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VN16B-E

STMicroelectronics

VN16B-E by STMicroelectronics

STMicroelectronics' VN16B-E is a 5-terminal peripheral driver with 8/16V power supplies and 20A max output current. Its rectangular plastic/epoxy package style in-line shape makes it suitable for various applications requiring high current switching capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,394 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,394

-

-

-

-

Anansix

USA . 427 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

427

-

-

-

-

Digiode

USA . 409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

409

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,715 parts In-Stock

1+ parts

$8.665

100+ parts

-

1k+ parts

$7.798

10k+ parts

-

1,715

$8.665

-

$7.798

-

Microchip USA

USA . 219 parts In-Stock

1+ parts

$14.313

100+ parts

-

1k+ parts

-

10k+ parts

-

219

$14.313

-

-

-

MKK Technologies

India . 2,180 parts In-Stock

1+ parts

$16.293

100+ parts

-

1k+ parts

-

10k+ parts

-

2,180

$16.293

-

-

-

DigiPath Technology Company

USA . 2,180 parts In-Stock

1+ parts

$16.293

100+ parts

-

1k+ parts

-

10k+ parts

-

2,180

$16.293

-

-

-

Kepictronics

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,000

-

-

-

-

Corphita

USA . 2,688 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,688

-

-

-

-

Parana Technologies

USA . 856 parts In-Stock

1+ parts

-

100+ parts

$10.360

1k+ parts

-

10k+ parts

-

856

-

$10.360

-

-

Overview

Unlock the power of precision and reliability with the VN16B-E peripheral driver by STMicroelectronics. Crafted with top-quality materials and advanced engineering, this product offers a seamless experience for a wide range of applications. Whether you're in the automotive, industrial, or consumer electronics industry, the VN16B-E delivers exceptional performance with its high output current and versatile terminal design. Trust STMicroelectronics to provide you with the best-in-class solutions for your driving needs. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, making the product long-lasting and resistant to wear and tear.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into various electronic devices or systems.

Power Supplies (V): 8/16

Support for multiple power supply options (8V/16V) offers flexibility in different operating environments or requirements.

No. of Terminals: 5

Having 5 terminals enables connection to multiple devices or components, enhancing functionality and versatility.

Package Style (Meter): IN-LINE

The in-line package style ensures easy installation and space-saving design for efficient use of limited space in electronic setups.

Terminal Position: ZIG-ZAG

Zig-zag terminal position layout helps in reducing signal interference and provides a more organized connection setup.

Maximum Output Current: 20 A

With a maximum output current of 20A, this peripheral driver can efficiently power high-current devices or components without overheating or performance issues.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure and reliable connections to the circuit board, reducing the risk of loose connections or signal interruptions.

Terminal Pitch: 1.7 mm

The 1.7mm terminal pitch allows for precise and compact PCB layout, maximizing board space efficiency and ease of assembly.

Technical Specifications

Peripheral Drivers VN16B-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PZIP-T5

No. of Terminals:

5

Maximum Output Current:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP5,.15,.2,67TB

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

8/16

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

NO

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

VN16B-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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