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UPSD3312D-40T6

STMicroelectronics

UPSD3312D-40T6 by STMicroelectronics

UPSD3312D-40T6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at temperatures from -40 °C to 85 °C. It features 52 terminals, 2048 bytes RAM, and supports ADC/PWM channels. Ideal for industrial applications requiring reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,683 parts In-Stock

1+ parts

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4,683

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-

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Digiode

USA . 576 parts In-Stock

1+ parts

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576

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Anansix

USA . 468 parts In-Stock

1+ parts

-

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468

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J2 Sourcing AB

Sweden . 407 parts In-Stock

1+ parts

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-

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407

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Prism Electronics

USA . 7 parts In-Stock

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,171 parts In-Stock

1+ parts

$20.440

100+ parts

-

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-

10k+ parts

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1,171

$20.440

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Microchip USA

USA . 386 parts In-Stock

1+ parts

$40.278

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386

$40.278

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IDEA Electronic Components Group

UK . 2,157 parts In-Stock

1+ parts

$53.079

100+ parts

-

1k+ parts

$47.771

10k+ parts

-

2,157

$53.079

-

$47.771

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MKK Technologies

India . 1,563 parts In-Stock

1+ parts

$99.812

100+ parts

-

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1,563

$99.812

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DigiPath Technology Company

USA . 1,563 parts In-Stock

1+ parts

$99.812

100+ parts

-

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1,563

$99.812

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Vigor

Singapore . 7,500 parts In-Stock

1+ parts

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7,500

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-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Corphita

USA . 2,157 parts In-Stock

1+ parts

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2,157

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Parana Technologies

USA . 1,384 parts In-Stock

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$63.464

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1,384

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$63.464

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Perfect Parts

USA . 8 parts In-Stock

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8

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Overview

Elevate your designs with the UPSD3312D-40T6 microcontroller from STMicroelectronics, a leader in innovation. This robust device promises unmatched performance in industrial applications, boasting a 40 MHz clock and versatility for various projects. Its low-profile package ensures seamless integration, while the reliable quality of STMicroelectronics guarantees longevity and efficiency. Experience enhanced functionality, reduced complexity, and significant cost savings with this cutting-edge solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures protection against environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing, making it easier to integrate into modern electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options, ensuring compatibility with a wide range of systems.

Package Shape: SQUARE

Square package shape optimizes board space, which is essential for high-density applications.

Bit Size: 8

The 8-bit architecture is ideal for low-power applications, making the device efficient for simple control tasks.

Power Supplies (V): 3.3, 5

Support for both 3.3V and 5V power supplies enhances versatility, allowing it to be used in various circuit designs.

No. of Terminals: 52

A larger number of terminals increases connectivity options, enabling complex interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack low profile design is advantageous for space-constrained environments where height limitations exist.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures consistent performance in a variety of power scenarios.

Maximum Operating Temperature: 85 °C

Operating at high temperatures makes this microcontroller suitable for industrial applications where heat resistance is required.

CPU Family: 8051

Based on the well-known 8051 family, this microcontroller benefits from a wide array of development tools and community support.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes it suitable for outdoor and harsh environment applications.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

The high-quality terminal finish provides better solderability and reduces corrosion, improving longevity.

ADC Channels: YES

Integrated ADC channels allow for direct processing of analog signals, enhancing functionality for sensor applications.

Terminal Position: QUAD

Quad terminal positioning aids in efficient PCB layout and component placement for optimized performance.

ROM Words: 65536

A sizable ROM allows for ample program storage, beneficial for complex applications requiring more code.

Maximum Seated Height: 1.7 mm

The low seated height is advantageous for compact device design, facilitating thinner products.

Width: 10 mm

A compact width allows for easy integration into tighter spaces within various modules and systems.

Maximum Clock Frequency: 40 MHz

A high clock frequency supports faster operation, making it suitable for performance-intensive applications.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures reliability during manufacturing processes, contributing to robust assembly.

Length: 10 mm

The short length complements the low-profile design, enabling efficient layout in compact systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature ratings guarantee reliability in demanding and variable conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it provides dedicated control for a myriad of electronic functionalities.

RAM Bytes: 2048

With 2048 bytes of RAM, the microcontroller can effectively handle multiple tasks in real-time operations.

Technology: CMOS

CMOS technology ensures low power consumption, enabling longer battery life in portable applications.

Terminal Form: GULL WING

The gull wing terminal form factor enhances the mechanical strength of connections, reducing the risk of failure.

Nominal Supply Voltage: 5 V

Nominal operating at 5 V simplifies design processes as many devices support this standard voltage.

PWM Channels: YES

Pulse Width Modulation channels are useful for motor control and analog signal generation, increasing versatility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to code without the need for physical changes.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for closer placements on circuit boards, optimizing design efficiency.

Speed: 40 rpm

A speed rating of 40 rpm indicates suitability for applications involving motors and mechanical operations.

No. of I/O Lines: 37

37 I/O lines offer extensive interfacing capabilities, supporting diverse peripheral connections in various projects.

Technical Specifications

Microcontrollers UPSD3312D-40T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3/e4

Length:

10 mm

No. of I/O Lines:

37

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

UPSD3312D-40T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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