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UPSD3454E-40U6

STMicroelectronics

UPSD3454E-40U6 by STMicroelectronics

UPSD3454E-40U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features 80 terminals, supports ADC and PWM channels, making it ideal for industrial applications requiring robust performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,234 parts In-Stock

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Anansix

USA . 2,616 parts In-Stock

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2,616

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Digiode

USA . 2,427 parts In-Stock

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2,427

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Distributors (Availability)

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Microchip USA

USA . 475 parts In-Stock

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$1.000

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475

$1.000

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AZTECH Wire

Italy . 748 parts In-Stock

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$13.970

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748

$13.970

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IDEA Electronic Components Group

UK . 2,276 parts In-Stock

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$79.562

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$71.605

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2,276

$79.562

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$71.605

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MKK Technologies

India . 1,922 parts In-Stock

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$149.610

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1,922

$149.610

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DigiPath Technology Company

USA . 1,922 parts In-Stock

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$149.610

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1,922

$149.610

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QUARKTWIN TECHNOLOGY LTD

USA . 21,738 parts In-Stock

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Corphita

USA . 2,914 parts In-Stock

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2,914

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Vigor

Singapore . 1,549 parts In-Stock

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1,549

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Parana Technologies

USA . 1,310 parts In-Stock

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$95.128

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$95.128

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Overview

Elevate your projects with the UPSD3454E-40U6 microcontroller from STMicroelectronics, a leader in quality and innovation. Engineered for versatility, this compact powerhouse delivers exceptional performance across various applications, from industrial automation to consumer electronics. With enhanced power efficiency and robust reliability, it empowers developers to create cutting-edge solutions that stand out in today's competitive landscape. Choose STMicroelectronics for unparalleled support and expertise, ensuring your success every step of the way!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides protection against environmental factors.

Surface Mount: YES

Surface mount technology saves space on PCBs and allows for greater design flexibility.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage allows for compatibility with a wide range of power systems, making it versatile for various applications.

Address Bus Width: 16

A 16-bit address bus enables the microcontroller to access a larger memory space, enhancing its capability for complex applications.

Package Shape: SQUARE

The square package shape is optimal for mounting and helps in better heat dissipation.

Bit Size: 8

An 8-bit architecture is suitable for a variety of simpler control applications, making the microcontroller cost-effective.

Power Supplies (V): 3.3, 5

Supporting both 3.3V and 5V power supplies provides flexibility for a range of electronic designs.

No. of Terminals: 80

A high number of terminals supports extensive I/O options, allowing for a diverse range of peripheral connections.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile and fine pitch design enable high-density PCB layouts, saving space and improving performance.

Minimum Supply Voltage: 4.5 V

The minimum voltage requirement ensures reliable operation in various environments and applications.

Maximum Operating Temperature: 85 °C

High-temperature tolerance makes this microcontroller suitable for industrial applications and environments.

CPU Family: 8051

The widely used 8051 architecture allows for a rich ecosystem of development tools and community support.

Minimum Operating Temperature: -40 °C

Extended temperature range allows the microcontroller to perform in harsh conditions, enhancing reliability.

Terminal Finish: MATTE TIN

Matte tin terminal finish helps in better solderability and improves the reliability of connections.

ADC Channels: YES

Integrated ADC channels enable real-time data processing from analog sources, enhancing functionality.

Terminal Position: QUAD

Quad terminal position provides design flexibility for PCB layout and improved signal integrity.

ROM Words: 262144

Significant ROM capacity allows for complex software programs, improving capability for advanced applications.

Maximum Seated Height: 1.6 mm

Low seated height is advantageous for space-constrained designs, contributing to compact products.

Width: 12 mm

Compact width allows this microcontroller to fit easily into smaller electronic devices.

External Data Bus Width: 8

An 8-bit external data bus provides compatibility with many peripheral devices, expanding application possibilities.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for faster processing and improves performance in time-sensitive applications.

Length: 12 mm

Short length is coupled with width for an overall compact form factor, ideal for modern electronic devices.

Temperature Grade: INDUSTRIAL

Industrial grade ensures robustness and reliability under challenging operational conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates processing, memory, and I/O, making it ideal for embedded applications.

RAM Bytes: 32768

Sufficient RAM allows for efficient data processing, essential for multitasking in applications.

Technology: CMOS

CMOS technology enhances power efficiency and reduces heat generation, critical for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, enhancing manufacturability.

Nominal Supply Voltage: 5 V

A standard nominal supply voltage simplifies design, ensuring compatibility with typical electronic systems.

PWM Channels: YES

Inclusion of PWM channels allows for control applications like motor driving and brightness adjustment in displays.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and modifications to firmware, increasing product longevity.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density designs, accommodating modern microelectronics trends.

Speed: 40 rpm

Speed metrics suggest potential applications in control systems requiring moderate response times.

No. of I/O Lines: 46

46 I/O lines facilitate extensive interfacing capabilities, making it suitable for a wide variety of applications.

Technical Specifications

Microcontrollers UPSD3454E-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3454E-40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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