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VN7140AS-E

STMicroelectronics

VN7140AS-E by STMicroelectronics

STMicroelectronics' VN7140AS-E is a peripheral driver with 8 terminals, operating b/w 4-28V. It offers built-in protections against transient, over/under voltage, current & thermal issues. With a compact rectangular shape and sink output current flow direction, it's ideal for buffer or inverter-based interface IC applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,807 parts In-Stock

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3,807

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Digiode

USA . 3,168 parts In-Stock

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3,168

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Anansix

USA . 784 parts In-Stock

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784

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 66 parts In-Stock

1+ parts

$6.951

100+ parts

-

1k+ parts

$6.256

10k+ parts

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66

$6.951

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$6.256

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AZTECH Wire

Italy . 210 parts In-Stock

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$8.260

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210

$8.260

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$8.857

100+ parts

$8.060

1k+ parts

$7.263

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20

$8.857

$8.060

$7.263

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Microchip USA

USA . 2,056 parts In-Stock

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$9.700

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2,056

$9.700

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MKK Technologies

India . 1,957 parts In-Stock

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$13.070

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1,957

$13.070

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DigiPath Technology Company

USA . 1,957 parts In-Stock

1+ parts

$13.070

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1,957

$13.070

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Component Stockers USA

USA . 312 parts In-Stock

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$99.990

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312

$99.990

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Corphita

USA . 4,961 parts In-Stock

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4,961

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Parana Technologies

USA . 1,732 parts In-Stock

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$8.310

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1,732

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$8.310

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Overview

STMicroelectronics presents the VN7140AS-E, a high-quality peripheral driver designed to meet the demanding requirements of various applications. With built-in protections against transient, over current, over voltage, thermal, and under voltage conditions, this product ensures enhanced safety and reliability. Perfect for a wide range of electronic devices, the VN7140AS-E offers customers exceptional value, efficiency, and performance. Trust STMicroelectronics for innovative solutions that deliver superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving valuable space in the design.

Maximum Supply Voltage: 28 V

The high maximum supply voltage of 28V makes the product suitable for a wide range of applications, providing flexibility in design.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The multiple built-in protections ensure the safety and reliability of the product, protecting it from various electrical faults and environmental conditions.

No. of Terminals: 8

With 8 terminals, the product offers versatile connectivity options, allowing for easy integration into different circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making the product suitable for compact designs or applications with limited board space.

Minimum Supply Voltage: 4 V

The low minimum supply voltage requirement of 4V enables the product to operate efficiently even with low power sources.

Terminal Position: DUAL

The dual terminal position provides flexibility in connecting the product to external components, enhancing the product's compatibility with different circuit layouts.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm allows for a slim profile, making the product suitable for applications with height constraints.

Width: 3.9 mm

The compact width of 3.9mm enables the product to fit into tight spaces on the PCB, contributing to efficient board layout.

Length: 4.9 mm

The short length of 4.9mm further contributes to space-saving design, ideal for applications where board real estate is limited.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections to the PCB, ensuring stable performance even in demanding operating conditions.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13V offers a stable operating range for the product, ensuring consistent performance under varying voltage conditions.

Turn-on Time: 120 us

The quick turn-on time of 120us ensures rapid response of the product, making it suitable for applications requiring fast switching or activation.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm allows for high density mounting on the PCB, enabling compact and efficient circuit designs.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The versatile interface IC type enables the product to work as a buffer or inverter based peripheral driver, offering flexibility in signal processing and control applications.

Turn-off Time: 100 us

The fast turn-off time of 100us ensures quick deactivation of the product, enhancing efficiency in applications requiring rapid switching or response.

Output Current Flow Direction: SINK

The sink output current flow direction allows the product to efficiently control external loads by sinking current, making it suitable for driving various types of components in a circuit.

Technical Specifications

Peripheral Drivers VN7140AS-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

100 us

Turn-on Time:

120 us

Width:

3.9 mm

Trade Compliance

VN7140AS-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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