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UPSD3433E-40T6

STMicroelectronics

UPSD3433E-40T6 by STMicroelectronics

UPSD3433E-40T6 from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features 131072 ROM words, 8192 bytes of RAM, and supports ADC/PWM channels. Ideal for industrial applications requiring robust performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,686 parts In-Stock

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7,686

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Digiode

USA . 569 parts In-Stock

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569

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Anansix

USA . 175 parts In-Stock

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175

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Prism Electronics

USA . 3 parts In-Stock

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Microchip USA

USA . 381 parts In-Stock

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$10.899

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381

$10.899

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AZTECH Wire

Italy . 312 parts In-Stock

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$14.370

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312

$14.370

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IDEA Electronic Components Group

UK . 746 parts In-Stock

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$57.768

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$51.991

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746

$57.768

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$51.991

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MKK Technologies

India . 1,627 parts In-Stock

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$108.628

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1,627

$108.628

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DigiPath Technology Company

USA . 1,627 parts In-Stock

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$108.628

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$108.628

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Kepictronics

USA . 5,500 parts In-Stock

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5,500

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Corphita

USA . 1,723 parts In-Stock

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1,723

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Vigor

Singapore . 1,249 parts In-Stock

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1,249

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Parana Technologies

USA . 895 parts In-Stock

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$69.070

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895

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$69.070

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Perfect Parts

USA . 3 parts In-Stock

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Overview

Unlock endless possibilities with the UPSD3433E-40T6 microcontroller from STMicroelectronics, a leader in innovative solutions. This compact powerhouse offers exceptional performance and reliability for diverse applications—from industrial automation to smart home devices. With low power consumption and robust temperature resilience, it ensures long-lasting efficiency. Elevate your projects with a trusted partner that delivers quality and cutting-edge technology, maximizing value every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic and epoxy body provides protection against environmental factors, making it reliable in various applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact designs, saving space on PCBs.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, the microcontroller can function in a range of low-power applications.

Package Shape: SQUARE

A square package shape provides uniform support for PCB layout, simplifying the design process.

Bit Size: 8

The 8-bit architecture is suitable for a range of basic applications while offering low power consumption.

Power Supplies (V): 3.3, 5

The dual voltage support allows for versatile application in varying electronic systems requiring 3.3V or 5V supply.

No. of Terminals: 52

A higher number of terminals provides extensive connectivity options for various peripherals and I/O functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design helps in reducing the overall space required on the PCB, facilitating compact assemblies.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures compatibility with various power sources while maintaining stable operation.

Maximum Operating Temperature: 85 °C

An operating temperature range up to 85 °C makes it suitable for industrial applications where higher temperatures may occur.

CPU Family: 8051

The 8051 CPU family ensures compatibility with a wide range of development tools and libraries, making it easier to program.

Minimum Operating Temperature: -40 °C

With the ability to operate down to -40 °C, this microcontroller is ideal for extreme environments.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

The premium terminal finish enhances solderability and provides excellent corrosion resistance, ensuring durability.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to easily handle analog signal processing, broadening its application scope.

Terminal Position: QUAD

The quad terminal layout simplifies the PCB design and enables effective heat dissipation.

ROM Words: 131072

A substantial ROM capacity allows for extensive program storage, supporting complex applications.

Maximum Seated Height: 1.6 mm

The compact height ensures a low-profile design for applications with height restrictions.

Width: 10 mm

The 10 mm width contributes to compact designs while ensuring sufficient space for terminal connections.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz provides excellent processing speed for responsive applications.

Peak Reflow Temperature °C: 260

This peak temperature withstands standard reflow soldering processes without damaging the microcontroller.

Length: 10 mm

A fixed length of 10 mm matches standard PCB layout dimensions, simplifying manufacturing.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, it assures reliability in harsh working conditions.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it provides specific functionalities necessary for digital control tasks.

RAM Bytes: 8192

Ample RAM allows for efficient data manipulation and storage during program execution.

Technology: CMOS

Being based on CMOS technology enhances power efficiency and performance, crucial for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and easy soldering, enhancing assembly quality.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V is standard in many applications, ensuring wide compatibility.

PWM Channels: YES

The availability of PWM channels makes it advantageous for applications requiring speed control or modulation.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, extending product life.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is suitable for high-density designs, optimizing space utilization.

Speed: 40 rpm

A speed of 40 rpm indicates capabilities for applications involving motors or other moving parts.

No. of I/O Lines: 35

Having 35 I/O lines allows for extensive interfacing options, making it versatile for various projects.

Technical Specifications

Microcontrollers UPSD3433E-40T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3/e4

Length:

10 mm

No. of I/O Lines:

35

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

UPSD3433E-40T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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