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Z84C41BB6

STMicroelectronics

Z84C41BB6 by STMicroelectronics

Z84C41BB6 by STMicroelectronics is a Serial Communication Controller with 40 terminals, operating at 5V. It supports data rates up to 0.09765625 MBps and communication protocols like ASYNC, BIT, SYNC. Widely used in industrial applications for serial I/O and communication tasks due to its CMOS technology and low power mode.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,558 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,558

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Digiode

USA . 1,438 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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1,438

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Vyrian

USA . 763 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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763

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ComSIT Distribution GmbH

Germany . 454 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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454

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,934 parts In-Stock

1+ parts

$14.415

100+ parts

-

1k+ parts

$12.974

10k+ parts

-

1,934

$14.415

-

$12.974

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MKK Technologies

India . 1,220 parts In-Stock

1+ parts

$27.107

100+ parts

-

1k+ parts

-

10k+ parts

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1,220

$27.107

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DigiPath Technology Company

USA . 1,220 parts In-Stock

1+ parts

$27.107

100+ parts

-

1k+ parts

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10k+ parts

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1,220

$27.107

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-

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Corphita

USA . 2,597 parts In-Stock

1+ parts

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2,597

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Parana Technologies

USA . 1,464 parts In-Stock

1+ parts

-

100+ parts

$17.236

1k+ parts

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10k+ parts

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1,464

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$17.236

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Overview

Enhance your communication systems with the Z84C41BB6 by STMicroelectronics, a top-tier manufacturer known for its high-quality products. This Serial Communication Controller offers seamless data transfer at lightning-fast speeds, making it ideal for various applications. With a wide range of communication protocols supported and low power consumption, this device ensures efficiency and reliability in all your projects. Upgrade your systems today and experience the value and benefits that this advanced controller brings to your technology solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight yet durable, making the product easy to handle and resistant to wear and tear in various environments.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in installation and operation.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into existing systems or circuit boards, optimizing space utilization and design flexibility.

Power Supplies (V): 5

With a low power supply requirement of 5V, the product can operate efficiently without the need for high power consumption, making it cost-effective and energy-efficient.

No. of Terminals: 40

The high number of terminals allows for versatile connectivity options, enabling the product to interface with multiple devices or components seamlessly.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and maintenance, reducing potential wiring errors and ensuring a neat and organized system layout.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures reliable operation even with fluctuating power sources, enhancing the product's stability and performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, making it suitable for industrial applications where temperature variations are common.

Maximum Data Transfer Rate: 0.09765625 MBps

The high data transfer rate allows for fast and efficient communication, enabling quick transmission of large amounts of data and improving overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions, making the product suitable for a wide range of operating environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and stable connection quality.

Terminal Position: DUAL

The dual terminal position offers redundancy and flexibility in connection setup, allowing for multiple configuration options and ensuring reliable data transmission.

Width: 15.24 mm

The compact width of the product enables easy integration into tight spaces or crowded installations, offering versatility in system design and layout.

Data Encoding or Decoding Method: NRZ

The NRZ data encoding method ensures efficient and accurate data transmission, reducing errors and improving the reliability of communication protocols.

External Data Bus Width: 8

The 8-bit external data bus width enhances data processing capabilities, enabling the product to handle large data volumes efficiently and effectively.

Communication Protocol: ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC

The support for multiple communication protocols allows for compatibility with various systems and devices, facilitating seamless data exchange and system integration.

Maximum Clock Frequency: 6 MHz

The high maximum clock frequency ensures fast and accurate data synchronization, enabling real-time communication and precise timing in data transmission.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating indicates the product's robustness and resilience in demanding industrial environments, ensuring reliable operation under challenging conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The product's serial IO and communication controller design provides versatile connectivity options and efficient data transfer, making it ideal for serial communication applications.

Technology: CMOS

The CMOS technology offers low power consumption and high-speed operation, enhancing the product's efficiency and performance in data processing and communication tasks.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure and reliable connections, preventing disconnection or signal loss in high-vibration environments or rough handling conditions.

Maximum Supply Current: 10 mA

The low maximum supply current requirement minimizes power consumption and heat generation, contributing to the product's energy efficiency and overall system reliability.

Nominal Supply Voltage: 5 V

The stable nominal supply voltage ensures consistent and reliable operation, reducing the risk of voltage fluctuations and enhancing system performance and longevity.

No. of Serial I/Os: 2

Having multiple serial I/Os allows for simultaneous data exchange with multiple devices, increasing system efficiency and throughput for enhanced communication capabilities.

Bus Compatibility: Z80

The compatibility with Z80 bus architecture ensures seamless integration with Z80-based systems and peripherals, making the product a versatile and readily deployable solution for Z80 platforms.

Terminal Pitch: 2.54 mm

The standard terminal pitch allows for easy connection to external devices or circuit boards, facilitating installation and maintenance procedures for quick and hassle-free setup.

Low Power Mode: YES

The low power mode feature reduces power consumption during idle or standby periods, maximizing energy efficiency and prolonging battery life for mobile or remote applications.

Technical Specifications

Serial Communication Controllers Z84C41BB6 attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Additional Features:

MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS

Address Bus Width:

1

Boundary Scan:

NO

Bus Compatibility:

Z80

Maximum Clock Frequency:

6 MHz

Communication Protocol:

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.09765625 MBps

External Data Bus Width:

8

JESD-30 Code:

R-PDIP-T40

JESD-609 Code:

e0

Low Power Mode:

YES

No. of DMA Channels:

0

No. of I/O Lines:

0

No. of Serial I/Os:

2

No. of Terminals:

40

On Chip Data RAM Width:

0

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

Z84C41BB6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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