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32F8102-CN

Texas Instruments

32F8102-CN by Texas Instruments

32F8102-CN by Texas Instruments is a small outline active filter with continuous time filtering. It operates at a supply voltage range of 4.5V to 5.5V, offering a lowpass response type with Bessel transfer characteristics. Ideal for applications requiring precise signal processing in commercial temperature environments up to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,144 parts In-Stock

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Digiode

USA . 2,195 parts In-Stock

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2,195

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Bristol Electronics

USA . 397 parts In-Stock

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397

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Atlantic Semiconductor

USA . 397 parts In-Stock

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397

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Electronic Expediters

USA . 100 parts In-Stock

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100

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One Stop Electronics

USA . 1,255 parts In-Stock

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$3.690

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$3.690

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AZTECH Wire

Italy . 395 parts In-Stock

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$8.244

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Parana Technologies

USA . 345 parts In-Stock

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$8.711

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$9.391

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345

$8.711

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ChromeModa Solutions

Germany . 4,201 parts In-Stock

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$9.788

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$8.026

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4,201

$9.788

$8.026

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IDEA Electronic Components Group

UK . 518 parts In-Stock

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$9.788

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$9.299

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$8.809

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518

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DigiPath Technology Company

USA . 1,398 parts In-Stock

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$8.825

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Native Components

USA . 872 parts In-Stock

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Northwest PG Solutions

USA . 859 parts In-Stock

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Corphita

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RTC Component Inc.

USA . 40 parts In-Stock

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Overview

Elevate your electronic designs with the 32F8102-CN by Texas Instruments. Crafted with precision and expertise, this active filter is designed to deliver top-notch performance in a variety of applications. Whether you're looking to enhance audio systems or improve signal processing, this continuous time filter offers unparalleled value and reliability. Trust in Texas Instruments' reputation for quality and innovation, and experience the benefits of using the 32F8102-CN in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the filter components, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Active Filter Type: CONTINUOUS TIME FILTER

Offers stable and precise filtering for continuous signal processing.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power sources, making it easy to integrate into a variety of systems.

Max Center/Cutoff Freq Rng: 18000 kHz

Provides a wide frequency range for versatile filtering capabilities.

Technical Specifications

Active Filters 32F8102-CN attributes and parameters. Explore more Active Filters devices from Texas Instruments

Electrical Characteristics

Supply Voltage Limit:

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage:

5 V

Performance Parameters

Response Type:

Filter Technology:

Maximum Frequency - Cutoff or Center:

18 MHz

Minimum Frequency - Cutoff or Center:

5.5 MHz

Transfer Characteristics:

Bessel

Poles and Zeros:

7 and 0

Environmental Characteristics

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Connectivity

Total Functions:

1

Total Terminals:

16

Terminal Finish:

Nickel Gold Palladium

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Physical Characteristics

Length:

0.39 in (9.906 mm)

Width:

0.155 in (3.94 mm)

Seated Height Limit:

0.07 in (1.778 mm)

Package Style:

Small Outline

Form Factor:

Rectangular

Package Code:

SOP

Package Body Material:

Plastic/Epoxy

Surface Mounting:

Yes

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Additional Features

Special Features:

Additional Single-Pole Single-Zero Differentiator

Qualified:

No

Trade Compliance

32F8102-CN Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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