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VN920SOTR-E

STMicroelectronics

VN920SOTR-E by STMicroelectronics

VN920SOTR-E by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and output current up to 10A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,454

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-

-

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Anansix

USA . 1,533 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,533

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Digiode

USA . 296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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296

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,192 parts In-Stock

1+ parts

$7.866

100+ parts

-

1k+ parts

$7.079

10k+ parts

-

1,192

$7.866

-

$7.079

-

AZTECH Wire

Italy . 400 parts In-Stock

1+ parts

$11.750

100+ parts

-

1k+ parts

-

10k+ parts

-

400

$11.750

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-

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MKK Technologies

India . 2,314 parts In-Stock

1+ parts

$14.792

100+ parts

-

1k+ parts

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10k+ parts

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2,314

$14.792

-

-

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DigiPath Technology Company

USA . 2,314 parts In-Stock

1+ parts

$14.792

100+ parts

-

1k+ parts

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10k+ parts

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2,314

$14.792

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-

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Microchip USA

USA . 104 parts In-Stock

1+ parts

$54.268

100+ parts

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104

$54.268

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Corphita

USA . 802 parts In-Stock

1+ parts

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802

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Parana Technologies

USA . 700 parts In-Stock

1+ parts

-

100+ parts

$9.405

1k+ parts

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10k+ parts

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700

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$9.405

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Overview

Elevate your designs with the VN920SOTR-E from STMicroelectronics, a pinnacle of reliability in peripheral drivers. This compact powerhouse ensures robust performance with built-in protections against transient spikes, overcurrent, and thermal stress, making it ideal for demanding applications. With its trusted manufacturer heritage, you gain peace of mind and enhanced efficiency, empowering your projects to thrive in any environment while optimizing energy consumption and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for a compact design, enabling it to be easily integrated into modern electronic circuits with limited space.

Maximum Supply Voltage: 36 V

A high maximum supply voltage provides flexibility in applications, supporting a range of operating conditions and enhancing performance.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout and space utilization on PCBs, making it suitable for diverse applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections enhance reliability and safety, protecting the device and connected components from potential damage.

Power Supplies (V): 8/36

The versatile power supply range allows for compatibility with various system voltages, making it adaptable for different user needs.

No. of Terminals: 16

With 16 terminals, this part can provide multiple connections and functionalities, promoting design flexibility in complex circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes board space usage, making it ideal for compact electronic designs.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage allows for operation in low-power applications, enhancing energy efficiency.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish improves electrical performance and enhances solderability for reliable connections.

Terminal Position: DUAL

Dual terminal positioning allows for increased layout flexibility and easier routing on printed circuit boards.

Maximum Seated Height: 2.65 mm

A low maximum seated height contributes to a thinner overall profile, further enabling space-efficient designs.

Width: 7.5 mm

A compact width facilitates integration into space-constrained applications, enhancing overall design efficiency.

Length: 10.3 mm

The moderate length strikes a balance between functionality and compactness, making it versatile for a variety of applications.

Maximum Output Current: 10 A

Capable of delivering up to 10 A makes this driver suitable for high-power applications, ensuring reliable performance under load.

Terminal Form: GULL WING

The gull wing terminal form provides ease of soldering and improves mechanical strength, ensuring greater reliability in connections.

Nominal Supply Voltage: 13 V

The nominal voltage of 13 V offers an optimal balance for typical applications, ensuring stable performance without excessive heat generation.

Terminal Pitch: 1.27 mm

A standard terminal pitch improves compatibility with existing systems and simplifies PCB design and routing.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, allowing for standard handling procedures that are manageable in production.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This interface IC type supports a broad range of applications, making it suitable for both general and specialized uses.

Output Current Flow Direction: SOURCE

The output current flow direction as source is ideal for driving loads, optimizing performance in peripheral applications.

Technical Specifications

Peripheral Drivers VN920SOTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Output Current Flow Direction:

SOURCE

Maximum Output Current:

10 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VN920SOTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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