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1P1G126QDRYRQ1

Texas Instruments

1P1G126QDRYRQ1 by Texas Instruments

1P1G126QDRYRQ1 by Texas Instruments is a 6-terminal bus driver with 32A output, 9ns propagation delay, and 3-STATE output. Ideal for automotive applications, it operates b/w -40 to 125°C with a supply voltage range of 1.65V to 5.5V.

Median Price

$0.340

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 289,749 parts In-Stock

1+ parts

$0.258

100+ parts

$0.176

1k+ parts

$0.090

10k+ parts

-

289,749

$0.258

$0.176

$0.090

-

Mouser Electronics

USA . 5,342 parts In-Stock

1+ parts

$0.340

100+ parts

$0.179

1k+ parts

$0.150

10k+ parts

$0.140

5,342

$0.340

$0.179

$0.150

$0.140

DigiKey

USA . 1,176 parts In-Stock

1+ parts

$0.340

100+ parts

$0.179

1k+ parts

$0.150

10k+ parts

$0.135

1,176

$0.340

$0.179

$0.150

$0.135

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,350 parts In-Stock

1+ parts

$0.245

100+ parts

-

1k+ parts

-

10k+ parts

-

3,350

$0.245

-

-

-

Vyrian

USA . 1,732 parts In-Stock

1+ parts

$0.258

100+ parts

-

1k+ parts

-

10k+ parts

-

1,732

$0.258

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 97,998 parts In-Stock

1+ parts

$0.219

100+ parts

-

1k+ parts

-

10k+ parts

-

97,998

$0.219

-

-

-

Corphita

USA . 1,532 parts In-Stock

1+ parts

$0.232

100+ parts

-

1k+ parts

-

10k+ parts

-

1,532

$0.232

-

-

-

Component Stockers USA

USA . 2,095 parts In-Stock

1+ parts

$0.390

100+ parts

$0.230

1k+ parts

$0.140

10k+ parts

-

2,095

$0.390

$0.230

$0.140

-

Andel Nordic

Denmark . 162 parts In-Stock

1+ parts

$8.191

100+ parts

-

1k+ parts

$7.863

10k+ parts

$7.863

162

$8.191

-

$7.863

$7.863

Native Components

USA . 525 parts In-Stock

1+ parts

$10.073

100+ parts

-

1k+ parts

-

10k+ parts

-

525

$10.073

-

-

-

Northwest PG Solutions

USA . 371 parts In-Stock

1+ parts

$11.080

100+ parts

$9.972

1k+ parts

-

10k+ parts

-

371

$11.080

$9.972

-

-

Parana Technologies

USA . 601 parts In-Stock

1+ parts

$24.430

100+ parts

-

1k+ parts

$25.099

10k+ parts

-

601

$24.430

-

$25.099

-

DigiPath Technology Company

USA . 1,621 parts In-Stock

1+ parts

$26.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,621

$26.900

-

-

-

ChromeModa Solutions

Germany . 6,000 parts In-Stock

1+ parts

$27.449

100+ parts

$22.508

1k+ parts

-

10k+ parts

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6,000

$27.449

$22.508

-

-

IDEA Electronic Components Group

UK . 48 parts In-Stock

1+ parts

$27.449

100+ parts

$26.077

1k+ parts

$24.704

10k+ parts

-

48

$27.449

$26.077

$24.704

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

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Overview

Unlock the power of seamless data transmission with the 1P1G126QDRYRQ1 by Texas Instruments. Crafted with precision and expertise, this bus driver and transceiver offers unparalleled quality and reliability. Perfect for automotive applications, this advanced device ensures smooth operation at extreme temperatures. Experience the value of fast propagation delays and true output polarity, providing optimal performance for your projects. Trust Texas Instruments to deliver top-notch technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials help in reducing the weight of the product, making it easier to handle and install.

Surface Mount: YES

Surface mount technology is more space-efficient and allows for automated assembly, making the product suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 1.8

Low voltage operation minimizes power consumption and heat dissipation, leading to energy efficiency.

Propagation Delay (tpd): 9 ns

Low propagation delay ensures fast signal transmission, making the product ideal for applications requiring quick response times.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range ensures reliable operation in harsh environments, making the product suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Bus Driver & Transceivers 1P1G126QDRYRQ1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay (tpd):

9 ns

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

1P1G126QDRYRQ1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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