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UPSD3333D-40T6

STMicroelectronics

UPSD3333D-40T6 by STMicroelectronics

UPSD3333D-40T6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features 131072 ROM words, 8192 RAM bytes, and supports industrial applications in harsh environments. Its compact design ensures efficient performance in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 13,045 parts In-Stock

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13,045

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Digiode

USA . 4,601 parts In-Stock

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4,601

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Anansix

USA . 2,155 parts In-Stock

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2,155

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ComSIT Distribution GmbH

Germany . 71 parts In-Stock

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71

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ComSIT USA

USA . 71 parts In-Stock

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71

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Distributors (Availability)

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AZTECH Wire

Italy . 157 parts In-Stock

1+ parts

$21.300

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157

$21.300

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IDEA Electronic Components Group

UK . 2,116 parts In-Stock

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$79.551

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-

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$71.596

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2,116

$79.551

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$71.596

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Component Stockers USA

USA . 779 parts In-Stock

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$99.990

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779

$99.990

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MKK Technologies

India . 141 parts In-Stock

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$149.591

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141

$149.591

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DigiPath Technology Company

USA . 141 parts In-Stock

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$149.591

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141

$149.591

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QUARKTWIN TECHNOLOGY LTD

USA . 16,145 parts In-Stock

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16,145

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A-Z Elektronik GmbH

Germany . 5,790 parts In-Stock

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Microchip USA

USA . 5,596 parts In-Stock

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Corphita

USA . 4,868 parts In-Stock

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Vigor

Singapore . 2,988 parts In-Stock

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2,988

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Parana Technologies

USA . 1,643 parts In-Stock

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$95.116

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1,643

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$95.116

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Perfect Parts

USA . 560 parts In-Stock

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560

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Metaverse IC Inc.

Canada . 510 parts In-Stock

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510

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Overview

Unlock the potential of your projects with the UPSD3333D-40T6 microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a powerful 8-bit solution designed for reliability in diverse applications. Experience enhanced performance with low power consumption, making it ideal for industrial automation, consumer electronics, and IoT devices. Elevate your designs with a trusted partner that prioritizes excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it ideal for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact designs, facilitating easy integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V provides flexibility in powering the microcontroller from various sources without risking damage.

Package Shape: SQUARE

The square package shape optimizes space utilization on printed circuit boards, which is important for high-density applications.

Bit Size: 8

An 8-bit architecture is suitable for simpler applications while still offering reliable performance for many control tasks.

Power Supplies (V): 3.3, 5

Supporting both 3.3 V and 5 V power supplies makes this microcontroller more versatile and compatible with a wider range of components.

No. of Terminals: 52

A higher number of terminals allows for greater connectivity, making it easier to interface with various sensors and actuators.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style contributes to space efficiency and heat dissipation, essential for compact electronic systems.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures reliable operation in a variety of conditions while providing some design flexibility.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller can function in more demanding thermal environments.

CPU Family: 8051

The 8051 CPU family is well-known for its robust performance and wide adoption, providing a wealth of resources and community support.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40 °C makes this microcontroller suitable for extreme environmental conditions.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

The terminal finish ensures excellent solderability and corrosion resistance, enhancing long-term reliability in various applications.

ADC Channels: YES

Presence of ADC channels enables the microcontroller to process analog signals, expanding its application in sensor interfacing.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and minimizes the risk of connection issues during assembly.

ROM Words: 131072

A significant ROM capacity allows for complex programs and functionality, ensuring that the microcontroller can handle demanding tasks.

Maximum Seated Height: 1.7 mm

Low seated height is beneficial for applications requiring compact design and minimal profile in enclosed spaces.

Width: 10 mm

At 10 mm wide, this microcontroller's size is manageable for tight spaces without compromising functionality.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz enables fast processing capabilities, suitable for real-time control and data processing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures compatibility with modern soldering techniques, enhancing manufacturability.

Length: 10 mm

With a length of just 10 mm, this microcontroller is ideal for compact designs where space-saving is critical.

Temperature Grade: INDUSTRIAL

The industrial temperature grade means it can endure demanding conditions, making it suitable for harsh environments.

Peripheral IC Type: MICROCONTROLLER

This classification confirms its core competency in control applications, making it a preferred choice for embedded solutions.

RAM Bytes: 8192

With 8 KB of RAM, it supports complex data manipulation and storage, allowing for more sophisticated application development.

Technology: CMOS

CMOS technology provides low power consumption which is essential for battery-operated and energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminals facilitate stable solder joints, improving reliability during assembly and operation.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many systems, enhancing interoperability with existing hardware.

PWM Channels: YES

PWM channel availability allows for effective control of motors and other devices requiring adjustable power.

ROM Programmability: FLASH

Flash programmability provides ease of updating firmware, allowing for flexibility and adaptability in product development.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is well-suited for high-density layouts and allows for more efficient PCB designs.

Speed: 40 rpm

While a lower speed, it may indicate suitability for certain low-speed control applications, potentially reducing costs.

No. of I/O Lines: 37

With 37 I/O lines, this microcontroller offers extensive connectivity options for interfacing with various peripherals and sensors.

Technical Specifications

Microcontrollers UPSD3333D-40T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3/e4

Length:

10 mm

No. of I/O Lines:

37

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

UPSD3333D-40T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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