Loading...

UPSD3433EVB40T6

STMicroelectronics

UPSD3433EVB40T6 by STMicroelectronics

UPSD3433EVB40T6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 40 MHz. It features 131072 ROM words, 8192 bytes RAM, and supports ADC/PWM channels. Ideal for industrial applications requiring robust performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,326

-

-

-

-

Digiode

USA . 983 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

983

-

-

-

-

Anansix

USA . 471 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

471

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 237 parts In-Stock

1+ parts

$6.258

100+ parts

-

1k+ parts

-

10k+ parts

-

237

$6.258

-

-

-

AZTECH Wire

Italy . 1,104 parts In-Stock

1+ parts

$9.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,104

$9.500

-

-

-

IDEA Electronic Components Group

UK . 615 parts In-Stock

1+ parts

$29.356

100+ parts

-

1k+ parts

$26.421

10k+ parts

-

615

$29.356

-

$26.421

-

MKK Technologies

India . 1,101 parts In-Stock

1+ parts

$55.203

100+ parts

-

1k+ parts

-

10k+ parts

-

1,101

$55.203

-

-

-

DigiPath Technology Company

USA . 1,101 parts In-Stock

1+ parts

$55.203

100+ parts

-

1k+ parts

-

10k+ parts

-

1,101

$55.203

-

-

-

Component Stockers USA

USA . 424 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

424

$99.990

-

-

-

Corphita

USA . 4,731 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,731

-

-

-

-

Vigor

Singapore . 1,463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,463

-

-

-

-

Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

560

-

-

-

-

Parana Technologies

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$35.100

1k+ parts

-

10k+ parts

-

500

-

$35.100

-

-

Overview

Unlock endless possibilities with the UPSD3433EVB40T6 microcontroller from STMicroelectronics—a leader in innovation and quality. This versatile device blends robust performance with energy efficiency, making it ideal for applications ranging from industrial automation to consumer electronics. Enjoy seamless integration, advanced functionality, and exceptional reliability that empowers your projects. Elevate your designs and achieve more with STMicroelectronics at your side!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and light, this material enhances the microcontroller's longevity in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient production processes.

Maximum Supply Voltage: 3.6 V

Optimal voltage range ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shapes facilitate uniform stacking and efficient use of board space.

Bit Size: 8

An 8-bit architecture is suitable for numerous applications, particularly in embedded systems.

Power Supplies (V): 3.3

Supports standard power supply voltages commonly used in modern electronic devices.

No. of Terminals: 52

A higher number of terminals provides flexibility for connecting various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

A low-profile design allows for more compact assemblies, making this microcontroller ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

Allows operation with lower voltage levels, reducing power consumption and extending battery life.

Maximum Operating Temperature: 85 °C

The high operating temperature makes this microcontroller reliable for industrial applications.

CPU Family: 8051

Based on the widely used 8051 architecture, it offers ample resources and a strong development ecosystem.

Minimum Operating Temperature: -40 °C

This wide temperature range supports operation in extreme conditions, enhancing versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Gold plating ensures excellent reliability and improves solderability for longer-lasting connections.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog sensors, ideal for data acquisition applications.

Terminal Position: QUAD

Quad terminal positioning aids in efficient space usage and stability during mounting.

ROM Words: 131072

Large ROM capacity supports complex applications while allowing for easy program updates.

Maximum Seated Height: 1.6 mm

Low seated height contributes to compact designs, enabling use in thin devices.

Width: 10 mm

Standard width suitable for a variety of PCB layouts ensures adaptability in different designs.

Maximum Clock Frequency: 40 MHz

High clock frequency supports faster processing and real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering processes, ensuring product reliability and manufacturability.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures, ensuring durability during assembly.

Length: 10 mm

Compact length allows for versatile integration into small form-factor electronics.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications, ensuring robustness and reliability in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, it is well-suited for handling various control functions efficiently.

RAM Bytes: 8192

Sufficient RAM allows for complex programs and data processing capabilities.

Technology: CMOS

CMOS technology enhances power efficiency and integration capabilities.

Terminal Form: GULL WING

Gull wing terminals provide stability and ease of soldering, ensuring reliable connections.

Nominal Supply Voltage: 3.3 V

Standard operating voltage takes advantage of modern low-power technology.

PWM Channels: YES

Integrated PWM channels enable effective control of motors and analog devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and field reprogramming of the device.

Terminal Pitch: 0.65 mm

The fine terminal pitch is ideal for high-density designs, maximizing PCB space utilization.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates good handling and shelf life, ensuring reliability in storage and use.

Speed: 40 rpm

This speed specification implies support for various applications needing controlled actuations.

No. of I/O Lines: 35

A large number of I/O lines supports extensive interfacing capabilities with sensors and modules.

Technical Specifications

Microcontrollers UPSD3433EVB40T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

35

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

UPSD3433EVB40T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20