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UPSD3454EVB40T6

STMicroelectronics

UPSD3454EVB40T6 by STMicroelectronics

UPSD3454EVB40T6 from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 40 MHz. It features 32KB RAM, 262144 ROM, and supports ADC/PWM channels. Ideal for industrial applications requiring robust performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,003 parts In-Stock

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5,003

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Digiode

USA . 3,896 parts In-Stock

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3,896

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Anansix

USA . 1,441 parts In-Stock

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1,441

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Distributors (Availability)

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AZTECH Wire

Italy . 1,192 parts In-Stock

1+ parts

$10.380

100+ parts

-

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1,192

$10.380

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Microchip USA

USA . 205 parts In-Stock

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$13.080

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205

$13.080

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IDEA Electronic Components Group

UK . 2,143 parts In-Stock

1+ parts

$38.823

100+ parts

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$34.941

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2,143

$38.823

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$34.941

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MKK Technologies

India . 1,535 parts In-Stock

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$73.004

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1,535

$73.004

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DigiPath Technology Company

USA . 1,535 parts In-Stock

1+ parts

$73.004

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1,535

$73.004

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Vigor

Singapore . 2,494 parts In-Stock

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2,494

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Parana Technologies

USA . 1,711 parts In-Stock

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$46.419

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1,711

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$46.419

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Corphita

USA . 623 parts In-Stock

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623

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Overview

Unlock endless possibilities in your designs with the UPSD3454EVB40T6 microcontroller by STMicroelectronics. Known for their commitment to quality and innovation, STMicroelectronics delivers a powerful solution tailored for industrial applications. This versatile microcontroller ensures reliable performance even in extreme conditions, providing superior power efficiency and programmability. Elevate your projects with a trusted partner that empowers creativity and enhances productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures the microcontroller can withstand various environmental conditions, making it reliable for diverse applications.

Surface Mount: YES

Surface mount technology allows for compact designs and better integration with modern PCB layouts, optimizing space in electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V is suitable for low-power applications, enhancing energy efficiency.

Package Shape: SQUARE

The square package shape provides uniform thermal distribution and space-efficient layout for circuit boards.

Bit Size: 8

The 8-bit architecture makes this microcontroller appropriate for simple control tasks and easy integration in basic embedded systems.

Power Supplies (V): 3.3

Operating at 3.3V is standard for low-power applications, making it compatible with a variety of sensors and devices.

No. of Terminals: 52

Having 52 terminals allows for ample connectivity options, supporting a wide range of peripherals and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

Low-profile flatpack design is advantageous for applications where height reduction is critical, enabling sleek product designs.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V ensures compatibility with battery-powered applications, extending device runtime.

Maximum Operating Temperature: 85 °C

An operating temperature limit of 85 °C is suitable for industrial applications where devices may be subject to high ambient temperatures.

CPU Family: 8051

The 8051 CPU family is well-established and widely supported, ensuring a wealth of resources and libraries for developers.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is ideal for extreme environments, such as automotive or outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances the product's longevity and reliability by providing excellent resistance to corrosion.

ADC Channels: YES

Inclusion of ADC channels allows for direct interfacing with analog sensors, making it versatile for various applications.

Terminal Position: QUAD

Quad terminal position optimizes connection density and enhances the layout capabilities on a PCB.

ROM Words: 262144

With 262144 ROM words available, the microcontroller can support complex applications and firmware.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm contributes to space-efficient designs, crucial in compact electronics.

Width: 10 mm

A width of 10 mm allows for effective integration into a variety of small-form-factor devices.

Maximum Clock Frequency: 40 MHz

The 40 MHz clock frequency enables fast processing capabilities, making it suitable for responsive applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature indicates reliability during the manufacturing process, reducing defects.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows compatibility with a variety of soldering processes and materials.

Length: 10 mm

A compact length of 10 mm enables integrated solutions in constrained spaces.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this microcontroller is specifically designed for robust and demanding environments.

Peripheral IC Type: MICROCONTROLLER

Classified as a microcontroller, this device integrates processing and control functions in one chip, simplifying design.

RAM Bytes: 32768

With 32,768 bytes of RAM, this microcontroller efficiently handles data in real-time applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form factor allows for easy soldering and enhanced thermal performance during operation.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V aligns with many modern electronic components, ensuring wide compatibility.

PWM Channels: YES

The inclusion of PWM channels allows for efficient control of motors and other actuators, enhancing functionality.

ROM Programmability: FLASH

Flash ROM programmability allows users to easily update and modify code, adapting to changing requirements.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm efficiently utilizes space on PCBs, ideal for densely packed electronics.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates reasonable robustness against moisture, suitable for storage and handling in typical manufacturing environments.

Speed: 40 rpm

With a speed of 40 rpm, this microcontroller is adaptable for applications involving speed control and automation.

No. of I/O Lines: 35

Having 35 I/O lines enhances the flexibility and expandability of the system, allowing multiple peripherals to be connected.

Technical Specifications

Microcontrollers UPSD3454EVB40T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

35

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

UPSD3454EVB40T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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