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VNL5030S5-E

STMicroelectronics

VNL5030S5-E by STMicroelectronics

STMicroelectronics VNL5030S5-E is a 12-terminal peripheral driver with built-in protections for transient, over current, and thermal issues. It operates b/w 3.5V to 5.5V, with turn-on time of 7.6us and turn-off time of 18.8us. Ideal for applications requiring sink output current flow direction in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 242,500 parts In-Stock

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242,500

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Vyrian

USA . 2,446 parts In-Stock

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2,446

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Digiode

USA . 296 parts In-Stock

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296

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Anansix

USA . 151 parts In-Stock

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151

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 743 parts In-Stock

1+ parts

$1.884

100+ parts

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1k+ parts

$1.696

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743

$1.884

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$1.696

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MKK Technologies

India . 1,093 parts In-Stock

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$3.543

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$3.543

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DigiPath Technology Company

USA . 1,093 parts In-Stock

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$3.543

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1,093

$3.543

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Microchip USA

USA . 348 parts In-Stock

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$4.228

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348

$4.228

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AZTECH Wire

Italy . 153 parts In-Stock

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$21.240

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153

$21.240

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Authorized Procurement Solutions

USA . 43,300 parts In-Stock

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43,300

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GreenTree Electronics

Israel . 4,270 parts In-Stock

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4,270

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Corphita

USA . 3,105 parts In-Stock

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3,105

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Perfect Parts

USA . 1,792 parts In-Stock

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1,792

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Parana Technologies

USA . 1,659 parts In-Stock

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$2.253

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1,659

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$2.253

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Overview

Unlock the full potential of your electronic devices with the VNL5030S5-E by STMicroelectronics. Designed with precision and reliability in mind, this peripheral driver offers built-in protections against transient events, overcurrent situations, and thermal issues. Ideal for a wide range of applications, this small outline package boasts a dual terminal position and a sink output current flow direction. Experience seamless performance and peace of mind knowing that your electronics are well-protected with the VNL5030S5-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and resistance to external factors, making this product reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of input voltages, making it versatile and compatible with various systems.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

The presence of built-in protections such as transient, overcurrent, and thermal protection ensures the safety of the peripheral driver and connected components, enhancing the overall reliability of the system.

No. of Terminals: 12

Having 12 terminals allows for multiple connection options, enabling the peripheral driver to interface with various devices and peripherals in a system.

Minimum Supply Voltage: 3.5 V

The low minimum supply voltage requirement makes this product energy-efficient and suitable for applications where power consumption is a concern.

Width: 3.9 mm

The compact width of 3.9 mm enables this peripheral driver to be used in space-constrained applications while maintaining a small footprint on the circuit board.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes this peripheral driver easy to integrate into compact electronic devices, providing flexibility in design and layout.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V ensures compatibility with standard power sources, making this peripheral driver suitable for a wide range of applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The use of buffer or inverter based interface IC type provides signal conditioning and voltage level translation, enhancing the performance and compatibility of the peripheral driver in various communication protocols.

Technical Specifications

Peripheral Drivers VNL5030S5-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G12

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

12

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

18.8 us

Turn-on Time:

7.6 us

Width:

3.9 mm

Trade Compliance

VNL5030S5-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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