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UPSD3233B-40U6

STMicroelectronics

UPSD3233B-40U6 by STMicroelectronics

UPSD3233B-40U6 from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V, featuring 131072 ROM words and 4096 RAM words. It operates in industrial temperatures (-40 °C to 85°C) and supports I2C/UART connectivity. Ideal for low-power applications, it includes ADC channels and multiple timers.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 4,560 parts In-Stock

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Digiode

USA . 1,752 parts In-Stock

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Anansix

USA . 1,359 parts In-Stock

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Tectiva GmbH

Germany . 550 parts In-Stock

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550

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First Choice Components Inc.

USA . 151 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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AZTECH Wire

Italy . 733 parts In-Stock

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$8.950

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733

$8.950

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IDEA Electronic Components Group

UK . 325 parts In-Stock

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$40.336

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$36.303

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325

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MKK Technologies

India . 1,805 parts In-Stock

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$75.850

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$75.850

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DigiPath Technology Company

USA . 1,805 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,738 parts In-Stock

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Microchip USA

USA . 5,672 parts In-Stock

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Authorized Procurement Solutions

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Vigor

Singapore . 2,389 parts In-Stock

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Parana Technologies

USA . 1,754 parts In-Stock

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Corphita

USA . 1,573 parts In-Stock

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Perfect Parts

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Metaverse IC Inc.

Canada . 209 parts In-Stock

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Kepictronics

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Overview

Unlock unparalleled performance with the UPSD3233B-40U6 microcontroller from STMicroelectronics! Renowned for its robust quality and innovative design, this versatile chip excels in industrial applications where reliability is key. With features like low power consumption and a compact footprint, it delivers exceptional value for diverse projects—from automation to IoT solutions. Choose STMicroelectronics for unrivaled expertise and elevate your designs with cutting-edge technology that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures robustness and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V makes it suitable for a wide range of applications without risk of damage.

Address Bus Width: 12

A 12-bit address bus allows for addressing a larger memory space, enhancing the capabilities of the microcontroller.

Package Shape: SQUARE

The square package shape enables efficient space utilization on circuit boards.

Bit Size: 8

An 8-bit architecture is effective for handling standard applications while optimizing performance and resource usage.

No. of Terminals: 80

With 80 terminals, it provides ample connectivity options for various peripherals and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile design contributes to a slim form factor suitable for compact electronic designs.

Minimum Supply Voltage: 4.5 V

The capability to operate at a minimum supply voltage of 4.5V makes it compatible with various power supply systems.

Maximum Operating Temperature: 85 °C

Operating at high temperatures (up to 85 °C) ensures reliability in demanding industrial environments.

CPU Family: 8051

The well-established 8051 CPU family provides a wealth of resources and community support for developers.

No. of External Interrupts: 2

Two external interrupts enable timely response to critical events, enhancing the microcontroller's responsiveness.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme low temperatures (-40 °C) makes it suitable for harsh environments.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

The terminal finish ensures excellent corrosion resistance and minimizes signal integrity issues.

ADC Channels: YES

The inclusion of ADC channels adds versatility, allowing the microcontroller to interface with analog sensors.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout, ensuring better electrical performance and easier routing.

ROM Words: 131072

With 131072 ROM words, it provides substantial program storage for complex applications.

Maximum Seated Height: 1.6 mm

A low seated height is advantageous for designs that require low-profile components.

RAM Words: 4096

4096 RAM words allow for adequate temporary storage during processing, improving performance in multitasking.

Width: 12 mm

A compact width of 12 mm makes it ideal for space-constrained applications.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging, enhancing reliability during prototyping.

External Data Bus Width: 8

An 8-bit external data bus is effective for standard data processing tasks, optimizing performance and resource use.

Peripherals: POR; PWM(5); TIMER(3); WDT

Multiple integrated peripherals enhance the functionality of the microcontroller, allowing for diverse applications.

Length: 12 mm

With a length of 12 mm, it maintains compactness, making it suitable for small electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and longevity in harsh operating environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller type, it combines processing, memory, and I/O capabilities in a single package for efficiency.

Technology: CMOS

CMOS technology offers low power consumption, making this microcontroller energy efficient.

Terminal Form: GULL WING

Gull wing terminals facilitate better soldering and mounting reliability on circuit boards.

Analog To Digital Converters: 4-Ch 8-Bit

Having 4-channels of 8-bit ADC enhances flexibility in reading multiple analog signals simultaneously.

Maximum Supply Current: 62 mA

A maximum supply current of 62 mA ensures adequate power for operations without overconsumption.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V aligns with standard digital systems and facilitates easier integration.

PWM Channels: YES

The presence of PWM channels allows for precise control of motors and other devices, expanding application possibilities.

Connectivity: I2C; UART(2)

Multiple connectivity options ensure easy communication with a variety of external devices and components.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the firmware, improving product longevity.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density applications, saving valuable PCB real estate.

Format: FIXED POINT

The use of fixed-point format is beneficial for applications requiring precise arithmetic without floating-point overhead.

Speed: 40 rpm

Operating at speeds up to 40 rpm ensures responsiveness and operational efficiency for relevant tasks.

Low Power Mode: YES

The low power mode enhances battery life in portable applications, making it energy-efficient.

On Chip Program ROM Width: 8

The 8-bit ROM width is a standard that facilitates compatibility with a wide range of software applications.

No. of I/O Lines: 46

Having 46 I/O lines provides flexibility for interfacing with various sensors and devices, making it versatile for different applications.

Technical Specifications

Microcontrollers UPSD3233B-40U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 2ND FLASH MEMORY: 32K BYTES

Address Bus Width:

12

Bit Size:

8

Boundary Scan:

YES

CPU Family:

8051

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3/e4

Length:

12 mm

Low Power Mode:

YES

No. of External Interrupts:

2

No. of I/O Lines:

46

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Words:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Current:

62 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C; UART(2)

Peripherals:

POR; PWM(5); TIMER(3); WDT

Analog To Digital Convertors:

4-Ch 8-Bit

Trade Compliance

UPSD3233B-40U6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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