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VN460SP13TR

STMicroelectronics

VN460SP13TR by STMicroelectronics

VN460SP13TR by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and can handle output currents up to 5A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,318 parts In-Stock

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7,318

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Anansix

USA . 1,274 parts In-Stock

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1,274

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Digiode

USA . 166 parts In-Stock

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166

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

XScomponents

USA . 600 parts In-Stock

1+ parts

$1.500

100+ parts

-

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600

$1.500

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Microchip USA

USA . 330 parts In-Stock

1+ parts

$5.366

100+ parts

-

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330

$5.366

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IDEA Electronic Components Group

UK . 1,826 parts In-Stock

1+ parts

$9.083

100+ parts

-

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$8.175

10k+ parts

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1,826

$9.083

-

$8.175

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AZTECH Wire

Italy . 117 parts In-Stock

1+ parts

$9.880

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117

$9.880

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MKK Technologies

India . 1,937 parts In-Stock

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$17.080

100+ parts

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1,937

$17.080

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DigiPath Technology Company

USA . 1,937 parts In-Stock

1+ parts

$17.080

100+ parts

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1,937

$17.080

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A-Z Elektronik GmbH

Germany . 6,081 parts In-Stock

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6,081

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Corphita

USA . 2,478 parts In-Stock

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2,478

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Parana Technologies

USA . 1,985 parts In-Stock

1+ parts

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100+ parts

$10.860

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1,985

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$10.860

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Overview

Elevate your designs with the VN460SP13TR from STMicroelectronics, a leader in innovative semiconductor solutions. This robust peripheral driver stands out for its exceptional reliability and built-in protections against overcurrent, overvoltage, and thermal risks. Ideal for automotive and industrial applications, it ensures seamless performance while simplifying circuit design. Experience peace of mind and superior quality that only STMicroelectronics can deliver, enhancing your projects' efficiency and longevity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity, making it an excellent choice for various applications.

Surface Mount: YES

Surface mount technology allows for compact design, facilitating space-saving layouts on PCBs.

Maximum Supply Voltage: 36 V

The high maximum supply voltage enables versatility in use across different voltage applications.

Package Shape: RECTANGULAR

The rectangular shape is optimized for efficient layout and integration into electronic systems.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Integrated protection features enhance reliability and safety, reducing the risk of damage.

Power Supplies (V): 5.5/36

Wide range of supply voltage allows this driver to be compatible with various power sources.

No. of Terminals: 10

The availability of multiple terminals offers flexibility for multiple connections and configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in minimizing space on the PCB while maximizing functionality.

Minimum Supply Voltage: 5.5 V

Low minimum voltage requirement enhances compatibility with low-power applications.

Terminal Finish: TIN

Tin finish on terminals provides good solderability and resistance to oxidation.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in layout design and enhances ease of installation.

Maximum Seated Height: 3.75 mm

Low seated height is ideal for applications where vertical space is limited.

Width: 7.5 mm

Compact width allows for easy integration into tight spaces within electronic designs.

Length: 9.4 mm

Short length contributes to the overall compactness, making it suitable for space-sensitive applications.

Maximum Output Current: 5 A

High output current capability ensures the driver can handle demanding loads efficiently.

Technology: MOS

MOS technology offers fast switching speeds and high efficiency, resulting in better performance.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide robust connections, enhancing reliability.

Nominal Supply Voltage: 13 V

Optimized nominal voltage allows for ideal performance within typical application ranges.

Turn-on Time: 250 us

Fast turn-on time enhances responsiveness in applications, making it suitable for dynamic use cases.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy alignment and mounting on PCBs.

Nominal Output Peak Current Limit: 5.4 A

Peak current limit demonstrates capability for handling brief high-load demands without failure.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter driver, it provides excellent signal integrity and control in peripheral applications.

Turn-off Time: 1500 us

Moderate turn-off time allows for adequate control in timing-critical applications.

Output Current Flow Direction: SINK

The sink output current flow is ideal for driving loads that require a grounded connection.

Technical Specifications

Peripheral Drivers VN460SP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SINK

Maximum Output Current:

5 A

Nominal Output Peak Current Limit:

5.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5.5/36

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

1500 us

Turn-on Time:

250 us

Width:

7.5 mm

Trade Compliance

VN460SP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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