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VNN1NV04

STMicroelectronics

VNN1NV04 by STMicroelectronics

VNN1NV04 by STMicroelectronics is a compact MOS peripheral driver with built-in protections against transient, overcurrent, and thermal issues. It features a max output current of 0.5 A and fast turn-on time of 1 µs. Ideal for buffer/inverter applications in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,267 parts In-Stock

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3,267

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Anansix

USA . 2,779 parts In-Stock

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2,779

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Digiode

USA . 1,171 parts In-Stock

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1,171

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Halfin

Belgium . 289 parts In-Stock

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289

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IDEA Electronic Components Group

UK . 1,541 parts In-Stock

1+ parts

$12.283

100+ parts

-

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$11.055

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1,541

$12.283

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$11.055

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MKK Technologies

India . 559 parts In-Stock

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$23.097

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559

$23.097

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DigiPath Technology Company

USA . 559 parts In-Stock

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$23.097

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559

$23.097

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Kepictronics

USA . 61,000 parts In-Stock

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61,000

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RC Electronics

USA . 18,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,591 parts In-Stock

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Corphita

USA . 3,115 parts In-Stock

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3,115

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Assy Fe

Spain . 2,464 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 43 parts In-Stock

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$14.686

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43

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$14.686

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Overview

Elevate your designs with the VNN1NV04 from STMicroelectronics, a leading name in innovation and reliability. This high-performance peripheral driver offers built-in protections against transient spikes, overcurrent, and thermal issues, ensuring your applications run smoothly and safely. With its compact size and efficient performance, the VNN1NV04 is perfect for automotive, industrial, and consumer electronics, delivering unmatched value and peace of mind to customers seeking quality and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating easier integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCB layouts, allowing for efficient use of board real estate.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

These built-in protections enhance reliability and ensure safe operation under various conditions, reducing the risk of damage.

No. of Terminals: 4

A 4-terminal design provides the necessary connections for efficient operation while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, enabling high-density mounting on PCBs.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and enhances long-term reliability of the connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options and facilitates better electrical performance.

Maximum Seated Height: 1.8 mm

A maximum seated height of 1.8 mm ensures low profile design, making it suitable for compact devices.

Width: 3.5 mm

Narrow width supports easier integration into tight spaces without compromising on performance.

Length: 6.5 mm

The length provides a balance between size and functionality, enabling it to fit in a variety of configurations.

Maximum Output Current: 0.5 A

A maximum output current of 0.5 A is sufficient for driving many peripheral devices, ensuring versatility.

Technology: MOS

MOS technology provides high efficiency and fast switching capabilities, essential for modern electronic applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and improves mechanical stability on the PCB.

Turn-on Time: 1 us

Fast turn-on time of 1 microsecond enhances responsiveness in peripheral applications, improving overall system performance.

Terminal Pitch: 2.3 mm

The 2.3 mm terminal pitch ensures compatibility with various PCB layouts, making it easier to integrate into existing designs.

Nominal Output Peak Current Limit: 1.7 A

The ability to handle a peak current limit of 1.7 A allows for brief surges in demand, accommodating spikes in peripheral usage.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This type of interface IC ensures compatibility with a wide range of devices, enhancing the versatility of the driver.

Turn-off Time: 5.5 us

A turn-off time of 5.5 microseconds helps increase operational efficiency, particularly in high-speed applications.

Output Current Flow Direction: SINK

A sinking output current flow direction is commonly required in various peripheral applications, ensuring broader compatibility.

Technical Specifications

Peripheral Drivers VNN1NV04 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SINK

Maximum Output Current:

.5 A

Nominal Output Peak Current Limit:

1.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.8 mm

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Turn-off Time:

5.5 us

Turn-on Time:

1 us

Width:

3.5 mm

Trade Compliance

VNN1NV04 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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