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UPSD3333D-40U6

STMicroelectronics

UPSD3333D-40U6 by STMicroelectronics

UPSD3333D-40U6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features 131072 ROM words, 8192 RAM bytes, and supports ADC/PWM channels. Ideal for industrial applications requiring robust performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,837 parts In-Stock

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6,837

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Anansix

USA . 1,353 parts In-Stock

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1,353

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Chip Stock

USA . 1,200 parts In-Stock

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1,200

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Digiode

USA . 114 parts In-Stock

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114

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ComSIT Distribution GmbH

Germany . 6 parts In-Stock

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6

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ComSIT USA

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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AZTECH Wire

Italy . 1,186 parts In-Stock

1+ parts

$9.900

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-

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1,186

$9.900

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IDEA Electronic Components Group

UK . 656 parts In-Stock

1+ parts

$50.729

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-

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$45.656

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656

$50.729

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$45.656

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MKK Technologies

India . 1,395 parts In-Stock

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$95.392

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1,395

$95.392

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DigiPath Technology Company

USA . 1,395 parts In-Stock

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$95.392

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1,395

$95.392

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QUARKTWIN TECHNOLOGY LTD

USA . 27,298 parts In-Stock

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27,298

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Microchip USA

USA . 5,805 parts In-Stock

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Vigor

Singapore . 1,650 parts In-Stock

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1,650

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Parana Technologies

USA . 1,169 parts In-Stock

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$60.654

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$60.654

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Perfect Parts

USA . 560 parts In-Stock

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560

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Corphita

USA . 442 parts In-Stock

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442

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Overview

Elevate your projects with the UPSD3333D-40U6 microcontroller from STMicroelectronics, a leader in innovation and reliability. Designed for industrial applications, this versatile component offers exceptional performance in a compact package, ensuring robust operation even in extreme conditions. Experience seamless integration and unmatched efficiency, empowering your designs with advanced features that deliver significant value and long-term benefits. Trust in STMicroelectronics' legacy of quality to drive your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space, making it ideal for modern electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options for different applications.

Address Bus Width: 12

The 12-bit address bus width allows for a larger memory addressing capability, enabling the use of more complex programs and data.

Package Shape: SQUARE

The square shape contributes to a uniform layout, simplifying the PCB design and enhancing thermal performance.

Bit Size: 8

An 8-bit architecture is versatile for a range of applications, balancing performance and efficiency.

Power Supplies (V): 3.3, 5

Supporting multiple voltage levels (3.3V and 5V) increases compatibility with various systems and peripherals.

No. of Terminals: 80

80 terminals provide ample I/O connections, facilitating communication with numerous peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is designed for high-density applications, making it suitable for modern electronic designs.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V allows for reliable operation in various voltage-regulated environments.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller can be used in demanding industrial environments.

CPU Family: 8051

The well-established 8051 CPU family is known for its robustness and wide community support, ensuring access to resources and development tools.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme low temperatures (-40 °C) makes it ideal for harsh and outdoor applications.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

High-quality terminal finishes improve solderability and long-term reliability in connection points.

ADC Channels: YES

Integrated ADC channels enhance functionality by allowing the microcontroller to interface with analog sensors directly.

Terminal Position: QUAD

Quad terminal positioning aids in efficient layout and connection during PCB design, optimizing space utilization.

ROM Words: 131072

A generous ROM capacity provides ample storage for firmware, supporting complex applications.

Maximum Seated Height: 1.6 mm

The low seated height allows for space-efficient designs in compact electronic devices.

Width: 12 mm

A standard width of 12 mm enhances compatibility with various PCB designs.

External Data Bus Width: 8

An 8-bit external data bus width enables efficient data transfer with external devices.

Maximum Clock Frequency: 40 MHz

A clock frequency of 40 MHz ensures responsive performance suitable for real-time processing needs.

Length: 12 mm

The length of 12 mm is standard for many applications, maintaining compatibility with existing designs.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, this microcontroller is ideal for use in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it’s designed for managing control tasks, making it an optimal choice for embedded systems.

RAM Bytes: 8192

With 8192 bytes of RAM, this microcontroller can handle more complex tasks and data without swapping to slower storage.

Technology: CMOS

CMOS technology ensures low power consumption while providing high-speed performance, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide a reliable connection, ideal for mass production.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard in many applications, simplifying power supply requirements.

PWM Channels: YES

PWM channels enhance control options for tasks such as motor control or audio generation, increasing versatility.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and modifications to the firmware, extending the product's usability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density packaging, accommodating more connections in smaller footprints.

Speed: 40 rpm

Operational speed of 40 rpm is suitable for various systems requiring moderate performance, particularly in control applications.

No. of I/O Lines: 46

Having 46 I/O lines provides significant interfacing capabilities with external devices, enhancing the microcontroller's utility.

Technical Specifications

Microcontrollers UPSD3333D-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

12

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3/e4

Length:

12 mm

No. of I/O Lines:

46

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3333D-40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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