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1P2G125QYEPR

Texas Instruments

1P2G125QYEPR by Texas Instruments

1P2G125QYEPR by Texas Instruments is a Bus Driver & Transceiver with 6.1ns Propagation Delay, 3.3V Nominal Voltage, and 24A Max I (ol). Ideal for automotive applications due to its CMOS technology and -40 to 125°C operating temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,793 parts In-Stock

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Digiode

USA . 4,295 parts In-Stock

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4,295

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Distributors (Availability)

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One Stop Electronics

USA . 1,423 parts In-Stock

1+ parts

$4.000

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$4.000

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Andel Nordic

Denmark . 140 parts In-Stock

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$7.512

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$7.211

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$7.211

140

$7.512

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$7.211

$7.211

Parana Technologies

USA . 185 parts In-Stock

1+ parts

$10.365

100+ parts

$962.542

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$9.328

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185

$10.365

$962.542

$9.328

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DigiPath Technology Company

USA . 1,368 parts In-Stock

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$11.413

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$10.500

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1,368

$11.413

$10.500

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IDEA Electronic Components Group

UK . 1,934 parts In-Stock

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$11.646

100+ parts

$11.064

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$10.481

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$11.646

$11.064

$10.481

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ChromeModa Solutions

Germany . 1,597 parts In-Stock

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$11.646

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$9.550

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$11.646

$9.550

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AZTECH Wire

Italy . 271 parts In-Stock

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$14.361

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$14.361

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Native Components

USA . 416 parts In-Stock

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$17.568

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$17.568

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Northwest PG Solutions

USA . 310 parts In-Stock

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$19.324

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$17.392

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310

$19.324

$17.392

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Component Stockers USA

USA . 762 parts In-Stock

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$99.990

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Corphita

USA . 2,773 parts In-Stock

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Robosynatics

Brazil . 1,000 parts In-Stock

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Lucentia Tech

USA . 1,000 parts In-Stock

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$29.448

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$27.269

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$27.269

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$29.448

$27.269

$27.269

Microchip USA

USA . 463 parts In-Stock

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463

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Overview

Experience the superior quality and reliability of Texas Instruments with the 1P2G125QYEPR Bus Driver & Transceiver. Perfect for automotive applications, this product offers a fast propagation delay of 6.1 ns and a maximum supply voltage of 5.5 V, ensuring efficient performance in demanding environments. With its innovative technology and compact design, this device provides customers with a valuable solution that delivers exceptional results. Trust Texas Instruments for top-of-the-line products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to external elements, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 6.1 ns

Low propagation delay ensures fast signal transmission, making this product suitable for applications that require quick data transfer.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common supply voltage of 3.3V makes this product compatible with a wide range of electronic systems and devices.

Maximum I (ol): 24 Amp

High output current capability of 24A enables this product to drive heavy loads, making it suitable for demanding applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range of up to 125°C ensures reliable performance even in high-temperature environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers 1P2G125QYEPR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B8

Length:

1.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.1 ns

Propagation Delay (tpd):

6.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

1P2G125QYEPR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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