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VN750(012Y)

STMicroelectronics

VN750(012Y) by STMicroelectronics

VN750(012Y) by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and supports output peak currents up to 9A. It features built-in protections against transient, overcurrent, and thermal issues. Ideal for applications requiring reliable power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,072 parts In-Stock

1+ parts

-

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8,072

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Digiode

USA . 2,744 parts In-Stock

1+ parts

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2,744

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Anansix

USA . 1,704 parts In-Stock

1+ parts

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1,704

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 181 parts In-Stock

1+ parts

$2.793

100+ parts

-

1k+ parts

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181

$2.793

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IDEA Electronic Components Group

UK . 293 parts In-Stock

1+ parts

$11.724

100+ parts

-

1k+ parts

$10.552

10k+ parts

-

293

$11.724

-

$10.552

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AZTECH Wire

Italy . 982 parts In-Stock

1+ parts

$17.080

100+ parts

-

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982

$17.080

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-

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Ampacity Inc.

Singapore . 1,257 parts In-Stock

1+ parts

$20.500

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1,257

$20.500

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MKK Technologies

India . 1,631 parts In-Stock

1+ parts

$22.047

100+ parts

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10k+ parts

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1,631

$22.047

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-

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DigiPath Technology Company

USA . 1,631 parts In-Stock

1+ parts

$22.047

100+ parts

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10k+ parts

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1,631

$22.047

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Corphita

USA . 2,986 parts In-Stock

1+ parts

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2,986

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

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350

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Parana Technologies

USA . 217 parts In-Stock

1+ parts

-

100+ parts

$14.018

1k+ parts

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217

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$14.018

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Overview

Elevate your designs with the VN750(012Y) from STMicroelectronics, a leader in innovative semiconductor solutions. This robust peripheral driver ensures reliability with built-in protections against transient spikes, overcurrent, and thermal stress, making it ideal for diverse applications like automotive systems and industrial automation. Experience peace of mind and superior performance, knowing you’re backed by ST's commitment to quality and innovation—fueling your projects with efficiency and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robustness and reliability, making the product suitable for various applications.

Maximum Supply Voltage: 36 V

A maximum supply voltage of 36 V allows this peripheral driver to handle a wide range of applications requiring higher voltages.

Package Shape: RECTANGULAR

The rectangular shape is ideal for efficient space utilization on PCBs, facilitating easier integration into different designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections enhance the safety and reliability of the device, reducing the risk of damage under adverse conditions.

No. of Terminals: 5

With 5 terminals, this product offers flexibility in connectivity, making it versatile for various circuit designs.

Package Style (Meter): FLANGE MOUNT

The flange mount package style ensures secure installation, providing stability and ease of handling in different environments.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage allows this peripheral driver to operate efficiently in diverse applications without requiring excessive power.

Terminal Position: ZIG-ZAG

The zig-zag terminal arrangement optimizes circuit layout and simplifies PCB design for improved manufacturability.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and reliable electrical connections, ideal for heavy-duty usage.

Nominal Supply Voltage: 13 V

Operating at a nominal supply voltage of 13 V ensures a balance of performance and efficiency, suitable for typical peripheral applications.

Nominal Output Peak Current Limit: 9 A

A peak output current limit of 9 A allows for high current applications, making this driver capable of powering demanding peripheral devices.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based design offers better signal integrity and enhanced performance for interfacing with peripheral devices.

Output Current Flow Direction: SOURCE

As a current source driver, this product effectively supplies power to connected components, ensuring optimal performance throughout operation.

Technical Specifications

Peripheral Drivers VN750(012Y) attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PZFM-T5

No. of Functions:

1

No. of Terminals:

5

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

NO

Terminal Form:

Terminal Position:

ZIG-ZAG

Trade Compliance

VN750(012Y) Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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