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VND5025BKTR-E

STMicroelectronics

VND5025BKTR-E by STMicroelectronics

VND5025BKTR-E by STMicroelectronics is a 2-function peripheral driver with built-in protections for transient, over current, over voltage, thermal, and under voltage. It operates at supply voltages ranging from 8V to 36V and can handle a max output current of 3A. This rectangular package with gull wing terminals is ideal for applications requiring sink output current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,054 parts In-Stock

1+ parts

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5,054

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Anansix

USA . 2,401 parts In-Stock

1+ parts

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2,401

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Digiode

USA . 1,003 parts In-Stock

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1,003

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 530 parts In-Stock

1+ parts

$2.958

100+ parts

-

1k+ parts

$2.662

10k+ parts

-

530

$2.958

-

$2.662

-

MKK Technologies

India . 1,004 parts In-Stock

1+ parts

$5.562

100+ parts

-

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-

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1,004

$5.562

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DigiPath Technology Company

USA . 1,004 parts In-Stock

1+ parts

$5.562

100+ parts

-

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1,004

$5.562

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-

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AZTECH Wire

Italy . 122 parts In-Stock

1+ parts

$10.450

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122

$10.450

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Microchip USA

USA . 2,614 parts In-Stock

1+ parts

$20.788

100+ parts

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2,614

$20.788

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Infinite Electronics LLP (Excess)

. 30,014 parts In-Stock

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30,014

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Kepictronics

USA . 22,260 parts In-Stock

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22,260

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Perfect Parts

USA . 3,317 parts In-Stock

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3,317

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A-Z Elektronik GmbH

Germany . 2,940 parts In-Stock

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2,940

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Assy Fe

Spain . 1,985 parts In-Stock

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1,985

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Parana Technologies

USA . 335 parts In-Stock

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$3.536

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335

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$3.536

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Corphita

USA . 69 parts In-Stock

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69

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Overview

Enhance your electronic projects with the VND5025BKTR-E from STMicroelectronics, a leading manufacturer known for their high-quality components. This peripheral driver offers built-in protections against transient, over current, over voltage, thermal, and under voltage issues, ensuring reliable performance. With a maximum output current of 3A and a wide supply voltage range of 4.5V to 36V, this compact device is perfect for a variety of applications. Trust in STMicroelectronics to deliver exceptional value and benefits to meet your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy installation and integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of power supply inputs, increasing its versatility.

No. of Functions: 2

Having multiple functions in one device can streamline the design process and reduce the number of components needed in a system.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and reliability of the connected peripherals, helping to prevent damage from various electrical faults.

Power Supplies (V): 8/36

Supporting a range of power supply voltages allows for compatibility with different systems and setups.

No. of Terminals: 24

Having a high number of terminals provides flexibility in connecting various peripheral devices.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline package style with a heat sink and shrink pitch design helps in efficient heat dissipation and space-saving on the PCB.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making the product versatile.

Terminal Position: DUAL

Dual terminal positions provide flexibility in mounting and connections, allowing for easier integration into different systems.

Maximum Seated Height: 2.45 mm

With a low maximum seated height, this peripheral driver can be used in compact designs where space is limited.

Width: 7.5 mm

The narrow width of the product allows for efficient use of space on the PCB, especially in densely packed designs.

Length: 10.3 mm

The compact length of the peripheral driver enables it to fit into tight spaces or crowded PCB layouts.

Maximum Output Current: 3 A

With a high maximum output current, this peripheral driver can handle power-hungry peripherals or components without overheating or malfunctioning.

Terminal Form: GULL WING

The gull wing terminal form makes soldering easier and more reliable, ensuring secure connections on the PCB.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13V provides a stable operating point for the peripheral driver, ensuring consistent and reliable performance.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for a high density of connections on the PCB, saving space and enabling complex circuit designs.

Driver No. of Bits: 2

Being a 2-bit driver allows for more precise control and communication with connected peripherals, enhancing performance and functionality.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based interface IC type ensures compatibility with a wide range of peripheral devices and control systems, simplifying integration.

Output Current Flow Direction: SINK

The output current sink capability allows the peripheral driver to efficiently control and power external devices, ensuring stable and reliable operation.

Technical Specifications

Peripheral Drivers VND5025BKTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

Length:

10.3 mm

No. of Functions:

2

No. of Terminals:

24

Output Current Flow Direction:

SINK

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

VND5025BKTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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