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UPSD3434EV-40U6

STMicroelectronics

UPSD3434EV-40U6 by STMicroelectronics

UPSD3434EV-40U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 40 MHz. It features 80 terminals, supports ADC and PWM channels, making it ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,531 parts In-Stock

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3,531

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Anansix

USA . 2,786 parts In-Stock

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2,786

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Digiode

USA . 1,965 parts In-Stock

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1,965

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Prism Electronics

USA . 5 parts In-Stock

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Microchip USA

USA . 113 parts In-Stock

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$9.172

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113

$9.172

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AZTECH Wire

Italy . 415 parts In-Stock

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$14.990

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415

$14.990

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IDEA Electronic Components Group

UK . 209 parts In-Stock

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$23.107

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$20.796

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209

$23.107

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$20.796

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MKK Technologies

India . 1,133 parts In-Stock

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$43.451

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1,133

$43.451

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DigiPath Technology Company

USA . 1,133 parts In-Stock

1+ parts

$43.451

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$43.451

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Vigor

Singapore . 3,854 parts In-Stock

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Corphita

USA . 2,718 parts In-Stock

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2,718

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Parana Technologies

USA . 143 parts In-Stock

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$27.628

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143

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$27.628

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Perfect Parts

USA . 8 parts In-Stock

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Overview

Elevate your projects with the UPSD3434EV-40U6 microcontroller from STMicroelectronics—a trusted name in innovation and reliability. Designed for versatility, this compact powerhouse excels in industrial applications where precision and durability are crucial. With its low power consumption and robust performance, it delivers exceptional efficiency and seamless integration into your designs. Harness the benefits of advanced technology to drive your success forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Being surface mount compatible enables compact design and easy integration into modern PCB assemblies.

Maximum Supply Voltage: 3.6 V

This low maximum supply voltage helps in reducing power consumption, which is critical for battery-operated devices.

Address Bus Width: 16

A 16-bit address bus width allows for accessing more memory, enhancing the microcontroller's capability for complex applications.

Package Shape: SQUARE

The square package shape contributes to efficient use of board space and better thermal management.

Bit Size: 8

An 8-bit microcontroller is ideal for handling simple processing tasks, making it cost-effective for basic applications.

Power Supplies (V): 3.3

Running on 3.3V makes this microcontroller compatible with many modern digital circuits.

No. of Terminals: 80

With 80 terminals, this microcontroller can support a wide range of peripherals and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack style enhances placement on compact PCBs, promoting space efficiency.

Minimum Supply Voltage: 3 V

This lower minimum supply voltage allows for enhanced flexibility in power management.

Maximum Operating Temperature: 85 °C

Operating safely at up to 85 °C makes it suitable for industrial applications where ambient temperatures may vary.

CPU Family: 8051

The 8051 family is well-known and widely used, ensuring ample support and resources for development.

Minimum Operating Temperature: -40 °C

This microcontroller's ability to operate at -40 °C makes it ideal for harsh environments and applications requiring temperature resilience.

Terminal Finish: TIN

Tin terminal finish provides good solderability and helps maintain performance in various conditions.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to interface with analog sensors, enhancing its versatility.

Terminal Position: QUAD

Quad terminal positioning optimizes space on the PCB for better layout options.

ROM Words: 262144

With 262,144 words of ROM, there is ample space for firmware and application code, allowing for complex operations.

Maximum Seated Height: 1.6 mm

At only 1.6 mm seated height, it accommodates designs where space is at a premium.

Width: 12 mm

The compact 12 mm width offers flexibility in PCB layout and contributes to smaller end-product designs.

External Data Bus Width: 8

An 8-bit external data bus allows for easy integration with various peripherals without increasing complexity.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz provides sufficient processing power for time-sensitive applications.

Length: 12 mm

This uniform length complements the width, ensuring a neat and compact component for space-effective designs.

Temperature Grade: INDUSTRIAL

Industrial grade components ensure reliability and longevity in demanding applications, such as manufacturing or automotive.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it provides integrated processing power, making it a versatile component for embedded systems.

RAM Bytes: 8192

With 8192 bytes of RAM, this microcontroller can effectively handle more complex tasks and data processing requirements.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, ideal for battery-powered and sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections, which are crucial for production efficiency.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V balances power needs while supporting modern electronic components.

PWM Channels: YES

PWM channels provide control for various applications such as motor control and dimming LEDs.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to firmware, enhancing flexibility.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density layouts, crucial in compact electronic devices.

Speed: 40 rpm

With an operational speed of 40 rpm, it suits applications requiring moderate to high speed data processing.

No. of I/O Lines: 46

Having 46 I/O lines provides extensive connectivity options for peripherals, facilitating a wide variety of applications.

Technical Specifications

Microcontrollers UPSD3434EV-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3434EV-40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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