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UPSD3354DV-40T6

STMicroelectronics

UPSD3354DV-40T6 by STMicroelectronics

UPSD3354DV-40T6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 40 MHz. It features 32KB RAM, 262144 ROM, and supports ADC/PWM channels, making it ideal for industrial applications. Its compact flatpack design ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,299 parts In-Stock

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6,299

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Digiode

USA . 4,335 parts In-Stock

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4,335

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Anansix

USA . 2,398 parts In-Stock

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2,398

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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AZTECH Wire

Italy . 276 parts In-Stock

1+ parts

$21.020

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-

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276

$21.020

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IDEA Electronic Components Group

UK . 2,240 parts In-Stock

1+ parts

$41.119

100+ parts

-

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$37.007

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2,240

$41.119

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$37.007

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Microchip USA

USA . 225 parts In-Stock

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$45.900

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225

$45.900

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MKK Technologies

India . 713 parts In-Stock

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$77.322

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713

$77.322

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DigiPath Technology Company

USA . 713 parts In-Stock

1+ parts

$77.322

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713

$77.322

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Vigor

Singapore . 5,381 parts In-Stock

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5,381

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Corphita

USA . 4,432 parts In-Stock

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4,432

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Perfect Parts

USA . 232 parts In-Stock

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232

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Parana Technologies

USA . 50 parts In-Stock

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$49.164

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50

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$49.164

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Overview

Elevate your projects with the UPSD3354DV-40T6 microcontroller from STMicroelectronics, a leader in innovative technology. Engineered for reliability and efficiency, this compact 8-bit solution delivers exceptional performance across various applications, from industrial automation to consumer electronics. With its robust design, advanced features, and low power consumption, it empowers you to create high-quality, cutting-edge devices that stand out in today’s competitive market. Choose STMicroelectronics for unparalleled quality and trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, ideal for modern electronic devices.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can work effectively with standard voltage levels found in many systems.

Package Shape: SQUARE

The square shape optimizes space utilization on PCBs, enhancing design flexibility.

Bit Size: 8

Being an 8-bit microcontroller makes it suitable for low-power applications where simple processing tasks are sufficient.

Power Supplies (V): 3.3

Designed to operate at 3.3 V, this microcontroller is compatible with a wide range of low-power applications.

No. of Terminals: 52

A higher number of terminals allows for more input/output connections, increasing the microcontroller's versatility in various projects.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style is advantageous for space-constrained designs, making it easier to integrate into compact devices.

Minimum Supply Voltage: 3 V

This microcontroller can operate at a low voltage of 3 V, enabling energy-efficient designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in warmer environments, suitable for industrial applications.

CPU Family: 8051

The 8051 CPU architecture is well-known and widely used, ensuring a robust ecosystem of support and libraries.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is ideal for applications in extreme conditions.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

The terminal finish enhances solderability and corrosion resistance, ensuring reliable connections and longevity.

ADC Channels: YES

The inclusion of ADC channels facilitates direct sensing of analog signals, making it suitable for applications such as sensor interfacing.

Terminal Position: QUAD

Quad terminal positioning provides improved connectivity options for PCB layout, making design integration more straightforward.

ROM Words: 262144

A high ROM word count enables the storage of more complex programs, increasing the microcontroller's application range.

Maximum Seated Height: 1.7 mm

The low seated height is beneficial for space-saving designs in compact applications.

Width: 10 mm

The compact width allows for efficient use of space on the PCB while maintaining performance.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz provides sufficient processing power for a variety of tasks without excessive power consumption.

Peak Reflow Temperature °C: 260

Supporting a peak reflow temperature of 260 °C helps ensure compatibility with modern soldering processes.

Length: 10 mm

A length of 10 mm contributes to its compact form factor, making it ideal for dense circuit designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in harsh environments, expanding its application range.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing and peripheral management, simplifying design and reducing component count.

RAM Bytes: 32768

With 32 KB of RAM, it allows for handling complex tasks and data processing efficiently.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals enhance soldering reliability and provide a secure connection on the PCB.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V reflects its compatibility with common electronic systems, making integration easy.

PWM Channels: YES

The presence of PWM channels makes this microcontroller suitable for applications requiring motor control and signal modulation.

ROM Programmability: FLASH

The use of FLASH memory for ROM programmability allows for easy updates and reprogramming of applications.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for a more compact layout while still maintaining ease of soldering.

Speed: 40 rpm

A processing speed of 40 rpm aligns well with typical microcontroller applications requiring effective and timely control.

No. of I/O Lines: 37

Having 37 I/O lines greatly enhances the versatility and connectivity options for interfacing with various peripherals.

Technical Specifications

Microcontrollers UPSD3354DV-40T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3/e4

Length:

10 mm

No. of I/O Lines:

37

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

UPSD3354DV-40T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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