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Z84C40BD2

STMicroelectronics

Z84C40BD2 by STMicroelectronics

Z84C40BD2 by STMicroelectronics is a Serial Communication Controller with 5V power supply, 40 terminals, and 6 MHz clock frequency. It supports communication protocols like ASYNC, SYNC, HDLC and has low power mode. Ideal for Z80 bus compatibility in military-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,590 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,590

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-

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Anansix

USA . 2,770 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,770

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Vyrian

USA . 1,829 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,829

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 465 parts In-Stock

1+ parts

$35.702

100+ parts

-

1k+ parts

$32.132

10k+ parts

-

465

$35.702

-

$32.132

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MKK Technologies

India . 128 parts In-Stock

1+ parts

$67.136

100+ parts

-

1k+ parts

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10k+ parts

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128

$67.136

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DigiPath Technology Company

USA . 128 parts In-Stock

1+ parts

$67.136

100+ parts

-

1k+ parts

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10k+ parts

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128

$67.136

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-

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Parana Technologies

USA . 2,141 parts In-Stock

1+ parts

-

100+ parts

$42.688

1k+ parts

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10k+ parts

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2,141

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$42.688

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Corphita

USA . 1,342 parts In-Stock

1+ parts

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1,342

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Overview

Unlock seamless communication possibilities with the Z84C40BD2 from STMicroelectronics. Crafted with precision and expertise, this serial communication controller offers unparalleled performance and reliability. Ideal for a wide range of applications, this versatile component provides customers with value, benefits, and advantages that are second to none. Elevate your projects to new heights with the quality and innovation that only STMicroelectronics can deliver.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed cofired package body material provides excellent durability and protection for the internal components, making this product suitable for harsh operating environments.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options and ensures stable operation under varying voltage conditions.

Package Shape: RECTANGULAR

The rectangular package shape is a standard and convenient form factor for easy integration into various electronic systems.

Power Supplies (V): 5

The 5V power supply requirement is commonly available and widely supported, ensuring compatibility with most power sources.

No. of Terminals: 40

The 40 terminals provide ample connectivity options for interfacing with other devices and systems.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures that the product can operate even under slightly lower power supply conditions, enhancing its reliability.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows for reliable performance in a wide range of temperature environments.

Maximum Data Transfer Rate: 0.09765625 MBps

The high data transfer rate enables fast and efficient communication, making this product suitable for applications requiring high-speed data transmission.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable performance even in extremely cold conditions, making this product versatile for various operating environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good conductivity and solderability, ensuring secure connections and ease of assembly.

Terminal Position: DUAL

The dual terminal position offers flexibility in connecting multiple devices or peripherals, enhancing the versatility of this product.

Width: 15.24 mm

The compact width of 15.24 mm enables space-efficient integration of this product into a wide range of electronic systems and applications.

Data Encoding or Decoding Method: NRZ

The NRZ data encoding or decoding method ensures efficient and reliable data transmission, contributing to the overall performance and reliability of this product.

External Data Bus Width: 8

The 8-bit external data bus width allows for efficient data transfer and processing, making this product suitable for applications requiring data-intensive operations.

Communication Protocol: ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC

The support for various communication protocols enables seamless integration with different systems and devices, enhancing the interoperability and compatibility of this product.

Maximum Clock Frequency: 6 MHz

The high maximum clock frequency of 6 MHz enables fast data processing and communication, making this product suitable for high-performance applications.

Temperature Grade: MILITARY

The military-grade temperature rating ensures robust performance in harsh environmental conditions and critical applications, making this product reliable and durable.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The peripheral IC type of serial IO/communication controller enables efficient and reliable serial communication, making this product ideal for data transfer and control applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, contributing to the energy efficiency and reliability of the overall system.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and provides secure connections, ensuring ease of installation and reliability in operation.

Maximum Supply Current: 10 mA

The low maximum supply current of 10 mA reduces power consumption and heat generation, contributing to the energy efficiency and longevity of this product.

Nominal Supply Voltage: 5 V

The nominal 5V supply voltage is a common industry standard, ensuring compatibility with a wide range of power sources and systems.

No. of Serial I/Os: 2

The two serial I/O ports provide versatile connectivity options for interfacing with multiple devices or peripherals, enhancing the flexibility and usability of this product.

Bus Compatibility: Z80

The Z80 bus compatibility ensures seamless integration with Z80-based systems and devices, expanding the potential applications and compatibility of this product.

Terminal Pitch: 2.54 mm

The standard 2.54 mm terminal pitch allows for easy connections and compatibility with common connectors, facilitating the integration of this product into various electronic systems.

Low Power Mode: YES

The availability of a low power mode enhances energy efficiency and extends battery life, making this product ideal for low-power applications or portable devices.

Technical Specifications

Serial Communication Controllers Z84C40BD2 attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Additional Features:

MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS

Address Bus Width:

1

Boundary Scan:

NO

Bus Compatibility:

Z80

Maximum Clock Frequency:

6 MHz

Communication Protocol:

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.09765625 MBps

External Data Bus Width:

8

JESD-30 Code:

R-CDIP-T40

JESD-609 Code:

e0

Low Power Mode:

YES

No. of DMA Channels:

0

No. of I/O Lines:

0

No. of Serial I/Os:

2

No. of Terminals:

40

On Chip Data RAM Width:

0

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

Z84C40BD2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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