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1P1G125QDCKRG4Q1

Texas Instruments

1P1G125QDCKRG4Q1 by Texas Instruments

1P1G125QDCKRG4Q1 by Texas Instruments is a 3.3V bus driver with 5.1ns propagation delay, suitable for automotive applications due to AEC-Q100 screening. It features a small outline package with 5 terminals and operates in the temperature range of -40 to 125°C. The device has a max I (ol) of 32A and is designed for true output polarity control in unidirectional systems.

Median Price

$0.244

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 252,000 parts In-Stock

1+ parts

$0.100

100+ parts

$0.100

1k+ parts

$0.100

10k+ parts

-

252,000

$0.100

$0.100

$0.100

-

Texas Instruments

USA . 434,657 parts In-Stock

1+ parts

$0.244

100+ parts

$0.166

1k+ parts

$0.085

10k+ parts

-

434,657

$0.244

$0.166

$0.085

-

DigiKey

USA . 2,647 parts In-Stock

1+ parts

$0.660

100+ parts

$0.366

1k+ parts

$0.320

10k+ parts

$0.286

2,647

$0.660

$0.366

$0.320

$0.286

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,733 parts In-Stock

1+ parts

$0.124

100+ parts

-

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3,733

$0.124

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Digiode

USA . 3,153 parts In-Stock

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$0.232

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-

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3,153

$0.232

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Bristol Electronics

USA . 1,674 parts In-Stock

1+ parts

$0.678

100+ parts

$0.339

1k+ parts

$0.136

10k+ parts

-

1,674

$0.678

$0.339

$0.136

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Chip Stock

USA . 15,500 parts In-Stock

1+ parts

-

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15,500

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ComSIT Distribution GmbH

Germany . 9,692 parts In-Stock

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9,692

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Cyclops Electronics Ltd

UK . 5,927 parts In-Stock

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5,927

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Dan-Mar Components

USA . 1,674 parts In-Stock

1+ parts

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1,674

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VNN

France . 349 parts In-Stock

1+ parts

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349

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,437 parts In-Stock

1+ parts

$0.220

100+ parts

-

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2,437

$0.220

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Ampacity Inc.

Singapore . 149,560 parts In-Stock

1+ parts

$0.229

100+ parts

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149,560

$0.229

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Parana Technologies

USA . 1,684 parts In-Stock

1+ parts

$15.555

100+ parts

-

1k+ parts

$15.930

10k+ parts

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1,684

$15.555

-

$15.930

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ChromeModa Solutions

Germany . 5,481 parts In-Stock

1+ parts

$17.477

100+ parts

$14.331

1k+ parts

-

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5,481

$17.477

$14.331

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IDEA Electronic Components Group

UK . 693 parts In-Stock

1+ parts

$17.477

100+ parts

$16.603

1k+ parts

$15.729

10k+ parts

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693

$17.477

$16.603

$15.729

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Perfect Parts

USA . 31,372 parts In-Stock

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31,372

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A-Z Elektronik GmbH

Germany . 9,000 parts In-Stock

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9,000

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Kepictronics

USA . 7,200 parts In-Stock

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7,200

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DigiPath Technology Company

USA . 1,991 parts In-Stock

1+ parts

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100+ parts

$15.757

1k+ parts

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1,991

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$15.757

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Netroflash

USA . 500 parts In-Stock

1+ parts

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500

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Overview

Discover the power of seamless communication with the 1P1G125QDCKRG4Q1 by Texas Instruments. Designed with precision and reliability in mind, this bus driver and transceiver offers unparalleled performance in automotive applications. With a compact design and advanced technology, this product ensures fast propagation and low power consumption, making it the ideal choice for your projects. Trust Texas Instruments to deliver quality and innovation that exceeds expectations. Experience the difference with the 1P1G125QDCKRG4Q1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for automotive applications.

Propagation Delay At Nominal Supply: 5.1 ns

Low propagation delay ensures fast signal transmission, improving overall performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards for automotive use.

Nominal Supply Voltage / Vsup (V): 3.3

Ideal supply voltage for automotive applications, providing stable operation.

Load Capacitance (CL): 50 pF

Optimal load capacitance for efficient signal transmission and reception.

Power Supplies (V): 3.3

Compatibility with 3.3V power supplies, commonly used in automotive electronics.

No. of Terminals: 5

Compact design with a low number of terminals simplifies integration and reduces space requirements.

Maximum I (ol): 32 Amp

High maximum output current capability allows for driving of loads with ease.

Output Characteristics: 3-STATE

3-STATE output allows for flexible control of output signal, enhancing versatility.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for automotive applications.

Technical Specifications

Bus Driver & Transceivers 1P1G125QDCKRG4Q1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.1 ns

Propagation Delay (tpd):

5.1 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

1.25 mm

Trade Compliance

1P1G125QDCKRG4Q1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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