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Z84C42AB6

STMicroelectronics

Z84C42AB6 by STMicroelectronics

Z84C42AB6 by STMicroelectronics is a Serial Communication Controller with 40 terminals, operating at 4-5.5V, and supports data rates up to 0.09765625 MBps. It is ideal for industrial applications requiring synchronous and asynchronous communication protocols like HDLC, SDLC, and X.25.

Median Price

$24.990

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 3 parts In-Stock

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$24.990

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Vyrian

USA . 4,564 parts In-Stock

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Digiode

USA . 4,465 parts In-Stock

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Anansix

USA . 280 parts In-Stock

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280

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J2 Sourcing AB

Sweden . 269 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 186 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 75 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 26 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,591 parts In-Stock

1+ parts

$63.614

100+ parts

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1k+ parts

$57.253

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1,591

$63.614

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$57.253

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MKK Technologies

India . 1,752 parts In-Stock

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$119.623

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$119.623

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DigiPath Technology Company

USA . 1,752 parts In-Stock

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$119.623

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1,752

$119.623

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Parana Technologies

USA . 1,173 parts In-Stock

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$76.061

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$76.061

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Corphita

USA . 646 parts In-Stock

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Perfect Parts

USA . 242 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 108 parts In-Stock

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Assy Fe

Spain . 75 parts In-Stock

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Overview

Unlock seamless communication with the Z84C42AB6 by STMicroelectronics. Crafted with precision and reliability, this serial communication controller offers unparalleled performance in a wide range of applications. From asynchronous to synchronous protocols, this versatile device ensures smooth data transfer at high speeds. With low power mode capabilities and a robust construction, the Z84C42AB6 guarantees optimal functionality and durability. Trust STMicroelectronics for cutting-edge technology that delivers value and efficiency to your projects. Elevate your communication systems with the Z84C42AB6 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to impact, making the product reliable for long-term use.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage allows for flexibility in power input, accommodating various power sources without risking damage to the controller.

Package Shape: RECTANGULAR

The rectangular package shape enables easy integration into different systems and devices, simplifying installation and design processes.

No. of Serial I/Os: 2

Having 2 serial I/Os provides versatility in connecting to multiple devices simultaneously, enhancing the product's communication capabilities.

Maximum Data Transfer Rate: 0.09765625 MBps

The high maximum data transfer rate ensures efficient and speedy communication between devices, leading to faster data transmission and processing.

Communication Protocol: ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC

Support for multiple communication protocols allows for compatibility with various systems and devices, making the product versatile and adaptable to different environments.

Maximum Clock Frequency: 4 MHz

The high maximum clock frequency enables the controller to process data at a fast rate, improving overall system performance and responsiveness.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the controller can operate in harsh environmental conditions, making it suitable for a wide range of industrial applications.

Technical Specifications

Serial Communication Controllers Z84C42AB6 attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Additional Features:

MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS

Address Bus Width:

1

Boundary Scan:

NO

Bus Compatibility:

Z80

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.09765625 MBps

External Data Bus Width:

8

JESD-30 Code:

R-PDIP-T40

JESD-609 Code:

e0

Low Power Mode:

YES

No. of DMA Channels:

0

No. of I/O Lines:

0

No. of Serial I/Os:

2

No. of Terminals:

40

On Chip Data RAM Width:

0

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

6 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

Z84C42AB6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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