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VND5025LAKTR-E

STMicroelectronics

VND5025LAKTR-E by STMicroelectronics

VND5025LAKTR-E by STMicroelectronics is a CMOS peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and thermal issues. It features a compact 24-terminal design for efficient surface mounting. Ideal for automotive and industrial applications requiring reliable power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 5,442 parts In-Stock

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5,442

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Digiode

USA . 4,908 parts In-Stock

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4,908

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Vyrian

USA . 4,079 parts In-Stock

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4,079

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Anansix

USA . 360 parts In-Stock

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360

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,311 parts In-Stock

1+ parts

$6.221

100+ parts

-

1k+ parts

$5.599

10k+ parts

-

1,311

$6.221

-

$5.599

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AZTECH Wire

Italy . 997 parts In-Stock

1+ parts

$11.530

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-

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997

$11.530

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MKK Technologies

India . 534 parts In-Stock

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$11.698

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534

$11.698

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DigiPath Technology Company

USA . 534 parts In-Stock

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$11.698

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534

$11.698

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Component Stockers USA

USA . 686 parts In-Stock

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$99.990

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686

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 19,808 parts In-Stock

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19,808

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,659 parts In-Stock

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Microchip USA

USA . 5,962 parts In-Stock

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Corphita

USA . 4,903 parts In-Stock

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Parana Technologies

USA . 1,430 parts In-Stock

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$7.438

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1,430

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$7.438

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Metaverse IC Inc.

Canada . 473 parts In-Stock

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473

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Overview

Unlock unparalleled performance with the VND5025LAKTR-E from STMicroelectronics, a leader in high-quality semiconductor solutions. This advanced peripheral driver ensures reliable operation in diverse applications, from automotive systems to industrial controls. With built-in protections against overcurrent and voltage spikes, it guarantees durability and safety. Experience efficiency and peace of mind with this compact, robust solution that enhances your designs while simplifying integration.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides robustness and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on printed circuit boards and enhances the assembly process.

Maximum Supply Voltage: 36 V

The high maximum supply voltage enables compatibility with a wide range of systems and applications, offering flexibility in design.

Package Shape: RECTANGULAR

The rectangular package shape contributes to easier handling and is conducive for automated placement during manufacturing.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Integrated protections ensure the longevity and reliability of the device by shielding it from common electrical hazards.

Power Supplies (V): 8/36

Versatile power supply range allows use in both low-power and high-power applications, making it suitable for various systems.

No. of Terminals: 24

A higher number of terminals offers enhanced connectivity options, facilitating integration into complex circuits.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style is ideal for compact applications, saving space on PCBs.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage makes the product suitable for battery-powered and energy-efficient designs.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and reduces the risk of whisker growth, enhancing reliability in connections.

Terminal Position: DUAL

Dual terminal positioning allows for versatile design layouts, enabling better placement options on PCBs.

Maximum Seated Height: 2.22 mm

A low maximum seated height contributes to a slim profile, ideal for space-constrained applications.

Width: 7.5 mm

The compact width enhances space efficiency on the PCB, allowing for more components to be integrated.

Length: 10.3 mm

The length is balanced to optimize both performance and compactness, making it suitable for diverse uses.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it reliable for high-speed operations.

Terminal Form: GULL WING

Gull wing terminal form allows for easy visual inspection and facilitates automated assembly processes.

Nominal Supply Voltage: 13 V

The nominal supply voltage optimizes performance for various applications, providing reliable operation under standard conditions.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch facilitates high-density mounting, making it suitable for modern compact electronic designs.

Driver No. of Bits: 2

The 2-bit driver capability offers basic control for low-complexity applications, maintaining efficiency in design.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This type of IC allows for versatile interfacing with various peripherals, enhancing compatibility across devices.

Output Current Flow Direction: SOURCE

The source output current flow direction is effective for driving loads, making it a suitable choice for peripheral control.

Technical Specifications

Peripheral Drivers VND5025LAKTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.22 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VND5025LAKTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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