Loading...

UPSD3354DV-40U6

STMicroelectronics

UPSD3354DV-40U6 by STMicroelectronics

UPSD3354DV-40U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 40 MHz. It features 46 I/O lines, 32KB RAM, and supports ADC/PWM channels. Ideal for industrial applications requiring robust performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,019 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,019

-

-

-

-

Digiode

USA . 4,941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,941

-

-

-

-

Chip Stock

USA . 2,547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,547

-

-

-

-

Anansix

USA . 2,236 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,236

-

-

-

-

Cyclops Electronics Ltd

UK . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23

-

-

-

-

Bristol Electronics

USA . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 304 parts In-Stock

1+ parts

$11.840

100+ parts

-

1k+ parts

-

10k+ parts

-

304

$11.840

-

-

-

IDEA Electronic Components Group

UK . 1,302 parts In-Stock

1+ parts

$27.617

100+ parts

-

1k+ parts

$24.856

10k+ parts

-

1,302

$27.617

-

$24.856

-

MKK Technologies

India . 77 parts In-Stock

1+ parts

$51.933

100+ parts

-

1k+ parts

-

10k+ parts

-

77

$51.933

-

-

-

DigiPath Technology Company

USA . 77 parts In-Stock

1+ parts

$51.933

100+ parts

-

1k+ parts

-

10k+ parts

-

77

$51.933

-

-

-

Component Stockers USA

USA . 438 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

438

$99.990

-

-

-

Perfect Parts

USA . 15,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,096

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 10,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,861

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,877

-

-

-

-

Microchip USA

USA . 3,401 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,401

-

-

-

-

Vigor

Singapore . 2,035 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,035

-

-

-

-

RC Electronics

USA . 1,234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,234

-

-

-

-

Parana Technologies

USA . 816 parts In-Stock

1+ parts

-

100+ parts

$33.021

1k+ parts

-

10k+ parts

-

816

-

$33.021

-

-

Authorized Procurement Solutions

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

600

-

-

-

-

Corphita

USA . 574 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

574

-

-

-

-

Kepictronics

USA . 397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

397

-

-

-

-

Futuretech Components

Singapore . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Overview

Unlock your project's potential with the UPSD3354DV-40U6 microcontroller from STMicroelectronics! Renowned for their innovation and quality, STMicroelectronics delivers a reliable solution that excels in performance across various applications—from industrial automation to consumer electronics. Enjoy enhanced efficiency, robust features, and seamless integration, all while leveraging this compact design to fit into your most demanding projects. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, ensuring reliable performance in various environments.

Surface Mount: YES

Enables compact design and easy integration into modern electronic devices.

Maximum Supply Voltage: 3.6 V

Supports a range of applications with higher voltage tolerance, enhancing versatility.

Address Bus Width: 12

Allows for efficient data handling and memory access, improving performance.

Package Shape: SQUARE

Facilitates easy placement on PCBs, optimizing space and layout.

Bit Size: 8

Ensures compatibility with a broad range of applications, suitable for simple embedded tasks.

Power Supplies (V): 3.3

Low power consumption, suitable for battery-operated devices and energy-efficient designs.

No. of Terminals: 80

Provides extensive connectivity options for peripheral devices, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Allows for effective space utilization on PCBs, critical for compact designs.

Minimum Supply Voltage: 3 V

Offers flexibility in power supply design, accommodating various system requirements.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, ensuring reliability in high-temperature environments.

CPU Family: 8051

Proven architecture with extensive software support, ideal for a wide range of applications.

Minimum Operating Temperature: -40 °C

Excellent thermal resilience, making it suitable for extreme environments.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

Ensures better conductivity and durability, enhancing long-term reliability.

ADC Channels: YES

Built-in Analog-to-Digital Conversion capabilities expand application possibilities.

Terminal Position: QUAD

Enables efficient routing and layout on printed circuit boards for effective design.

ROM Words: 262144

Ample memory for program storage, allowing for complex applications and firmware.

Maximum Seated Height: 1.6 mm

Low profile design suitable for compact devices where space is limited.

Width: 12 mm

Standard dimensions facilitate easy placement and integration into existing designs.

External Data Bus Width: 8

Promotes efficient data transfer with external devices, enhancing overall performance.

Maximum Clock Frequency: 40 MHz

High clock speed allows for fast processing and responsiveness in applications.

Length: 12 mm

Compact size simplifies integration into various applications, especially space-constrained ones.

Temperature Grade: INDUSTRIAL

Designed for reliability in harsh environments, suitable for industrial automation.

Peripheral IC Type: MICROCONTROLLER

Versatile and flexible, allowing for a wide range of applications in embedded systems.

RAM Bytes: 32768

Sufficient RAM for real-time processing and handling temporary data effectively.

Technology: CMOS

Ensures low power consumption and high efficiency for battery-operated devices.

Terminal Form: GULL WING

Facilitates efficient soldering and assembly processes in manufacturing.

Nominal Supply Voltage: 3.3 V

Optimized for modern low-voltage applications, enhancing energy efficiency.

PWM Channels: YES

Offers Pulse Width Modulation capabilities for controlling motors and other devices.

ROM Programmability: FLASH

Allows for easy updates and modifications, extending the product life cycle.

Terminal Pitch: 0.5 mm

Enables high-density connections, ideal for advanced compact designs.

Speed: 40 rpm

Suitable for applications requiring variable speed control, enhancing functionality.

No. of I/O Lines: 46

Provides extensive interfacing options for sensors, actuators, and other peripherals.

Technical Specifications

Microcontrollers UPSD3354DV-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

12

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3/e4

Length:

12 mm

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3354DV-40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20