Loading...

VN16B(012Y)

STMicroelectronics

VN16B(012Y) by STMicroelectronics

VN16B(012Y) by STMicroelectronics is a robust peripheral driver with a max supply voltage of 26V and an output current of 8.8A. It features built-in protections against overcurrent, thermal issues, and undervoltage. Ideal for automotive applications, it operates in extreme temperatures from -40 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,022

-

-

-

-

Vyrian

USA . 3,486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,486

-

-

-

-

Anansix

USA . 877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

877

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,892 parts In-Stock

1+ parts

$13.756

100+ parts

-

1k+ parts

$12.380

10k+ parts

-

1,892

$13.756

-

$12.380

-

MKK Technologies

India . 1,056 parts In-Stock

1+ parts

$25.867

100+ parts

-

1k+ parts

-

10k+ parts

-

1,056

$25.867

-

-

-

DigiPath Technology Company

USA . 1,056 parts In-Stock

1+ parts

$25.867

100+ parts

-

1k+ parts

-

10k+ parts

-

1,056

$25.867

-

-

-

Corphita

USA . 3,327 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,327

-

-

-

-

Parana Technologies

USA . 748 parts In-Stock

1+ parts

-

100+ parts

$16.447

1k+ parts

-

10k+ parts

-

748

-

$16.447

-

-

Overview

Elevate your projects with the VN16B(012Y) from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for robust performance in automotive applications, this reliable peripheral driver ensures optimal safety with built-in protections against overcurrent, thermal issues, and undervoltage. With a broad voltage range and exceptional temperature resilience, it guarantees efficiency and longevity, empowering you to drive your designs forward with confidence and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making this peripheral driver suitable for various applications.

Maximum Supply Voltage: 26 V

A maximum supply voltage of 26 V allows for versatile application in systems requiring higher voltage levels, providing flexibility in design.

Package Shape: RECTANGULAR

The rectangular shape helps optimize space on printed circuit boards (PCBs), allowing for efficient layout and design.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protection features ensure greater reliability and safety for the device and the systems it operates within, reducing the risk of failure.

Power Supplies (V): 8/16

Dual voltage options of 8V and 16V enhance versatility, allowing for compatibility with a wider range of applications.

No. of Terminals: 5

Having 5 terminals provides adequate connectivity options for various configurations, simplifying design integration.

Package Style (Meter): FLANGE MOUNT

Flange mount design facilitates secure mounting, helping to ensure stable operation in potentially vibration-prone environments.

Minimum Supply Voltage: 6 V

A low minimum supply voltage of 6V enables operation in systems with limited power budgets, making it an efficient choice.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product is well-suited for high-temperature environments, ensuring reliable performance under stress.

Minimum Operating Temperature: -40 °C

The capability to function in extreme low temperatures (-40 °C) makes this peripheral driver ideal for automotive and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good solderability and corrosion resistance, enhancing the longevity of the device.

Terminal Position: SINGLE

Single terminal position simplifies the design, making it easier for engineers to integrate this driver into existing systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this driver meets stringent automotive standards for reliability and performance in demanding conditions.

Maximum Output Current: 8.8 A

A high output current of 8.8 A allows this driver to effectively handle demanding loads, making it suitable for various high-power applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal configuration provides increased mechanical stability, beneficial in high-stress applications.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13V is optimal for automotive applications, aligning with standard vehicle electrical systems.

Turn-on Time: 500 us

A quick turn-on time of 500 microseconds allows for fast response in applications requiring immediate power delivery.

Terminal Pitch: 1.7 mm

A terminal pitch of 1.7 mm provides adequate spacing for easy soldering and reliable connections on PCBs.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter-based design enhances signal integrity, allowing for reliable operation in digital interfacing applications.

Turn-off Time: 500 us

A turn-off time of 500 microseconds ensures swift cessation of output, which is critical for protecting downstream components.

Output Current Flow Direction: SOURCE

The SOURCE current flow direction enables compatibility with a wide range of application demands, enhancing design flexibility.

Technical Specifications

Peripheral Drivers VN16B(012Y) attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PSFM-T5

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

8.8 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP5,.1,67TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

8/16

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

13 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Turn-off Time:

500 us

Turn-on Time:

500 us

Trade Compliance

VN16B(012Y) Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 8