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UPSD3212CV-24T6

STMicroelectronics

UPSD3212CV-24T6 by STMicroelectronics

UPSD3212CV-24T6 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 24 MHz. It features 52 terminals, supports ADC and PWM channels, making it ideal for industrial applications requiring reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,341 parts In-Stock

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5,341

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Digiode

USA . 3,985 parts In-Stock

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3,985

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Anansix

USA . 2,068 parts In-Stock

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2,068

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Distributors (Availability)

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AZTECH Wire

Italy . 655 parts In-Stock

1+ parts

$9.230

100+ parts

-

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655

$9.230

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Microchip USA

USA . 170 parts In-Stock

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$10.754

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170

$10.754

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IDEA Electronic Components Group

UK . 943 parts In-Stock

1+ parts

$75.802

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$68.221

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943

$75.802

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$68.221

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MKK Technologies

India . 138 parts In-Stock

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$142.540

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138

$142.540

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DigiPath Technology Company

USA . 138 parts In-Stock

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$142.540

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138

$142.540

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Vigor

Singapore . 1,466 parts In-Stock

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1,466

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Corphita

USA . 1,319 parts In-Stock

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1,319

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Parana Technologies

USA . 253 parts In-Stock

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$90.632

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253

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$90.632

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Overview

Unlock the potential of your designs with the UPSD3212CV-24T6 microcontroller from STMicroelectronics, a leader in innovation and reliability. This versatile, low-profile chip offers exceptional performance for industrial applications, boasting robust power efficiency and a wide operating temperature range. With unparalleled support and quality assurance from STMicroelectronics, elevate your projects while enjoying seamless integration and enhanced functionality. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient space utilization on circuit boards, making this microcontroller ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

This microcontroller operates effectively at a maximum supply voltage of 3.6 V, providing compatibility with various power supply configurations.

Address Bus Width: 12

A 12-bit address bus enables the access of a larger memory space, enhancing the microcontroller's capability to handle complex tasks.

Package Shape: SQUARE

The square package shape improves the layout flexibility on PCBs, facilitating better design integration.

Bit Size: 8

An 8-bit architecture allows for simple processing and control tasks while maintaining efficient performance for many embedded applications.

Power Supplies (V): 3.3

Operating at a nominal supply voltage of 3.3 V enhances energy efficiency, contributing to longer battery life in portable devices.

No. of Terminals: 52

With 52 terminals, this microcontroller provides ample connections for interfacing with various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design is well-suited for applications requiring low-height profiles, making it versatile for multiple form factors.

Minimum Supply Voltage: 3 V

The ability to operate at a minimum supply voltage of 3 V provides flexibility in power supply requirements, accommodating a wide range of designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in moderately high-temperature environments, suitable for industrial applications.

CPU Family: 8051

Being part of the 8051 family means access to extensive development resources, libraries, and a large community for support.

Minimum Operating Temperature: -40 °C

Withstanding temperatures as low as -40 °C makes this microcontroller ideal for harsh environments and extreme conditions.

Terminal Finish: MATTE TIN/NICKEL PALLADIUM GOLD

The terminal finish ensures excellent solderability and corrosion resistance, contributing to the longevity and reliability of the device.

ADC Channels: YES

Integrated ADC channels enable direct interaction with analog signals, making it suitable for projects that require data acquisition.

Terminal Position: QUAD

Quad terminal positioning allows for efficient use of PCB space and enhances connectivity options for peripheral devices.

ROM Words: 65536

A ROM capacity of 65536 words provides sufficient storage for firmware and application code, allowing for complex functionalities.

Maximum Seated Height: 1.6 mm

The low seated height is beneficial for applications where space is at a premium, contributing to slimmer designs.

Width: 10 mm

A compact width of 10 mm makes this microcontroller feasible for miniaturized designs, enhancing its versatility.

External Data Bus Width: 8

An 8-bit external data bus width supports efficient data handling and easy interfacing with other components.

Maximum Clock Frequency: 24 MHz

Operating at a maximum clock frequency of 24 MHz provides a good balance between performance and power consumption for a range of applications.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with modern soldering processes, facilitating reliable manufacturing.

Length: 10 mm

The compact length of 10 mm is conducive for designs that require small footprints, enhancing product integration.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, this microcontroller is reliable in demanding environments, suitable for commercial and industrial use.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is designed to handle both processing and control tasks, making it perfect for embedded applications.

RAM Bytes: 2048

With 2048 bytes of RAM, there is sufficient memory for data manipulation tasks, enhancing the microcontroller's performance.

Technology: CMOS

CMOS technology offers low power consumption, which is essential for battery-powered or energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals simplify PCB mounting and soldering processes, increasing manufacturing efficiency.

Maximum Supply Current: 20 mA

A maximum supply current of 20 mA allows for efficient operation within low-power applications, aiding in energy conservation.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V helps to standardize the design and improve compatibility with various components.

PWM Channels: YES

Integrated PWM channels allow for generating precise signal control which is essential for motor control and dimming applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming, ensuring flexibility in software development.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is standard for high-density mounting, allowing for a compact design without compromising on connectivity.

Speed: 24 rpm

A speed of 24 rpm indicates efficiency in specific applications, particularly in controlling rotational devices.

No. of I/O Lines: 37

Having 37 I/O lines provides significant interfacing options, accommodating various sensor and actuator connections.

Technical Specifications

Microcontrollers UPSD3212CV-24T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

12

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3/e4

Length:

10 mm

No. of I/O Lines:

37

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP52,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

UPSD3212CV-24T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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