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UPSD3234A-40U6

STMicroelectronics

UPSD3234A-40U6 by STMicroelectronics

UPSD3234A-40U6 from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates in industrial temperatures (-40 °C to 85°C). It features 80 terminals, supports I2C and USB connectivity, and includes ADC channels for versatile applications. Ideal for low-power designs, it offers extensive peripherals like PWM and timers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,486 parts In-Stock

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7,486

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Chip Stock

USA . 3,800 parts In-Stock

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3,800

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Digiode

USA . 3,541 parts In-Stock

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3,541

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Anansix

USA . 2,389 parts In-Stock

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2,389

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Prism Electronics

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,959 parts In-Stock

1+ parts

$17.014

100+ parts

-

1k+ parts

$15.312

10k+ parts

-

1,959

$17.014

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$15.312

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AZTECH Wire

Italy . 1,181 parts In-Stock

1+ parts

$17.540

100+ parts

-

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1,181

$17.540

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MKK Technologies

India . 115 parts In-Stock

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$31.993

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115

$31.993

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DigiPath Technology Company

USA . 115 parts In-Stock

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$31.993

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115

$31.993

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Microchip USA

USA . 127 parts In-Stock

1+ parts

$60.588

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127

$60.588

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A-Z Elektronik GmbH

Germany . 6,246 parts In-Stock

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6,246

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Corphita

USA . 4,425 parts In-Stock

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4,425

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Kepictronics

USA . 3,050 parts In-Stock

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3,050

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Vigor

Singapore . 1,637 parts In-Stock

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1,637

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Parana Technologies

USA . 1,431 parts In-Stock

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$20.342

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1,431

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$20.342

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Perfect Parts

USA . 1,064 parts In-Stock

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1,064

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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Overview

Elevate your projects with the UPSD3234A-40U6 from STMicroelectronics, a versatile microcontroller renowned for its exceptional quality and reliability. Designed for diverse applications, it ensures high performance in demanding environments while maintaining low power consumption. With robust connectivity options and efficient processing capabilities, it empowers developers to create innovative solutions that stand out. Trust in STMicroelectronics' legacy of excellence and unlock new possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides good protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for reduced circuit board space and improved performance, particularly in compact designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V ensures compatibility with a wide range of power supplies typically used in electronic devices.

Address Bus Width: 12

A 12-bit address bus width facilitates access to a larger memory space, enhancing the capability of the microcontroller.

Package Shape: SQUARE

The square package shape aids in efficient layout and design, promoting better thermal performance and electrical characteristics.

Bit Size: 8

An 8-bit architecture allows for easier handling of data in applications that do not require extensive numerical precision.

No. of Terminals: 80

With 80 terminals, this microcontroller supports a broad range of peripheral connections, offering high expandability.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style saves space and allows for easy integration into compact electronic devices.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5V enables operation in a variety of low-power applications, increasing efficiency.

Maximum Operating Temperature: 85 °C

Rated for a maximum operating temperature of 85 °C, this microcontroller is ideal for industrial applications that demand reliability.

CPU Family: 8051

The popular 8051 CPU family ensures broad support and extensive resources for development, making it a reliable choice.

No. of External Interrupts: 2

Having 2 external interrupts allows for responsive system designs, particularly in event-driven applications.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold conditions (-40 °C) enhances the microcontroller's applicability in harsh environments.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

This terminal finish provides excellent corrosion resistance and ensures reliable electrical connectivity.

ADC Channels: YES

Built-in ADC channels enable easy interfacing with analog sensors, enhancing the versatility of the microcontroller.

Terminal Position: QUAD

Quad terminal positioning optimizes space and enhances solder joint reliability for surface mount applications.

ROM Words: 262144

With 262,144 ROM words, ample memory is available for program storage, allowing for complex applications.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm makes it a suitable choice for low-profile designs and applications.

RAM Words: 4096

4,096 words of RAM provides sufficient temporary storage for efficient data handling in applications.

Width: 12 mm

A compact width of 12 mm ensures it can fit into tight spaces on circuit boards, making it easier to design compact products.

Boundary Scan: YES

Boundary scan support facilitates easier debugging and manufacturing testing, improving the overall reliability of the device.

External Data Bus Width: 8

An 8-bit external data bus width is efficient for many applications that don’t need higher data throughput.

Peripherals: POR; PWM(5); TIMER(3); WDT

Multiple integrated peripherals like PWM channels and timers enhance functionality and reduce component count in designs.

Length: 12 mm

A length of 12 mm complements its width, maintaining its compactness for board space optimization.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in demanding environments, such as manufacturing and outdoor settings.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing and control capabilities, making it efficient for embedded systems.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance, which are critical for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy mounting and provide excellent soldering characteristics in production.

Analog To Digital Convertors: 4-Ch 8-Bit

The availability of 4 analog-to-digital converters allows for direct interfacing with a variety of sensors.

Maximum Supply Current: 62 mA

A maximum supply current of 62 mA allows it to operate efficiently without excessive power draw.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V is standard, making it compatible with many common electronic systems.

PWM Channels: YES

Support for PWM channels allows for precise control in applications like motor control and signal modulation.

Connectivity: I2C; UART(2); USB

Multiple connectivity options such as I2C and USB provide flexibility for communication with other devices, enhancing capability.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming, making it suitable for applications that require firmware updates.

Terminal Pitch: 0.5 mm

0.5 mm terminal pitch is ideal for modern compact circuit boards, supporting high-density designs.

Format: FIXED POINT

Using a fixed-point format simplifies calculations and data processing, making it a good fit for many control applications.

Speed: 40 rpm

A speed rating of 40 rpm indicates suitability for applications where low-speed control is required.

Low Power Mode: YES

The low power mode reduces energy consumption, increasing battery life in portable applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides compatibility with common 8-bit programming paradigms and tools.

No. of I/O Lines: 46

46 I/O lines provide extensive interfacing capabilities for various peripherals, sensors, and outputs.

Technical Specifications

Microcontrollers UPSD3234A-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 2ND FLASH MEMORY: 32K BYTES

Address Bus Width:

12

Bit Size:

8

Boundary Scan:

YES

CPU Family:

8051

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3/e4

Length:

12 mm

Low Power Mode:

YES

No. of External Interrupts:

2

No. of I/O Lines:

46

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Words:

4096

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Current:

62 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C; UART(2); USB

Peripherals:

POR; PWM(5); TIMER(3); WDT

Analog To Digital Convertors:

4-Ch 8-Bit

Trade Compliance

UPSD3234A-40U6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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