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VNB28N04TR-E

STMicroelectronics

VNB28N04TR-E by STMicroelectronics

VNB28N04TR-E by STMicroelectronics is a N-CHANNEL Power FET with 28A max drain current and 83W power dissipation. Ideal for applications requiring high power handling in enhancement mode operation, such as automotive systems and industrial controls.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,082 parts In-Stock

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6,082

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Digiode

USA . 1,743 parts In-Stock

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1,743

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Anansix

USA . 1,157 parts In-Stock

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ComSIT Distribution GmbH

Germany . 800 parts In-Stock

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800

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IDEA Electronic Components Group

UK . 1,490 parts In-Stock

1+ parts

$0.676

100+ parts

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$0.609

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1,490

$0.676

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$0.609

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MKK Technologies

India . 747 parts In-Stock

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$1.272

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747

$1.272

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DigiPath Technology Company

USA . 747 parts In-Stock

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$1.272

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747

$1.272

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Microchip USA

USA . 462 parts In-Stock

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$2.066

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462

$2.066

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AZTECH Wire

Italy . 809 parts In-Stock

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$22.130

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809

$22.130

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Component Stockers USA

USA . 614 parts In-Stock

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$99.990

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614

$99.990

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,864 parts In-Stock

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2,864

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Parana Technologies

USA . 845 parts In-Stock

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$0.808

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845

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$0.808

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Corphita

USA . 84 parts In-Stock

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Overview

Power up your projects with the VNB28N04TR-E by STMicroelectronics, a high-quality N-CHANNEL Power FET that offers exceptional performance and reliability. Designed with cutting-edge METAL-OXIDE SEMICONDUCTOR technology, this single configuration transistor can handle a maximum drain current of 28A and a power dissipation of 83W, making it ideal for a wide range of applications. From automotive to industrial uses, this enhancement mode transistor ensures efficiency and durability in every project. Experience the value and benefits of STMicroelectronics' expertise with the VNB28N04TR-E.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for high-power applications due to their efficient power handling capabilities.

Configuration: SINGLE

Single configuration FETs are generally easier to drive and control, making them suitable for simple circuit designs.

Surface Mount: YES

Surface mount FETs are compact and easy to integrate into modern electronics, saving space and simplifying assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs can be easily turned on and off, providing precise control over power flow in the circuit.

Maximum Drain Current: 28 A

With a high maximum drain current, this FET can handle heavy loads and high power applications effectively.

Maximum Power Dissipation: 83 W

The high maximum power dissipation allows this FET to operate efficiently under heavy loads without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-state resistance, making this FET ideal for high-performance applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high-temperature environments and operate reliably.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections in the circuit.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this FET has moderate sensitivity to moisture, making it suitable for standard manufacturing processes.

Maximum Time At Peak Reflow Temperature: 30s

With a maximum time of 30 seconds at peak reflow temperature, this FET can be effectively soldered onto circuit boards.

Peak Reflow Temperature: 245

A peak reflow temperature of 245 °C ensures proper soldering and reflow of this FET during manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) VNB28N04TR-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

28 A

Maximum Drain Current (ID):

28 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

VNB28N04TR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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