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VNQ05XSP1613TR

STMicroelectronics

VNQ05XSP1613TR by STMicroelectronics

VNQ05XSP1613TR from STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V, supporting applications in automotive and industrial sectors. It features built-in protections against overcurrent and thermal issues. This compact 16-terminal device operates efficiently b/w 5.5V to 36V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,211 parts In-Stock

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3,211

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Digiode

USA . 3,112 parts In-Stock

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3,112

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Anansix

USA . 2,769 parts In-Stock

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2,769

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Distributors (Availability)

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Microchip USA

USA . 176 parts In-Stock

1+ parts

$6.290

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176

$6.290

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IDEA Electronic Components Group

UK . 1,809 parts In-Stock

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$8.065

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-

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$7.258

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1,809

$8.065

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$7.258

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MKK Technologies

India . 1,507 parts In-Stock

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$15.165

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1,507

$15.165

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DigiPath Technology Company

USA . 1,507 parts In-Stock

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$15.165

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1,507

$15.165

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AZTECH Wire

Italy . 980 parts In-Stock

1+ parts

$17.910

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980

$17.910

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Component Stockers USA

USA . 328 parts In-Stock

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$99.990

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328

$99.990

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Perfect Parts

USA . 2,585 parts In-Stock

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2,585

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Corphita

USA . 2,248 parts In-Stock

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Parana Technologies

USA . 1,109 parts In-Stock

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$9.643

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$9.643

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Overview

Unlock the potential of your designs with the VNQ05XSP1613TR from STMicroelectronics, a leader in high-quality semiconductor solutions. This robust peripheral driver excels in reliability, offering built-in protections against transient spikes and thermal issues, ensuring long-lasting performance. Ideal for automotive, industrial, and consumer applications, it elevates your projects with seamless integration, efficiency, and peace of mind—perfect for developers seeking excellence without compromise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures high durability and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Being a surface mount component allows for compact designs and simplifies the manufacturing process, enhancing assembly efficiency.

Maximum Supply Voltage: 36 V

A maximum supply voltage of 36V provides flexibility for various applications and ensures compatibility with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space usage on circuit boards, allowing for better layout and integration with other components.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections enhance the product's reliability and longevity by safeguarding against common electrical faults.

Power Supplies (V): 5.5/36

Support for a wide range of power supplies (5.5V to 36V) makes this driver versatile, suitable for various operational environments.

No. of Terminals: 16

With 16 terminals, the product allows for extensive connectivity options, facilitating integration into complex systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline and heat sink/slug design help manage thermal dissipation, which is crucial for maintaining performance in demanding applications.

Minimum Supply Voltage: 5.5 V

A minimum supply voltage of 5.5V ensures compatibility with low voltage environments, broadening its applicability.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for easier routing and flexibility in circuit board design, making installation simpler.

Maximum Seated Height: 3.6 mm

A low maximum seated height helps in designing slim and compact devices, ideal for space-constrained applications.

Width: 7.5 mm

At just 7.5mm wide, this product can fit into tighter spaces on PCB layouts without compromising functionality.

Maximum Time At Peak Reflow Temperature: 30 s

Having a maximum reflow time of 30 seconds helps in optimizing production efficiency while minimizing thermal stress during assembly.

Peak Reflow Temperature: 250 °C

A peak reflow temperature of 250 °C ensures compatibility with modern surface-mount soldering processes, promoting ease of manufacturing.

Length: 9.4 mm

At a length of 9.4mm, the product maintains a compact form, making it suitable for various designs while ensuring effective performance.

Terminal Form: GULL WING

Gull wing terminal form offers strong mechanical stability and excellent soldering characteristics, which enhance reliability after installation.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13V is advantageous for many standard applications, making it a dependable choice for engineers.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch enables higher density component placement on PCBs, essential for modern compact designs.

Driver No. of Bits: 4

With 4 driver bits, it allows for enhanced control and manipulation of peripheral devices, contributing to the versatility of the product.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, necessitating proper handling, ensuring the integrity of the device during assembly.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter-based peripheral driver makes it an essential component for driving various signals with reliability and efficiency.

Output Current Flow Direction: SOURCE

The source output current flow direction is ideal for powering external components, providing flexibility in circuit design.

Technical Specifications

Peripheral Drivers VNQ05XSP1613TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP16,.55,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

5.5/36

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VNQ05XSP1613TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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