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VND5E050AK-E

STMicroelectronics

VND5E050AK-E by STMicroelectronics

VND5E050AK-E by STMicroelectronics is a robust peripheral driver with a max supply voltage of 28V and an output current of 2A. It features built-in protections against transient, overcurrent, and thermal issues. Ideal for applications requiring reliable power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,490 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,490

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-

-

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Digiode

USA . 4,777 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,777

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-

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Anansix

USA . 271 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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271

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,339 parts In-Stock

1+ parts

$2.005

100+ parts

-

1k+ parts

$1.804

10k+ parts

-

2,339

$2.005

-

$1.804

-

MKK Technologies

India . 1,799 parts In-Stock

1+ parts

$3.770

100+ parts

-

1k+ parts

-

10k+ parts

-

1,799

$3.770

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-

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DigiPath Technology Company

USA . 1,799 parts In-Stock

1+ parts

$3.770

100+ parts

-

1k+ parts

-

10k+ parts

-

1,799

$3.770

-

-

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AZTECH Wire

Italy . 71 parts In-Stock

1+ parts

$19.300

100+ parts

-

1k+ parts

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10k+ parts

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71

$19.300

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-

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Microchip USA

USA . 276 parts In-Stock

1+ parts

$22.708

100+ parts

-

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10k+ parts

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276

$22.708

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-

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Corphita

USA . 3,677 parts In-Stock

1+ parts

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100+ parts

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3,677

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A-Z Elektronik GmbH

Germany . 2,100 parts In-Stock

1+ parts

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1k+ parts

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2,100

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Parana Technologies

USA . 767 parts In-Stock

1+ parts

-

100+ parts

$2.397

1k+ parts

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767

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$2.397

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

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350

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Overview

Elevate your designs with the VND5E050AK-E from STMicroelectronics, a trusted leader in innovative solutions. This premium peripheral driver boasts robust built-in protections against transient spikes and overcurrent, ensuring reliable performance in demanding applications. With its compact design and efficient power handling capabilities, it seamlessly integrates into various systems, delivering unmatched quality and value that enhances your projects and drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection from environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology enables easy integration into compact designs, ensuring efficient space usage on printed circuit boards.

Maximum Supply Voltage: 28 V

With a maximum supply voltage of 28 V, this product can handle high voltage applications, making it versatile across many devices.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and aids in better thermal management.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protections ensure the long-term reliability and safety of the device by safeguarding against common electrical faults.

Power Supplies (V): 8/28

Wide supply voltage range (8V to 28V) makes this peripheral driver suitable for diverse applications.

No. of Terminals: 24

The 24 terminals provide ample connectivity options, allowing for various configurations and functionalities.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style aids in effective heat dissipation while keeping a compact footprint, ensuring optimal performance.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage of 4.5 V means this product can operate with various power sources, increasing its adaptability.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and corrosion resistance, ensuring a stable connection over time.

Terminal Position: DUAL

Dual terminal positions allow for better distribution of signals and improved performance characteristics.

Maximum Seated Height: 2.45 mm

A low maximum seated height facilitates compatibility with space-constrained designs, enabling the product to fit neatly into various setups.

Width: 7.5 mm

This compact width helps conserve board space without compromising performance, making it ideal for tight layouts.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures proper attachment during manufacturing, promoting reliable quality.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperatures of 260 °C ensures compatibility with common soldering processes.

Length: 10.3 mm

The length contributes to a compact design, suitable for small electronic devices needing space-efficient components.

Maximum Output Current: 2 A

With a high maximum output current of 2 A, this driver can power devices effectively, enabling robust performance.

Technology: CMOS

Utilizing CMOS technology results in lower power consumption, contributing to energy efficiency and extended battery life.

Terminal Form: GULL WING

The gull-wing terminal form enhances PCB mounting stability and reliability.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V optimizes the device's performance in standard applications, making it user-friendly.

Turn-on Time: 20 us

Fast turn-on time of 20 µs allows for quick response in dynamic circuit applications.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm enables high packing density while maintaining solderability, suitable for modern PCBs.

Driver No. of Bits: 2

The 2-bit driver facilitates control over multiple outputs, enhancing functionality in a compact form.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that proper handling and storage can ensure reliability, while still allowing for some flexibility in manufacturing.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based peripheral driver allows for versatile interfacing capabilities with various logic levels.

Turn-off Time: 45 us

Turn-off time of 45 µs allows for efficient signal handling, catering to high-speed applications.

Output Current Flow Direction: SOURCE

The source output current flow direction allows for efficient driving configurations and optimized circuit design.

Technical Specifications

Peripheral Drivers VND5E050AK-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

45 us

Turn-on Time:

20 us

Width:

7.5 mm

Trade Compliance

VND5E050AK-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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