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UPSD3422EV-40U6

STMicroelectronics

UPSD3422EV-40U6 by STMicroelectronics

UPSD3422EV-40U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 40 MHz. It features 80 terminals, 4KB RAM, and supports ADC/PWM channels. Ideal for industrial applications requiring robust performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,048 parts In-Stock

1+ parts

-

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4,048

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Digiode

USA . 2,468 parts In-Stock

1+ parts

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2,468

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Anansix

USA . 1,525 parts In-Stock

1+ parts

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1,525

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Flip Electronics

USA . 250 parts In-Stock

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,423 parts In-Stock

1+ parts

$10.880

100+ parts

-

1k+ parts

-

10k+ parts

-

3,423

$10.880

-

-

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Microchip USA

USA . 142 parts In-Stock

1+ parts

$11.395

100+ parts

-

1k+ parts

-

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142

$11.395

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-

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AZTECH Wire

Italy . 650 parts In-Stock

1+ parts

$18.580

100+ parts

-

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650

$18.580

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IDEA Electronic Components Group

UK . 128 parts In-Stock

1+ parts

$70.531

100+ parts

-

1k+ parts

$63.478

10k+ parts

-

128

$70.531

-

$63.478

-

MKK Technologies

India . 1,960 parts In-Stock

1+ parts

$132.629

100+ parts

-

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1,960

$132.629

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DigiPath Technology Company

USA . 1,960 parts In-Stock

1+ parts

$132.629

100+ parts

-

1k+ parts

-

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1,960

$132.629

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Corphita

USA . 4,468 parts In-Stock

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4,468

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Perfect Parts

USA . 610 parts In-Stock

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610

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Authorized Procurement Solutions

USA . 300 parts In-Stock

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300

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Parana Technologies

USA . 79 parts In-Stock

1+ parts

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100+ parts

$84.330

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79

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$84.330

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Overview

Elevate your designs with the UPSD3422EV-40U6 microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile 8-bit MCU delivers exceptional performance for diverse applications, from industrial automation to consumer electronics. Enjoy benefits like low power consumption and robust features, ensuring reliability and efficiency in your projects. Trust in ST's expertise to drive innovation and enhance your product's value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on printed circuit boards.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can operate efficiently with common voltage levels in embedded systems.

Address Bus Width: 16

A 16-bit address bus width allows for addressing a larger memory space, enhancing the capability of handling more complex applications.

Package Shape: SQUARE

The square package shape facilitates straightforward placement on PCBs, improving the ease of assembly.

Bit Size: 8

An 8-bit architecture is optimal for low-power applications, maintaining efficiency while processing data.

Power Supplies (V): 3.3

Operating at 3.3 V aligns with modern low-power logic standards, enhancing compatibility with a wide range of devices.

No. of Terminals: 80

With 80 terminals, this microcontroller offers ample I/O connectivity, allowing for complex interfacing with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design minimizes space on the PCB while allowing for high-density component placement.

Minimum Supply Voltage: 3 V

The ability to operate at a minimum voltage of 3 V increases the versatility of the microcontroller across different power scenarios.

Maximum Operating Temperature: 85 °C

This temperature range makes the microcontroller suitable for industrial applications where operating conditions can be harsh.

CPU Family: 8051

Being part of the 8051 family ensures compatibility with a wide range of development tools and established software libraries.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller can function in extreme environments, making it reliable for outdoor applications.

Terminal Finish: TIN

The tin terminal finish offers good solderability, contributing to reliable connections in high-volume production.

ADC Channels: YES

Having ADC channels enables the microcontroller to easily process analog signals, expanding its utility in sensor applications.

Terminal Position: QUAD

Quad terminal positioning facilitates efficient heat dissipation and easy routing on PCBs, enhancing overall performance.

ROM Words: 65536

With 65,536 ROM words, the microcontroller can store a significant amount of application code, supporting complex functionality.

Maximum Seated Height: 1.6 mm

A low seated height ensures compatibility with various low-profile designs, aiding in the development of compact electronic devices.

Width: 12 mm

The compact width of 12 mm allows for efficient design in space-constrained applications.

External Data Bus Width: 8

An 8-bit external data bus width is adequate for many standard applications, balancing performance with low complexity.

Maximum Clock Frequency: 40 MHz

Operating at a maximum clock frequency of 40 MHz enhances processing speed, making it capable of handling demanding tasks.

Length: 12 mm

With a length of 12 mm, this microcontroller is ideal for compact and portable device designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade components ensure extended reliability and performance under rigorous conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing and control functions in a single chip, simplifying design considerations.

RAM Bytes: 4096

With 4096 bytes of RAM, this microcontroller can efficiently handle a moderate workload, suitable for embedded applications.

Technology: CMOS

The CMOS technology ensures low power consumption and high reliability, making it a good choice for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals ensure ease of soldering and improve mechanical strength, enhancing product durability.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V supports low-power applications, contributing to energy-efficient designs.

PWM Channels: YES

The presence of PWM channels allows for precise control over motors and lights, making this microcontroller ideal for automation tasks.

ROM Programmability: FLASH

Flash ROM programmability enables in-circuit updates, allowing for easy modifications and upgrades to applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suitable for modern device designs, supporting high-density component layouts.

Speed: 40 rpm

With a speed rating of 40 rpm, it can effectively control motors, enhancing its application in automation and robotics.

No. of I/O Lines: 46

Having 46 I/O lines offers extensive interfacing options for connecting various sensors and devices, providing flexibility in application design.

Technical Specifications

Microcontrollers UPSD3422EV-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3422EV-40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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