Loading...

VNQ05XSP16

STMicroelectronics

VNQ05XSP16 by STMicroelectronics

VNQ05XSP16 by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V, built-in protections against overcurrent and thermal issues. It features a compact 16-terminal design suitable for surface mounting. Ideal for buffer or inverter applications, it operates b/w 5.5V and 36V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,233

-

-

-

-

Digiode

USA . 1,919 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,919

-

-

-

-

Anansix

USA . 809 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

809

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 276 parts In-Stock

1+ parts

$3.178

100+ parts

-

1k+ parts

-

10k+ parts

-

276

$3.178

-

-

-

IDEA Electronic Components Group

UK . 1,747 parts In-Stock

1+ parts

$11.207

100+ parts

-

1k+ parts

$10.087

10k+ parts

-

1,747

$11.207

-

$10.087

-

MKK Technologies

India . 463 parts In-Stock

1+ parts

$21.075

100+ parts

-

1k+ parts

-

10k+ parts

-

463

$21.075

-

-

-

DigiPath Technology Company

USA . 463 parts In-Stock

1+ parts

$21.075

100+ parts

-

1k+ parts

-

10k+ parts

-

463

$21.075

-

-

-

AZTECH Wire

Italy . 659 parts In-Stock

1+ parts

$21.660

100+ parts

-

1k+ parts

-

10k+ parts

-

659

$21.660

-

-

-

Corphita

USA . 2,731 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,731

-

-

-

-

iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

350

-

-

-

-

Parana Technologies

USA . 188 parts In-Stock

1+ parts

-

100+ parts

$13.400

1k+ parts

-

10k+ parts

-

188

-

$13.400

-

-

Overview

Elevate your designs with the VNQ05XSP16 from STMicroelectronics, a powerhouse in peripheral drivers. This compact solution ensures robust performance with built-in protections against overcurrent, voltage spikes, and thermal issues, making it perfect for diverse applications—from automotive to industrial automation. Trust in ST’s legacy of quality and innovation to deliver reliability and efficiency, empowering your projects with cutting-edge technology that enhances value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental stresses, making the driver reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact size and efficient use of PCB space, which is ideal for modern electronic designs.

Maximum Supply Voltage: 36 V

A high maximum supply voltage enables compatibility with a wide range of devices, making this driver versatile for different applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout and scalability in electronic designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The extensive built-in protections enhance the longevity and reliability of the driver, safeguarding it against common electrical faults.

Power Supplies (V): 5.5/36

The wide operating voltage range allows the driver to function in various power environments, increasing its adaptability.

No. of Terminals: 16

Having 16 terminals provides flexibility in circuit design and allows for complex configurations without requiring multiple components.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style contributes to effective heat dissipation and supports efficient thermal management in compact designs.

Minimum Supply Voltage: 5.5 V

Starting at a minimum supply voltage of 5.5 V makes this driver suitable for low-voltage applications, broadening its usability.

Terminal Finish: Matte Tin (Sn) - annealed

A matte tin finish ensures good solderability, enhancing the assembly process and ensuring reliable electrical contacts.

Terminal Position: DUAL

Dual terminal positions allow for flexible layout configurations, facilitating use in various circuit topologies.

Maximum Seated Height: 3.6 mm

A low profile seated height helps in fitting the driver into space-constrained designs, making it ideal for portable devices.

Width: 7.5 mm

The compact width helps to save board space, allowing for denser circuit designs without compromising performance.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum peak reflow time of 30 seconds indicates compatibility with standard manufacturing processes, thus reducing production costs.

Peak Reflow Temperature °C: 250

Operating at a peak reflow temperature of 250 °C ensures compatibility with high-temperature soldering processes, enhancing reliability.

Length: 9.4 mm

The short length of the component allows for efficient routing on PCBs, optimizing the design layout.

Terminal Form: GULL WING

Gull wing terminals provide excellent strength and reliability for soldering, ensuring a stable connection on PCB.

Nominal Supply Voltage: 13 V

A nominal voltage of 13 V strikes a balance between low and high voltage applications, making the driver versatile across devices.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for high-density connections, making it suitable for modern, space-limited designs.

Driver No. of Bits: 4

With 4 bits, the driver can effectively handle multiple signals, making it suitable for a variety of control applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, guiding handling and storage to maintain component integrity.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This type of interface IC allows for signal conditioning, ensuring enhanced performance in driving peripheral devices.

Output Current Flow Direction: SOURCE

As a source output, the driver can effectively control and provide current to peripheral devices, enhancing its functionality.

Technical Specifications

Peripheral Drivers VNQ05XSP16 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP16,.55,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

5.5/36

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VNQ05XSP16 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 2