing precise and reliable output.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is commonly used in electronic devices, making this active filter compatible with a wide range of applications.

Max Center/Cutoff Freq Rng: 27000 kHz

With a maximum cutoff frequency range of 27,000 kHz, this active filter is ideal for high-frequency signal filtering applications.

Technical Specifications

Active Filters 32F8101-CV attributes and parameters. Explore more Active Filters devices from Texas Instruments

Electrical Characteristics

Supply Voltage Limit:

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage:

5 V

Performance Parameters

Response Type:

Filter Technology:

Maximum Frequency - Cutoff or Center:

27 MHz

Minimum Frequency - Cutoff or Center:

9 MHz

Transfer Characteristics:

Bessel

Poles and Zeros:

7 and 0

Environmental Characteristics

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temperature Grade:

Connectivity

Total Functions:

1

Total Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Physical Characteristics

Length:

0.283 in (7.2 mm)

Width:

0.209 in (5.3 mm)

Seated Height Limit:

0.079 in (2 mm)

Package Style:

Small Outline, Shrink Pitch

Form Factor:

Rectangular

Package Code:

Package Body Material:

Plastic/Epoxy

Surface Mounting:

Yes

JESD-30 Code:

R-PDSO-G20

Additional Features

Special Features:

Additional Single-Pole Single-Zero Differentiator

Qualified:

No

Trade Compliance

32F8101-CV Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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