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UPSD3333DV-40U6

STMicroelectronics

UPSD3333DV-40U6 by STMicroelectronics

UPSD3333DV-40U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 40 MHz. It features 131072 ROM words and 8192 RAM bytes, making it ideal for industrial applications requiring reliable performance in harsh environments. Its compact design includes a low-profile flatpack package with 80 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,827 parts In-Stock

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9,827

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Digiode

USA . 2,258 parts In-Stock

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2,258

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Anansix

USA . 489 parts In-Stock

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489

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Distributors (Availability)

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Microchip USA

USA . 444 parts In-Stock

1+ parts

$16.736

100+ parts

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444

$16.736

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AZTECH Wire

Italy . 767 parts In-Stock

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$18.120

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767

$18.120

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IDEA Electronic Components Group

UK . 1,523 parts In-Stock

1+ parts

$72.295

100+ parts

-

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$65.065

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1,523

$72.295

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$65.065

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Component Stockers USA

USA . 495 parts In-Stock

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$99.990

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495

$99.990

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MKK Technologies

India . 28 parts In-Stock

1+ parts

$135.945

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28

$135.945

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DigiPath Technology Company

USA . 28 parts In-Stock

1+ parts

$135.945

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28

$135.945

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Vigor

Singapore . 4,845 parts In-Stock

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4,845

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Corphita

USA . 4,818 parts In-Stock

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4,818

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A-Z Elektronik GmbH

Germany . 4,512 parts In-Stock

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4,512

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Parana Technologies

USA . 2,024 parts In-Stock

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$86.439

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2,024

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$86.439

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Perfect Parts

USA . 1,232 parts In-Stock

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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Overview

Experience exceptional performance with the UPSD3333DV-40U6 from STMicroelectronics, a leader in innovative microcontroller solutions. Designed for versatility and reliability, this advanced 8-bit MCU excels in industrial applications, delivering robust functionality while ensuring energy efficiency. With its compact design and superior thermal range, it’s perfect for everything from automation to consumer electronics. Elevate your projects with ST's trusted quality and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making this microcontroller reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, which is essential for modern electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power systems, making it energy-efficient.

Address Bus Width: 12

With a 12-bit address bus width, this microcontroller can address more memory locations, increasing its versatility in complex applications.

Package Shape: SQUARE

The square package shape facilitates easier integration into circuit boards, enhancing design flexibility.

Bit Size: 8

An 8-bit architecture is suitable for simpler applications, allowing for cost-effective designs that don’t require a large computational power.

Power Supplies (V): 3.3

The 3.3 V power supply is common in the industry, simplifying integration with other components and reducing overall system complexity.

No. of Terminals: 80

Having 80 terminals allows for a greater number of input/output connections, providing flexibility in interfacing with various peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile design is space-efficient and ideal for high-density circuit layouts, which is crucial in modern electronic applications.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V ensures the microcontroller operates efficiently even with slightly lower power inputs, which is beneficial for battery-powered devices.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C makes this microcontroller suitable for industrial applications, where high heat can be a concern.

CPU Family: 8051

The well-established 8051 CPU family promises reliability and a wealth of development resources, making it a trusted choice for developers.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C allows this microcontroller to perform in extreme environments, ideal for automotive and industrial uses.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

This terminal finish enhances solderability and corrosion resistance, increasing the longevity of the microcontroller in various applications.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to process analog signals directly, making it suitable for sensor applications.

Terminal Position: QUAD

The quad-terminal arrangement offers reduced inductance and better electrical performance, essential for high-speed applications.

ROM Words: 131072

With 131072 ROM words available, the microcontroller can store a significant amount of application code, supporting complex functionalities.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm is ideal for low-profile designs, limiting the overall height of the device.

Width: 12 mm

The compact width allows for easy placement in tight spaces on circuit boards, enhancing design efficiency.

External Data Bus Width: 8

An 8-bit external data bus width accommodates popular data formats, facilitating easy communication with other microcontrollers or peripherals.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz provides sufficient processing speed for most applications without significant heat generation, optimizing performance.

Length: 12 mm

The compact length of 12 mm is ideal for space-constrained applications like handheld devices and wearables.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in harsh environmental conditions, making this microcontroller suitable for demanding applications.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it integrates various functionalities needed for embedded systems, simplifying design and reducing component count.

RAM Bytes: 8192

With 8192 bytes of RAM, it can efficiently handle variables and temporary data in real-time processing applications.

Technology: CMOS

CMOS technology allows for low power consumption and high speed, making this microcontroller ideal for battery-operated and portable devices.

Terminal Form: GULL WING

The gull wing terminal design allows for easy hand soldering and machine assembly, enhancing the manufacturing process.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V ensures optimal performance across various applications, particularly in low power consumption designs.

PWM Channels: YES

Having PWM channels enables control over motors and other devices requiring varying power levels, widening application potential.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in firmware updates and development, allowing for easy modifications to meet changing requirements.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density packing on PCBs, maximizing available space for additional components.

Speed: 40 rpm

The ability to achieve 40 RPM makes this microcontroller suitable for applications requiring moderate-speed operations, such as motors and actuators.

No. of I/O Lines: 46

Having 46 I/O lines allows for extensive interfacing capabilities with various sensors and peripherals, making it versatile for different projects.

Technical Specifications

Microcontrollers UPSD3333DV-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

12

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3/e4

Length:

12 mm

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3333DV-40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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