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VN460SP

STMicroelectronics

VN460SP by STMicroelectronics

STMicroelectronics' VN460SP is a MOS technology-based peripheral driver with 10 terminals and built-in protections. It operates at supply voltages ranging from 5.5V to 36V, providing a max output current of 5A in sink direction. This small outline package is ideal for applications requiring overcurrent, overvoltage, thermal, and undervoltage protection.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,109 parts In-Stock

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10,109

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Digiode

USA . 755 parts In-Stock

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755

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Anansix

USA . 509 parts In-Stock

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509

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LIBRA Elektronik GmbH

Germany . 100 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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1

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Distributors (Availability)

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Microchip USA

USA . 270 parts In-Stock

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$6.208

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270

$6.208

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IDEA Electronic Components Group

UK . 642 parts In-Stock

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$6.625

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$5.962

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642

$6.625

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$5.962

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AZTECH Wire

Italy . 1,207 parts In-Stock

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$9.150

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$9.150

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MKK Technologies

India . 738 parts In-Stock

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$12.458

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738

$12.458

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DigiPath Technology Company

USA . 738 parts In-Stock

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$12.458

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738

$12.458

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Component Stockers USA

USA . 285 parts In-Stock

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$99.990

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$99.990

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 3,191 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,342 parts In-Stock

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Parana Technologies

USA . 283 parts In-Stock

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$7.921

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Kepictronics

USA . 99 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of precision and reliability with the VN460SP by STMicroelectronics. Designed with cutting-edge technology, this peripheral driver offers built-in protections against over current, over voltage, thermal issues, and under voltage, ensuring optimal performance and safety. From automotive to industrial applications, this versatile product provides seamless integration and high-quality output, making it an essential component for your projects. Experience the unmatched value and benefits that only STMicroelectronics can deliver with the VN460SP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety of the connected components and prevent damage from overloads or voltage spikes, making the product reliable and long-lasting.

Maximum Output Current: 5 A

With a maximum output current of 5 A, this peripheral driver can handle a wide range of devices and peripherals, making it versatile and suitable for various applications.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13 V allows compatibility with a range of power sources, making the product flexible and easy to integrate into different systems.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver provides flexibility in signal conversion and processing, making the product suitable for a variety of input/output configurations.

Technical Specifications

Peripheral Drivers VN460SP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SINK

Maximum Output Current:

5 A

Nominal Output Peak Current Limit:

5.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5.5/36

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

1500 us

Turn-on Time:

250 us

Width:

7.5 mm

Trade Compliance

VN460SP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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