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VNL5300S5-E

STMicroelectronics

VNL5300S5-E by STMicroelectronics

STMicroelectronics VNL5300S5-E is a peripheral driver with 8 terminals, operating voltage range of 3.5V to 5.5V, and built-in protections against transient, over current, and over voltage. It features a small outline package style suitable for surface mount applications in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 48,440 parts In-Stock

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48,440

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Vyrian

USA . 7,466 parts In-Stock

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7,466

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Digiode

USA . 3,777 parts In-Stock

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3,777

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ComSIT Distribution GmbH

Germany . 2,400 parts In-Stock

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2,400

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ComSIT USA

USA . 2,400 parts In-Stock

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2,400

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Anansix

USA . 696 parts In-Stock

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696

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Microchip USA

USA . 407 parts In-Stock

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$1.979

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407

$1.979

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IDEA Electronic Components Group

UK . 2,027 parts In-Stock

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$13.793

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-

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$12.413

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2,027

$13.793

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$12.413

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AZTECH Wire

Italy . 560 parts In-Stock

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$16.370

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560

$16.370

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MKK Technologies

India . 167 parts In-Stock

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$25.936

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167

$25.936

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DigiPath Technology Company

USA . 167 parts In-Stock

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$25.936

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167

$25.936

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RC Electronics

USA . 61,494 parts In-Stock

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Perfect Parts

USA . 27,552 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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iodParts Technologies Inc.

India . 2,400 parts In-Stock

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Corphita

USA . 1,862 parts In-Stock

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1,862

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Parana Technologies

USA . 1,082 parts In-Stock

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$16.491

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$16.491

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Kepictronics

USA . 500 parts In-Stock

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500

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Overview

Elevate your electronics projects with the VNL5300S5-E from STMicroelectronics. Known for their top-quality manufacturing, this peripheral driver offers unparalleled protection against transient, over current, and over voltage events. With a wide supply voltage range of 3.5V to 5.5V, this compact rectangular device is perfect for various applications. Its small outline package style and dual terminal position make it versatile and easy to integrate into your designs. Experience peace of mind and reliable performance with the VNL5300S5-E, the ultimate solution for your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 5.5 V

Supports a wide range of operating voltages, providing flexibility in different system designs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, maximizing component density.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Built-in protections ensure the safety and reliability of the peripheral driver, protecting it from potential damage or failure.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components or peripherals in the system.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, allowing for compact and portable device designs.

Minimum Supply Voltage: 3.5 V

Low minimum supply voltage allows for operation in systems with lower power requirements, increasing versatility.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity for reliable performance.

Maximum Seated Height: 1.75 mm

Low seated height minimizes the overall profile of the peripheral driver, ideal for slim and compact devices.

Width: 3.9 mm

Compact width dimension saves space on the PCB, contributing to efficient PCB layout and design.

Length: 4.9 mm

Optimal length dimension for fitting within the layout of the PCB, ensuring proper placement and connectivity.

Terminal Form: GULL WING

Gull Wing terminal form offers secure connections and easy soldering during assembly, enhancing reliability.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage allows for compatibility with a wide range of electronic systems and devices.

Terminal Pitch: 1.27 mm

Fine terminal pitch enables high-density component placement on the PCB, optimizing space utilization.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter based interface IC type provides efficient signal handling and processing for peripheral connections.

Output Current Flow Direction: SINK

Sink output current flow direction ensures efficient power distribution and control within the system.

Technical Specifications

Peripheral Drivers VNL5300S5-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

VNL5300S5-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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