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VN16B

STMicroelectronics

VN16B by STMicroelectronics

VN16B by STMicroelectronics is a robust peripheral driver with a max supply voltage of 26V and operates in extreme temps from -40 °C to 125 °C. It features built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for automotive applications, it ensures reliable performance with a turn-on/off time of just 500µs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,426 parts In-Stock

1+ parts

-

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7,426

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Lantek

USA . 6,950 parts In-Stock

1+ parts

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6,950

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Digiode

USA . 4,293 parts In-Stock

1+ parts

-

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4,293

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Lakeland Logistics Inc

USA . 4,205 parts In-Stock

1+ parts

-

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4,205

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Bristol Electronics

USA . 4,200 parts In-Stock

1+ parts

-

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4,200

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Anansix

USA . 1,936 parts In-Stock

1+ parts

-

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1,936

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,816 parts In-Stock

1+ parts

$2.362

100+ parts

-

1k+ parts

$2.125

10k+ parts

-

1,816

$2.362

-

$2.125

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Microchip USA

USA . 441 parts In-Stock

1+ parts

$3.690

100+ parts

-

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441

$3.690

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-

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MKK Technologies

India . 891 parts In-Stock

1+ parts

$4.441

100+ parts

-

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891

$4.441

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DigiPath Technology Company

USA . 891 parts In-Stock

1+ parts

$4.441

100+ parts

-

1k+ parts

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10k+ parts

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891

$4.441

-

-

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AZTECH Wire

Italy . 455 parts In-Stock

1+ parts

$9.070

100+ parts

-

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455

$9.070

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Corphita

USA . 4,422 parts In-Stock

1+ parts

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4,422

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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4,000

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Parana Technologies

USA . 2,287 parts In-Stock

1+ parts

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100+ parts

$2.824

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2,287

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$2.824

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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Kepictronics

USA . 600 parts In-Stock

1+ parts

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600

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Assy Fe

Spain . 34 parts In-Stock

1+ parts

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34

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Overview

Elevate your design with the VN16B from STMicroelectronics—a robust peripheral driver built for performance and reliability. With advanced built-in protections against overcurrent and thermal issues, this component ensures your applications run smoothly under challenging conditions. Trusted in automotive environments, its quality craftsmanship guarantees longevity and efficiency. Experience seamless integration and enhanced functionality while enjoying peace of mind with ST's industry-leading expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides robust protection against environmental factors, ensuring the reliability of the peripheral driver.

Maximum Supply Voltage: 26 V

A high maximum supply voltage allows for versatility in various applications, making it suitable for higher voltage environments.

Package Shape: RECTANGULAR

The rectangular shape is a common and efficient design, facilitating easy integration into existing systems.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Multiple built-in protections enhance the safety and longevity of the device by preventing damage under adverse conditions.

No. of Terminals: 5

Five terminals provide ample connection points for flexibility in circuit design and easy integration with other components.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers stable mounting options, ensuring a secure fit in various applications.

Minimum Supply Voltage: 6 V

A low minimum supply voltage broadens the scope of compatibility, making it ideal for low-voltage applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in heated environments, suitable for many automotive applications.

Minimum Operating Temperature: -40 °C

The ability to function at extremely low temperatures makes this peripheral driver well-suited for harsh environmental conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides good corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning facilitates easier soldering and connections, streamlining assembly processes.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this component meets strict industry standards for durability and performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for secure mounting and robust connections, enhancing the reliability of installations.

Nominal Supply Voltage: 13 V

With a nominal supply voltage close to automotive standards, this driver is optimized for vehicle electronic systems.

Turn-on Time: 500 us

A rapid turn-on time ensures quick response in dynamic applications, improving overall system efficiency.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based driver provides greater flexibility in interfacing with various signal types in numerous applications.

Turn-off Time: 500 us

Fast turn-off time enhances performance in time-sensitive applications by reducing delay in signal processing.

Output Current Flow Direction: SOURCE

The source output current flow direction is beneficial for driving loads effectively, ensuring optimal power management.

Technical Specifications

Peripheral Drivers VN16B attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PZFM-T5

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

13 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

ZIG-ZAG

Turn-off Time:

500 us

Turn-on Time:

500 us

Trade Compliance

VN16B Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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