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UPSD3254A-40U6

STMicroelectronics

UPSD3254A-40U6 by STMicroelectronics

UPSD3254A-40U6 from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 40 MHz. It features 262,144 ROM words and 32,768 RAM bytes, making it ideal for industrial applications requiring robust performance. Its low-profile package ensures efficient space utilization in designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,644 parts In-Stock

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Digiode

USA . 4,702 parts In-Stock

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4,702

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Anansix

USA . 1,396 parts In-Stock

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1,396

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Goldney Electronics S.L.

Spain . 245 parts In-Stock

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245

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Prism Electronics

USA . 14 parts In-Stock

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14

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Cyclops Electronics Ltd

UK . 3 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 813 parts In-Stock

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$11.720

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-

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813

$11.720

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Microchip USA

USA . 262 parts In-Stock

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$19.125

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262

$19.125

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IDEA Electronic Components Group

UK . 1,108 parts In-Stock

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$76.651

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$68.986

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$76.651

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$68.986

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Component Stockers USA

USA . 623 parts In-Stock

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$99.990

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623

$99.990

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MKK Technologies

India . 1,341 parts In-Stock

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$144.137

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$144.137

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DigiPath Technology Company

USA . 1,341 parts In-Stock

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$144.137

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$144.137

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A-Z Elektronik GmbH

Germany . 5,111 parts In-Stock

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Parana Technologies

USA . 1,742 parts In-Stock

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$91.648

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Vigor

Singapore . 1,291 parts In-Stock

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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Perfect Parts

USA . 569 parts In-Stock

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569

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Corphita

USA . 144 parts In-Stock

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144

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Overview

Elevate your projects with the UPSD3254A-40U6 microcontroller from STMicroelectronics, a trusted name in innovation. This high-performance 8-bit MCU, designed for diverse applications ranging from industrial control to consumer electronics, delivers unmatched reliability and efficiency. With its robust features, including ample memory and versatile I/O capabilities, it empowers developers to create smarter solutions that thrive in demanding environments—maximizing value and performance with every use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling higher circuit densities and saving valuable board space.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options while ensuring stable operation.

Package Shape: SQUARE

The square package shape facilitates efficient placement on PCBs, contributing to better thermal and electrical performance.

Bit Size: 8

An 8-bit architecture is efficient for controlling various devices and processing simple to moderate computing tasks.

Power Supplies (V): 5

Operating at a standard voltage of 5 V makes it compatible with a wide range of power supplies and easy to integrate into existing systems.

No. of Terminals: 80

With 80 terminals, this microcontroller can support a substantial number of connections for enhanced functionality and versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack style reduces the height and footprint, making it ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V allows for reliable operation even in low-power scenarios.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in industrial and high-temperature environments.

CPU Family: 8051

The 8051 family is well-established and supported, favoring a broad base of applications and development resources.

Minimum Operating Temperature: -40 °C

The ability to function in temperatures as low as -40 °C enhances durability in extreme conditions.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

The gold finish ensures better conductivity and resistance to oxidation, resulting in enhanced reliability.

ADC Channels: YES

Integrated ADC channels facilitate signal processing for a range of analog inputs, increasing the versatility of applications.

Terminal Position: QUAD

The quad terminal position allows for effective space utilization and simplifies PCB layout.

ROM Words: 262144

With 262144 ROM words, the microcontroller offers substantial memory for application storage and program execution.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm aids in maintaining a low-profile design for compact applications.

Width: 12 mm

A width of 12 mm contributes to efficient use of space on PCBs, allowing for more compact designs.

Maximum Clock Frequency: 40 MHz

The high clock frequency of 40 MHz allows for rapid processing speeds, enabling quick reactions and more complex computations.

Length: 12 mm

A length of 12 mm ensures compatibility with standard PCB layouts while maintaining a compact footprint.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller is robust enough to perform reliably in tough environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it combines processing, control, and I/O functions, making it ideal for embedded systems.

RAM Bytes: 32768

With 32768 bytes of RAM, there is ample space for variable storage, enhancing the capability to handle complex tasks.

Technology: CMOS

CMOS technology ensures low power consumption, which is ideal for battery-operated devices and efficient designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections to the PCB.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V simplifies design requirements, making it easier to integrate into existing systems.

PWM Channels: YES

Inclusion of PWM channels enables the microcontroller to control motors and other devices effectively, enhancing its utility.

ROM Programmability: FLASH

The ability to program ROM using FLASH technology allows for easy updates and versatility in application development.

Terminal Pitch: 0.5 mm

A tight terminal pitch of 0.5 mm supports high-density designs and ensures effective space utilization.

Speed: 40 RPM

This speed specification may indicate peripheral control capabilities, enhancing the product's functionality in motor control applications.

No. of I/O Lines: 45

With 45 I/O lines, this microcontroller provides extensive interfacing options for connecting various peripherals and sensors.

Technical Specifications

Microcontrollers UPSD3254A-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3/e4

Length:

12 mm

No. of I/O Lines:

45

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

UPSD3254A-40U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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