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VNQ830PEP-E

STMicroelectronics

VNQ830PEP-E by STMicroelectronics

VNQ830PEP-E by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V, supporting up to 4 functions. It features built-in protections against overcurrent and thermal issues, making it ideal for automotive applications. With a compact design (7.5mm x 10.3mm), it ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,709 parts In-Stock

1+ parts

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5,709

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Digiode

USA . 3,133 parts In-Stock

1+ parts

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3,133

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Anansix

USA . 1,114 parts In-Stock

1+ parts

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1,114

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,037 parts In-Stock

1+ parts

$8.766

100+ parts

-

1k+ parts

$7.889

10k+ parts

-

2,037

$8.766

-

$7.889

-

AZTECH Wire

Italy . 694 parts In-Stock

1+ parts

$11.670

100+ parts

-

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-

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-

694

$11.670

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-

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MKK Technologies

India . 800 parts In-Stock

1+ parts

$16.483

100+ parts

-

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800

$16.483

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DigiPath Technology Company

USA . 800 parts In-Stock

1+ parts

$16.483

100+ parts

-

1k+ parts

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800

$16.483

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-

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Component Stockers USA

USA . 768 parts In-Stock

1+ parts

$99.990

100+ parts

-

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768

$99.990

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Microchip USA

USA . 4,820 parts In-Stock

1+ parts

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4,820

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QUARKTWIN TECHNOLOGY LTD

USA . 3,736 parts In-Stock

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3,736

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Corphita

USA . 2,815 parts In-Stock

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2,815

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Parana Technologies

USA . 1,950 parts In-Stock

1+ parts

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$10.481

1k+ parts

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1,950

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$10.481

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

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350

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Kepictronics

USA . 146 parts In-Stock

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146

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Overview

Elevate your designs with the VNQ830PEP-E from STMicroelectronics, a leader in high-quality semiconductor solutions. This advanced peripheral driver offers unmatched reliability and built-in protections against transient spikes, overcurrent, and thermal issues, ensuring your systems run smoothly. Ideal for automotive and industrial applications, it empowers your projects with superior performance, efficiency, and peace of mind—transforming challenges into innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and reliability under various environmental conditions.

Surface Mount: YES

Surface mount technology enables compact design and easy integration into modern circuit boards.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this driver is suitable for a wide range of applications requiring robust power supply.

No. of Functions: 4

Featuring 4 functions, this device offers versatility and efficiency for various peripheral driver applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on the PCB, making it suitable for designs with space constraints.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections safeguard the device and connected circuits from damage due to electrical anomalies.

Power Supplies (V): 8/36

A wide range of power supply options (8V to 36V) increases compatibility with various systems.

No. of Terminals: 24

Having 24 terminals offers flexibility in connectivity and functionality, accommodating complex designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This packaging style enhances thermal performance and is ideal for applications requiring effective heat dissipation.

Minimum Supply Voltage: 5.5 V

The minimum supply voltage allows for operation in low-voltage applications, expanding the product's usability.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and ensures reliability in electrical connections.

Terminal Position: DUAL

Dual terminal positioning aids in better layout design flexibility, contributing to optimized board design.

Maximum Seated Height: 2.22 mm

Low height allows for space-saving designs, enhancing the compatibility with compact electronic devices.

Width: 7.5 mm

A width of 7.5 mm makes it a compact choice for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient reflow processes during assembly, ensuring high manufacturing throughput.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C supports compatibility with high-temperature soldering processes.

Length: 10.3 mm

Compact length aids in efficient use of PCB space, fitting into various design layouts.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and reliability during soldering.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13V is ideal for many standard applications, optimizing overall performance.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm enables compact layout designs without compromising connection integrity.

Driver No. of Bits: 4

A 4-bit driver configuration offers enhanced performance for multiple output functions in digital applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, allowing for appropriate storage and handling protocols.

Nominal Output Peak Current Limit: 18 A

Able to handle a peak current limit of 18A, this driver is well-suited for demanding applications requiring robust output.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This versatile interface IC type is perfect for various buffering and inverting functions in peripheral devices.

Output Current Flow Direction: SOURCE

The source output current flow direction enhances the device's ability to drive loads and ensures effective performance.

Technical Specifications

Peripheral Drivers VNQ830PEP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

18 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.22 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VNQ830PEP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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