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VN750PEP

STMicroelectronics

VN750PEP by STMicroelectronics

VN750PEP by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 36V and supports output currents up to 2A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 4,059 parts In-Stock

1+ parts

-

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1k+ parts

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10k+ parts

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4,059

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Anansix

USA . 2,582 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,582

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-

-

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Vyrian

USA . 1,554 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,554

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Digiode

USA . 716 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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716

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 741 parts In-Stock

1+ parts

$2.639

100+ parts

-

1k+ parts

$2.376

10k+ parts

-

741

$2.639

-

$2.376

-

MKK Technologies

India . 2,293 parts In-Stock

1+ parts

$4.963

100+ parts

-

1k+ parts

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10k+ parts

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2,293

$4.963

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DigiPath Technology Company

USA . 2,293 parts In-Stock

1+ parts

$4.963

100+ parts

-

1k+ parts

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10k+ parts

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2,293

$4.963

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Parana Technologies

USA . 2,110 parts In-Stock

1+ parts

-

100+ parts

$3.156

1k+ parts

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2,110

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$3.156

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Corphita

USA . 1,638 parts In-Stock

1+ parts

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100+ parts

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1,638

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Overview

Experience unparalleled reliability with the VN750PEP from STMicroelectronics, a leading name in innovative semiconductor solutions. This advanced peripheral driver guarantees robust performance across a variety of applications, from automotive to industrial control systems. With built-in protections against transients, overcurrent, and thermal issues, it ensures your designs are safe and efficient, maximizing value and performance while minimizing downtime. Elevate your projects with ST's commitment to quality and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing plastic/epoxy for packaging ensures durability and resistance against environmental factors, making this peripheral driver reliable for various applications.

Surface Mount: YES

Surface mount technology allows for easier and more compact PCB designs, facilitating high-density circuit integration.

Maximum Supply Voltage: 36 V

A high maximum supply voltage capability enhances the versatility of this driver, supporting a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on PCBs, helping designers achieve efficient layouts.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure the device's longevity and reliability under varying electrical conditions.

Power Supplies (V): 8/36

Support for a broad range of power supplies allows greater flexibility in system design and integration.

No. of Terminals: 12

With 12 terminals, this device offers multiple connectivity options, enhancing its versatility in implementation.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

The low-profile design reduces space requirements while effectively managing heat, which is ideal for compact electronic devices.

Minimum Supply Voltage: 5.5 V

A lower minimum supply voltage makes this product suitable for battery-operated devices and energy-efficient applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good solderability and reliable connections, which are crucial for electronic performance.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options, making integration into various designs more flexible.

Maximum Seated Height: 1.62 mm

A low seated height is beneficial for space-constrained designs, making it perfect for modern, slim devices.

Width: 3.9 mm

A compact width helps optimize board space, allowing designers to fit more components into their designs.

Length: 4.9 mm

Short length combined with low profile makes this driver ideal for compact applications without compromising functionality.

Maximum Output Current: 2 A

A maximum output current of 2 A provides ample power for driving peripherals, ensuring compatibility with various devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly, reducing manufacturing complexity.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V provides an optimal operational range for consistent performance in typical applications.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for tighter layouts and component density, making it suitable for advanced electronic designs.

Nominal Output Peak Current Limit: 9 A

The capability to handle a peak output current of 9 A makes this driver suitable for demanding applications requiring high transient currents.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter-based driver offers flexibility in applications, catering to different output needs.

Output Current Flow Direction: SOURCE

Output current flowing in the source direction is advantageous for driving connected devices directly from the driver.

Technical Specifications

Peripheral Drivers VN750PEP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

12

Output Current Flow Direction:

SOURCE

Maximum Output Current:

2 A

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP12,.25,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

1.62 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

VN750PEP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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